OMAPL138EZWTD4RW

IC MPU OMAP-L1X 456MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 456MHz 361-NFBGA (16x16)

Quantity 1,566 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusDiscontinued at Digi-Key
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCNN/AEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case361-LFBGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesBoot Security, CryptographySpeed456MHz
Supplier Device Package361-NFBGA (16×16)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138EZWTD4RW – IC MPU OMAP-L1X 456MHZ 361NFBGA

The OMAPL138EZWTD4RW is a single‑core ARM926EJ‑S microprocessor from the Texas Instruments OMAP‑L13x series, running at 456 MHz. Designed for embedded applications, it integrates processor performance with a range of on‑chip interfaces and security capabilities for industrial systems.

Key Features

  • Core & Performance Single ARM926EJ‑S 32‑bit core operating at 456 MHz for deterministic embedded processing.
  • Co‑processors Dedicated signal‑processing co‑processor C674x and system control CP15 to offload specialized tasks.
  • Memory & Display SDRAM controller support and an integrated LCD display interface for common embedded memory and UI needs.
  • Connectivity & Storage On‑chip 10/100 Mbps Ethernet, SATA 3 Gbps, and both USB 1.1 and USB 2.0 with PHYs enable networked and local storage connectivity.
  • Peripheral Interface Host Port Interface (HPI) for additional system integration and peripheral access.
  • Security Built‑in boot security and cryptography features to support secure boot and data protection strategies.
  • Package & Mounting Supplied in a 361‑NFBGA (16×16) package (package case listed as 361‑LFBGA) for compact surface‑mount board designs.
  • Industrial Grade & Temperature Rated for industrial operation with an ambient temperature range of −40 °C to 90 °C.
  • Compliance RoHS compliant to support environmentally regulated manufacturing.

Typical Applications

  • Industrial Control — Deterministic single‑core processing and industrial temperature rating make the device suitable for embedded controllers and factory automation.
  • Networked Appliances — Integrated 10/100 Mbps Ethernet and USB/SATA interfaces support networked equipment and local storage functions.
  • Human‑Machine Interfaces — LCD controller and SDRAM support enable operator displays and basic UI tasks in embedded systems.
  • Secure Embedded Systems — Boot security and cryptography features help implement secure device initialization and data protection.

Unique Advantages

  • Integrated connectivity suite: Ethernet, SATA and dual USB (1.1 and 2.0) with PHYs reduce external component count for connected systems.
  • Dedicated signal‑processing support: On‑chip C674x co‑processor provides hardware assistance for DSP tasks without additional chips.
  • Industrial temperature capability: −40 °C to 90 °C rating supports deployment in challenging ambient environments.
  • Security primitives on‑chip: Boot security and cryptography features enable secure system boot and protect sensitive operations.
  • Compact BGA footprint: 361‑NFBGA (16×16) package facilitates space‑constrained PCB designs while providing high pin density.
  • Manufacturer pedigree: Part of the Texas Instruments OMAP‑L13x series, offering integrated subsystems for embedded applications.

Why Choose OMAPL138EZWTD4RW?

The OMAPL138EZWTD4RW balances a 456 MHz ARM926EJ‑S core with integrated peripheral interfaces and on‑chip security to address embedded and industrial system requirements. Its combination of Ethernet, SATA, USB, SDRAM and display support enables compact, connected designs while the industrial temperature rating and RoHS compliance support deployment in regulated and harsh environments.

This device is suited for designers seeking a single‑chip solution that consolidates processing, connectivity and security functions in a compact BGA package from a recognized manufacturer.

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