OMAPL138BZCEA3E

The OMAPL138BZCEA3E is an industrial-grade embedded microprocessor IC from the OMAP-L13x family by Texas Instruments, featuring an ARM926EJ-S 32-bit core running at 375 MHz. It combines a high-performance ARM application processor with a C674x-series DSP co-processor and extensive on-chip peripherals to address industrial and embedded applications that require real-time processing, secure boot, and robust I/O integration.

Designed for surface-mount deployment in a 361-NFBGA (13×13) package, this device targets embedded systems and industrial markets where integration, connectivity and extended temperature operation (−40 °C to 105 °C) are critical.

Key Features

• Core & DSP ARM926EJ-S 32-bit RISC processor at 375 MHz with a C674x signal-processing DSP co-processor for mixed control and signal-processing tasks.
• Memory & Controllers SDRAM controller support plus external memory interfaces (EMIFA) and DDR2/Mobile DDR memory controller options for flexible memory configurations and efficient data handling.
• Connectivity & Storage Integrated 10/100 Mbps Ethernet, SATA 3 Gbps interface, and both USB 1.1 and USB 2.0 with PHYs to enable networked, host and device connectivity and local storage solutions.
• Display & Host Interfaces On-chip LCD display controller and Host Port Interface (HPI) support for user interfaces and host communication paths.
• Security Boot security and cryptography features to support secure system start-up and data protection needs in embedded deployments.
• Industrial Grade & Packaging Rated for −40 °C to 105 °C operation and supplied in a 361-LFBGA / 361-NFBGA (13×13) surface-mount package suitable for industrial hardware designs.

Typical Applications

• Industrial Control & Instrumentation — Real-time processing and wide temperature range support control, monitoring and automation systems in industrial environments.
• Networking & Communications — Integrated 10/100 Ethernet plus multiple USB interfaces enable network gateways, protocol converters and communication appliances.
• Storage & Data Logging — SATA 3 Gbps and USB host/device support make the device suitable for local storage, data acquisition and logging applications.
• Human-Machine Interfaces (HMI) — On-chip LCD controller and ARM processing capability support embedded HMI designs with responsive user interfaces.

Unique Advantages

• Highly integrated I/O: Ethernet, SATA, USB 1.1 and USB 2.0 with PHYs reduce external component count and simplify board-level design.
• Dual-processing model: ARM926EJ-S application core paired with a C674x DSP co-processor enables separation of control and intensive signal-processing workloads.
• Industrial temperature capability: −40 °C to 105 °C rating supports reliable operation across harsh environmental conditions.
• Secure boot and cryptography: On-chip security features protect system integrity and sensitive data from power-up onward.
• Compact BGA package: 361-NFBGA (13×13) surface-mount package enables high-density PCB layouts while supporting industrial assembly processes.

Why Choose OMAPL138BZCEA3E?

The OMAPL138BZCEA3E balances application processing and dedicated DSP capabilities in a single industrial-grade device, providing a compact, connected and secure platform for embedded designs. Its integrated peripherals—Ethernet, SATA, USB, LCD and flexible memory interfaces—help reduce BOM complexity and accelerate development of networked, storage and HMI-enabled systems.

This part is well suited to engineering teams developing robust embedded hardware for industrial and communication applications that require real-time signal processing, secure boot, and long-term reliability backed by the OMAP-L13x family architecture.

Request a quote or submit your requirements today to evaluate the OMAPL138BZCEA3E for your next embedded design project.