OMAPL138CZWTD4RW
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16) |
|---|---|
| Quantity | 1,450 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 361-NFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 90°C (TJ) | Package / Case | 361-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (1) | Security Features | Boot Security, Cryptography | Speed | 456MHz | ||
| Supplier Device Package | 361-NFBGA (16×16) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL138CZWTD4RW – IC MPU OMAP-L1X 456MHZ 361NFBGA
The OMAPL138CZWTD4RW is a highly integrated embedded processor from Texas Instruments' OMAP-L13x series combining an ARM926EJ-S MPU core running at 456 MHz with a C674x DSP co-processor. Designed for industrial-grade applications, the device integrates a broad set of on-chip peripherals and controllers to support connectivity, storage, display, and signal-processing tasks.
This device targets embedded systems that require deterministic processing, real-time signal processing acceleration, and a compact, surface-mount BGA package for space-constrained designs.
Key Features
- Core Architecture ARM926EJ-S RISC MPU at 456 MHz with an integrated C674x signal-processing DSP co-processor for mixed-control and DSP workloads.
- Memory and DMA SDRAM memory controller support and an enhanced EDMA3 controller architecture for flexible memory/cache partitioning and high-bandwidth data transfers.
- Multimedia and Display Integrated LCD controller and Video Port Interface (VPIF) to support display and video I/O requirements.
- Connectivity and Storage Single 10/100 Mbps Ethernet MAC, single SATA 3 Gbps controller, USB 1.1 and USB 2.0 PHYs provide comprehensive wired connectivity and on-board storage interface options.
- Peripheral Interfaces Multiple serial interfaces including UARTs, MMC/SD controllers, McASP and McBSP audio serial ports, and an HPI for parallel host interaction.
- Security Boot security and cryptography features to help protect boot integrity and enable secure system operation.
- Package and Mounting 361-ball NFBGA (16 × 16) surface-mount package suitable for compact, high-density board designs.
- Industrial Grade Rated for an operating temperature range of −40 °C to 90 °C and RoHS compliant for industrial deployments.
- Real-Time and DMA Resources Enhanced DMA with multiple channels and programmable transfer features to support real-time data movement for time-sensitive applications.
Typical Applications
- Industrial Control and Automation Use the ARM core with DSP acceleration and robust I/O (Ethernet, SATA, USB) for machine control, data logging, and deterministic field systems.
- Multimedia and Imaging Systems Combine the C674x DSP and VPIF/LCD controller to implement video capture, processing, and display pipelines in embedded imaging products.
- Networking and Storage Appliances Leverage the integrated 10/100 Ethernet MAC and SATA 3 Gbps controller to build compact networked storage or gateway devices.
- Human-Machine Interfaces (HMI) Employ the LCD controller and UART/MMC/USB interfaces to drive local operator displays and peripheral I/O for embedded HMI designs.
Unique Advantages
- Highly Integrated Dual-Core SoC: ARM926EJ-S plus C674x DSP on a single die reduces BOM and simplifies board design for mixed-control and DSP tasks.
- Broad On-Chip Connectivity: Ethernet, SATA, USB 1.1/2.0 with PHYs, and multiple serial interfaces provide a wide range of I/O without external controllers.
- Real-Time Data Movement: Enhanced EDMA3 controller and multiple DMA channels enable efficient, low-latency transfers for time-critical applications.
- Industrial Temperature and Package Density: −40 °C to 90 °C rating and a 361-ball NFBGA (16×16) surface-mount package support rugged, space-constrained deployments.
- Security-Ready: Integrated boot security and cryptography features help protect device integrity from the earliest stages of system boot.
- Flexibility for Memory and Cache: Support for flexible L1/L2 cache and SDRAM controller options allows tuning for performance or memory-mapped use cases.
Why Choose OMAPL138CZWTD4RW?
The OMAPL138CZWTD4RW positions itself as a versatile embedded processor that blends an ARM926EJ-S application processor with a C674x DSP, providing a balanced platform for control, signal processing, and I/O-heavy applications. Its integrated connectivity, storage, display subsystems, and security features reduce the need for external components and streamline system design.
This industrial-grade device is suitable for developers and OEMs building compact, reliable embedded products that require deterministic processing, DSP acceleration, and broad peripheral support, all packaged in a high-density surface-mount BGA.
Request a quote or submit an inquiry to begin sourcing OMAPL138CZWTD4RW for your next embedded design project and evaluate how its integrated features can reduce BOM and accelerate time to market.

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