OMAPL138EZWTQ3

IC MPU OMAP-L1X 375MHZ 361NFBGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 361-NFBGA (16x16)

Quantity 1,481 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package361-NFBGA (16x16)
Display & Interface ControllersLCDECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature–Package / Case361-LFBGARAM ControllersDDR2, LPDDR
REACH ComplianceREACH UnknownRoHS ComplianceROHS3 CompliantSATASATA 3Gbps (1)
Security FeaturesBoot Security, CryptographySpeed375MHzSupplier Device Package361-NFBGA (16×16)
USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)Voltage – I/O1.8V, 3.3V

Overview of OMAPL138EZWTQ3 – IC MPU OMAP-L1X 375MHZ 361NFBGA

The OMAPL138EZWTQ3 is an OMAP-L13x series microprocessor device featuring an ARM926EJ-S 32-bit MPU core running at 375 MHz. The OMAP-L138 family combines an ARM926EJ-S application processor with a TMS320C674x DSP core in a tightly integrated SoC architecture to support embedded designs that require general-purpose control and signal processing.

Designed for embedded applications, the device provides a broad set of memory controllers and peripheral interfaces—DDR2/LPDDR support, LCD controller, 10/100 Ethernet, SATA 3Gbps, USB 1.1 and USB 2.0 PHYs—along with security features such as boot security and cryptography, all in a 361-ball NFBGA (16×16) surface-mount package.

Key Features

  • ARM926EJ-S Core (MPU): 32-bit RISC core running at 375 MHz with 16 KB instruction cache and 16 KB data cache plus 8 KB vector-table RAM and 64 KB ROM.
  • TMS320C674x DSP: Integrated fixed- and floating-point VLIW DSP core (series-level feature) for signal-processing offload and high-throughput computation.
  • Memory and Storage Interfaces: DDR2 and LPDDR memory controllers, EMIFA external memory interface, and support for NOR/NAND and 16-bit SDRAM memory maps.
  • High-speed Peripherals: 10/100 Mbps Ethernet (1), SATA 3 Gbps (1), USB 2.0 + PHY (1) and USB 1.1 + PHY (1) to support networking and mass-storage connectivity.
  • Display and I/O: LCD controller and multiple serial interfaces, including configurable 16550‑type UARTs and SPI modules, for human-machine interface and peripheral control.
  • DMA and System Throughput: Enhanced DMA controller (EDMA3) with multiple transfer controllers and up to 64 independent DMA channels for efficient data movement.
  • Security: Hardware support for boot security and cryptography as part of the device security feature set.
  • Package and Assembly: 361-ball NFBGA (16×16) / 361-LFBGA package options, RoHS compliant, surface-mount mounting type for compact board-level integration.
  • Additional Interfaces: Host Port Interface (HPI) and multiple peripheral interfaces to support custom system architectures.

Typical Applications

  • Embedded Signal Processing: Use the integrated C674x DSP alongside the ARM926EJ-S core for audio, sensor, or control signal processing where offload and parallel compute are required.
  • Industrial and Networking Equipment: Leverage 10/100 Ethernet, SATA, and USB interfaces for industrial gateways, protocol converters, and networked appliances requiring local storage and connectivity.
  • Human-Machine Interfaces: Combine the LCD controller and serial interfaces to implement display-driven control panels and operator interfaces with local processing.

Unique Advantages

  • Integrated MPU + DSP Architecture: The combination of an ARM926EJ-S core and a C674x DSP in the OMAP-L138 series enables partitioning of control and signal-processing tasks on a single device, reducing system BOM and inter-chip latency.
  • Broad Peripheral Set: On-chip Ethernet, SATA, USB 1.1/2.0 with PHYs, and LCD support simplify connectivity and reduce the need for external controllers.
  • Flexible Memory Support: DDR2 and LPDDR controllers plus external memory interfaces accommodate a range of memory configurations for performance and capacity scaling.
  • Efficient Data Movement: EDMA3 with many independent channels and quick-DMA options enables high-throughput transfers with minimal CPU overhead.
  • Security-Ready: Built-in boot security and cryptography support help protect system integrity from power-up and during secure operations.
  • Compact, RoHS-Compliant Package: 361-ball NFBGA (16×16) surface-mount package supports dense board layouts while meeting RoHS environmental requirements.

Why Choose OMAPL138EZWTQ3?

OMAPL138EZWTQ3 positions itself as a versatile, integration-focused SoC for embedded designs that require a mix of application processing and high-performance signal processing. With a 375 MHz ARM926EJ-S core, DSP co-processor capabilities from the OMAP-L138 series, extensive memory-controller support, and a rich set of peripherals (Ethernet, SATA, USB, LCD), it addresses systems needing both control and data throughput in a single package.

This device is suitable for engineers developing compact, connected embedded systems that benefit from a consolidated hardware platform, on-chip DMA, and hardware security primitives—helping reduce component count, simplify board design, and provide a scalable platform for product development.

Request a quote or submit a parts inquiry to receive pricing and availability for OMAPL138EZWTQ3 and to discuss volume or lead-time requirements.

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