OMAPL138EZCEA3E
| Part Description |
ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (13x13) |
|---|---|
| Quantity | 885 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP-L13x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C674x, System Control; CP15 | Core Processor | ARM926EJ-S | Device Package | 361-NFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 3A991A2 | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 361-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3Gbps (1) | Security Features | Boot Security, Cryptography | Speed | 375MHz | ||
| Supplier Device Package | 361-NFBGA (13×13) | USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of OMAPL138EZCEA3E – IC MPU OMAP-L1X 375MHZ 361NFBGA
The OMAPL138EZCEA3E from Texas Instruments is a single-core ARM926EJ-S 32-bit microprocessor running at 375 MHz, offered in the OMAP-L13x series. It targets embedded systems and industrial applications that require a compact, integrated MPU with multiple on-chip interfaces and security capabilities.
The device integrates a range of system interfaces—including Ethernet, SATA, USB, LCD and SDRAM controllers—along with boot security and cryptography, and is specified for operation from −40°C to 105°C to meet industrial temperature requirements.
Key Features
- Core & Performance The ARM926EJ-S single 32‑bit core operates at 375 MHz, delivering deterministic processing for embedded control tasks.
- Co-processors Includes signal-processing and system-control co-processors: C674x DSP and CP15, enabling dedicated processing for signal and system-control workloads.
- Memory & Display On-chip SDRAM controller and LCD display controller support common embedded memory and display requirements.
- High-speed Connectivity Integrated 10/100 Mbps Ethernet and both USB 1.1 and USB 2.0 with PHYs provide flexible connectivity options.
- Storage Interface SATA 3 Gbps interface supports direct connection to storage devices.
- Security Features Built-in boot security and cryptography functions support secure boot and data protection use cases.
- Package & Mounting Available in a 361‑ball NFBGA (13×13 mm) surface-mount package for compact board-level integration.
- Industrial Temperature Range Rated for operation from −40°C to 105°C to suit industrial environments.
- Additional Interfaces Host Port Interface (HPI) available for system-level integration with external subsystems.
Typical Applications
- Industrial Control Single-core processing, industrial temperature rating, and multiple I/O interfaces make it suitable for embedded controllers and automation nodes.
- Networked Embedded Equipment On-chip Ethernet and SATA support network connectivity and local storage in communications or data-logging devices.
- Human-Machine Interfaces LCD controller plus USB connectivity enables implementation of operator displays and peripheral input.
Unique Advantages
- Broad On-chip Integration Ethernet, SATA, USB 1.1/2.0 with PHYs, LCD controller and SDRAM controller reduce external component count and simplify board design.
- Industrial Reliability −40°C to 105°C operating range and a compact 361‑ball NFBGA package support deployment in demanding environments.
- Built-in Security Boot security and cryptographic features enable secure device startup and data protection without requiring separate security ICs.
- Dedicated Signal Processing Support The C674x DSP co-processor provides focused signal-processing capability alongside the ARM926EJ-S core.
- Compact Footprint 13×13 mm NFBGA package facilitates high-density PCB layouts for space-constrained designs.
Why Choose OMAPL138EZCEA3E?
The OMAPL138EZCEA3E positions a 375 MHz ARM926EJ-S core together with a C674x DSP co-processor, multiple high-speed interfaces, and on-chip security in a compact industrial-grade package. This combination delivers a practical balance of processing, connectivity and system integration for embedded and industrial applications where temperature range and integrated I/O matter.
Designs that require local storage, Ethernet connectivity, display capability and secure boot can benefit from the device’s integrated controllers and industrial specifications, enabling streamlined hardware designs and reliable field operation.
Request a quote or submit an inquiry to check availability and pricing for the OMAPL138EZCEA3E and to discuss how it fits your embedded design requirements.

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