OMAPL138BZWTD4E

IC MPU OMAP-L1X 456MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16)

Quantity 395 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed456MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138BZWTD4E – ARM926EJ-S 456 MHz MPU in 361-NFBGA

The OMAPL138BZWTD4E is an embedded microprocessor built around an ARM926EJ-S 32-bit core running at 456 MHz and includes a TMS320C674x DSP coprocessor for signal-processing workloads. This combination delivers a balanced platform for designs that require control processing alongside high-performance DSP capabilities, with integrated memory controllers and a broad set of peripheral interfaces for embedded and industrial applications.

Designed for industrial-grade operation, the device integrates storage and connectivity interfaces, security features, and a compact 361-ball NFBGA package to support space-constrained systems that need both real-time signal processing and application control.

Key Features

  • Core and DSP  ARM926EJ-S 32-bit core at 456 MHz with a TMS320C674x DSP coprocessor for mixed control and signal-processing tasks.
  • Memory Architecture  Multiple on-chip memories and caches: ARM-side instruction and data caches and ROM; DSP-side 32KB L1P/L1D and 256KB L2 unified RAM/cache plus 128KB shared RAM, enabling flexible partitioning and low-latency data paths.
  • DMA and Peripheral Offload  Enhanced EDMA3 controller with 64 independent channels, 3 transfer controllers and programmable bursts to accelerate data movement and reduce CPU/DSP load.
  • Interfaces and Connectivity  Integrated 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 and USB 2.0 with PHYs, LCD display controller and HPI interface for broad I/O connectivity.
  • External Memory Support  Two external memory interfaces (EMIFA and DDR2/Mobile DDR controllers) and SDRAM controller support, enabling NOR/NAND and DDR2 memory configurations.
  • Security and Boot  Boot security and cryptography features to support secure system startup and protected operations.
  • Software Ecosystem  Device is supported by TI software resources including DSP/BIOS, Chip Support Library and DSP libraries to accelerate development.
  • Package and Temperature  361-ball NFBGA (16 × 16 mm) surface-mount package rated for industrial temperature operation from −40 °C to 90 °C.
  • Standards and Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • Industrial Control  Use the ARM core for control and system management while the C674x DSP processes sensor data, filtering and analytics in industrial automation systems.
  • Communications and Networking  Integrated Ethernet, USB and DMA support enable embedded networking equipment and protocol offload functions.
  • Storage and Media Subsystems  SATA 3 Gbps together with USB and DMA capabilities make the device suitable for embedded storage controllers and media appliances.
  • Human-Machine Interfaces  LCD controller and rich I/O support enable responsive operator interfaces and display-driven embedded systems.

Unique Advantages

  • Combined Control and DSP Processing: ARM926EJ-S core plus C674x DSP coprocessor provide both control-plane responsiveness and high-performance signal processing without separate chips.
  • Flexible Memory and Cache Configuration: Multiple levels of cache and configurable L1/L2 partitioning improve real-time performance and let designers tune memory for application needs.
  • Comprehensive Peripheral Set: On-chip Ethernet, SATA, USB 1.1/2.0 with PHYs and display/HPI interfaces reduce external components and simplify board-level design.
  • High-Bandwidth Data Movement: EDMA3 controller with up to 64 channels and programmable bursts minimizes CPU/DSP overhead for large-data transfers.
  • Industrial Readiness: Rated for −40 °C to 90 °C operation and supplied in a compact 361-NFBGA package suitable for space-constrained, rugged systems.
  • Development Support: TI-provided software libraries and DSP/BIOS support accelerate bring-up and algorithm deployment.

Why Choose OMAPL138BZWTD4E?

The OMAPL138BZWTD4E positions itself as a tightly integrated MPU + DSP solution for embedded systems that require both deterministic control and substantial signal-processing capability. Its combination of a 456 MHz ARM926EJ-S core, C674x DSP coprocessor, extensive on-chip memory resources, and a rich set of peripherals delivers a balanced platform for industrial, communications, and storage-focused designs.

With industrial temperature rating, RoHS compliance, and software ecosystem support, this device is suited to designers seeking long-term robustness and reduced BOM complexity through integrated interfaces and DMA offload capabilities.

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