OMAPL138CZWTD4RW

IC MPU OMAP-L1X 456MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16)

Quantity 1,450 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed456MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138CZWTD4RW – IC MPU OMAP-L1X 456MHZ 361NFBGA

The OMAPL138CZWTD4RW is a highly integrated embedded processor from Texas Instruments' OMAP-L13x series combining an ARM926EJ-S MPU core running at 456 MHz with a C674x DSP co-processor. Designed for industrial-grade applications, the device integrates a broad set of on-chip peripherals and controllers to support connectivity, storage, display, and signal-processing tasks.

This device targets embedded systems that require deterministic processing, real-time signal processing acceleration, and a compact, surface-mount BGA package for space-constrained designs.

Key Features

  • Core Architecture  ARM926EJ-S RISC MPU at 456 MHz with an integrated C674x signal-processing DSP co-processor for mixed-control and DSP workloads.
  • Memory and DMA  SDRAM memory controller support and an enhanced EDMA3 controller architecture for flexible memory/cache partitioning and high-bandwidth data transfers.
  • Multimedia and Display  Integrated LCD controller and Video Port Interface (VPIF) to support display and video I/O requirements.
  • Connectivity and Storage  Single 10/100 Mbps Ethernet MAC, single SATA 3 Gbps controller, USB 1.1 and USB 2.0 PHYs provide comprehensive wired connectivity and on-board storage interface options.
  • Peripheral Interfaces  Multiple serial interfaces including UARTs, MMC/SD controllers, McASP and McBSP audio serial ports, and an HPI for parallel host interaction.
  • Security  Boot security and cryptography features to help protect boot integrity and enable secure system operation.
  • Package and Mounting  361-ball NFBGA (16 × 16) surface-mount package suitable for compact, high-density board designs.
  • Industrial Grade  Rated for an operating temperature range of −40 °C to 90 °C and RoHS compliant for industrial deployments.
  • Real-Time and DMA Resources  Enhanced DMA with multiple channels and programmable transfer features to support real-time data movement for time-sensitive applications.

Typical Applications

  • Industrial Control and Automation  Use the ARM core with DSP acceleration and robust I/O (Ethernet, SATA, USB) for machine control, data logging, and deterministic field systems.
  • Multimedia and Imaging Systems  Combine the C674x DSP and VPIF/LCD controller to implement video capture, processing, and display pipelines in embedded imaging products.
  • Networking and Storage Appliances  Leverage the integrated 10/100 Ethernet MAC and SATA 3 Gbps controller to build compact networked storage or gateway devices.
  • Human-Machine Interfaces (HMI)  Employ the LCD controller and UART/MMC/USB interfaces to drive local operator displays and peripheral I/O for embedded HMI designs.

Unique Advantages

  • Highly Integrated Dual-Core SoC: ARM926EJ-S plus C674x DSP on a single die reduces BOM and simplifies board design for mixed-control and DSP tasks.
  • Broad On-Chip Connectivity: Ethernet, SATA, USB 1.1/2.0 with PHYs, and multiple serial interfaces provide a wide range of I/O without external controllers.
  • Real-Time Data Movement: Enhanced EDMA3 controller and multiple DMA channels enable efficient, low-latency transfers for time-critical applications.
  • Industrial Temperature and Package Density: −40 °C to 90 °C rating and a 361-ball NFBGA (16×16) surface-mount package support rugged, space-constrained deployments.
  • Security-Ready: Integrated boot security and cryptography features help protect device integrity from the earliest stages of system boot.
  • Flexibility for Memory and Cache: Support for flexible L1/L2 cache and SDRAM controller options allows tuning for performance or memory-mapped use cases.

Why Choose OMAPL138CZWTD4RW?

The OMAPL138CZWTD4RW positions itself as a versatile embedded processor that blends an ARM926EJ-S application processor with a C674x DSP, providing a balanced platform for control, signal processing, and I/O-heavy applications. Its integrated connectivity, storage, display subsystems, and security features reduce the need for external components and streamline system design.

This industrial-grade device is suitable for developers and OEMs building compact, reliable embedded products that require deterministic processing, DSP acceleration, and broad peripheral support, all packaged in a high-density surface-mount BGA.

Request a quote or submit an inquiry to begin sourcing OMAPL138CZWTD4RW for your next embedded design project and evaluate how its integrated features can reduce BOM and accelerate time to market.

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