OMAPL138BZWTA3E

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16)

Quantity 520 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed375MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BZWTA3E – IC MPU OMAP-L1X 375MHz 361-NFBGA

The OMAPL138BZWTA3E is an industrial-grade embedded microprocessor from the OMAP-L13x series that combines an ARM926EJ-S RISC MPU core running at 375 MHz with a C674x-class signal-processing DSP. Designed for embedded systems, this device integrates high-speed interfaces and memory controllers to support networking, storage, and real-time signal-processing tasks in industrial and communications applications.

With on-chip security features, a broad operating temperature range, and a compact 361-NFBGA (16×16) surface-mount package, the OMAPL138BZWTA3E delivers a balanced platform for designs that require both general-purpose processing and deterministic DSP acceleration.

Key Features

  • Processor Cores  ARM926EJ-S 32-bit MPU core at 375 MHz coupled with a C674x-class DSP co-processor for dedicated signal-processing workloads.
  • Memory Architecture  On-chip memory and cache architecture derived from the OMAP-L138 family, including multiple levels of RAM/cache and external SDRAM support; flexible memory partitioning supports embedded software and DSP code/data needs.
  • External Memory Interfaces  Support for SDRAM and DDR2/Mobile DDR memory controllers for system memory expansion and high-bandwidth data buffering.
  • High-Speed Interfaces  Integrated 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 and USB 2.0 ports with PHYs, and an LCD display controller for connectivity and I/O-rich embedded systems.
  • DMA and Peripherals  Enhanced EDMA3 controller with multiple channels and transfer controllers to offload data movement and improve real-time throughput.
  • Security and Boot  Built-in boot security and cryptography features to support secure system boot and protected data handling.
  • Package and Thermal  361-pin NFBGA (16×16 mm) surface-mount package rated for industrial operation from −40 °C to 105 °C.

Typical Applications

  • Industrial Control  Real-time control and signal-processing tasks in industrial automation where deterministic DSP acceleration and an ARM host processor are required.
  • Communications Equipment  Networking and protocol handling using integrated Ethernet and USB interfaces alongside DSP-based packet processing or codec functions.
  • Storage and Embedded NAS  Compact storage appliances and embedded NAS designs benefiting from on-chip SATA 3 Gbps and Ethernet connectivity.
  • Multimedia and Signal Processing  Voice, audio, and other DSP-centric workloads that leverage the C674x signal-processing core with the ARM MPU coordinating system-level tasks.

Unique Advantages

  • Integrated MPU + DSP Architecture: Combines an ARM926EJ-S application processor with a C674x-class DSP to consolidate control and compute-intensive signal processing on a single device, reducing BOM and inter-chip latency.
  • Rich I/O Set: On-chip Ethernet, SATA, USB (1.1 and 2.0 with PHYs), LCD controller and HPI interfaces enable a wide range of system designs without extensive external glue logic.
  • Industrial Temperature Rating: Specified for −40 °C to 105 °C operation to meet the environmental demands of industrial and ruggedized deployments.
  • Security-Ready: Boot security and cryptographic capabilities facilitate secure system startup and data protection strategies.
  • Compact Surface-Mount Package: 361-pin NFBGA (16×16 mm) package provides a high pin-count solution in a compact footprint suitable for space-constrained embedded boards.

Why Choose OMAPL138BZWTA3E?

The OMAPL138BZWTA3E positions itself as a versatile embedded SoC that pairs a 375 MHz ARM926EJ-S application core with a C674x-class DSP co-processor, enabling mixed workloads that require both general-purpose control and high-performance signal processing. Its integrated peripherals—Ethernet, SATA, USB, LCD, and robust memory interfaces—support complex connectivity and storage-focused designs while minimizing external components.

Engineers targeting industrial, communications, or multimedia embedded systems will find the OMAPL138BZWTA3E well suited to designs that demand processing flexibility, secure boot capability, and reliable operation across a wide temperature range, backed by the OMAP-L138 family architecture and memory subsystem features.

Request a quote or submit a purchase inquiry to check availability and pricing for the OMAPL138BZWTA3E. Our team can provide lead-time information and assist with packaging or volume requirements.

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