P1020NXE2HFB
| Part Description |
PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 800MHz 689-TEPBGA II (31x31) |
|---|---|
| Quantity | 1,360 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | P1020 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500v2 | Device Package | 689-TEPBGA II (31x31) | Grade | Industrial | ||
|---|---|---|---|---|---|---|---|
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C – 105°C | ||
| Package / Case | Tray | Speed | 800MHz | Voltage | 2.5V, 3.3V |
Overview of P1020NXE2HFB – IC MPU QORIQ P1 800MHZ PBGA689
The P1020NXE2HFB is a dual-core PowerPC e500v2 microprocessor from NXP Semiconductors' QorIQ P1020 series, operating at 800 MHz. It integrates CPU cores and system logic tailored for networking, wireless infrastructure, and telecommunications applications.
With integrated memory controllers, multi‑port Ethernet, security acceleration, and a broad set of I/O, this industrial‑grade processor is designed to deliver a compact, high‑function building block for embedded communication and infrastructure systems.
Key Features
- Processing Cores Dual PowerPC e500v2 processor cores, 32‑bit, running at 800 MHz for parallel packet and control processing.
- Memory Subsystem Integrated DDR2/DDR3 memory controller and on‑chip L2 cache to support system memory performance needs.
- Security Engine (SEC 3.3) Integrated SEC 3.3 security accelerator with support for 3DES, AES, KASUMI, MD5, RNG, SHA, and SNOW 3G.
- Ethernet and Networking Three enhanced three‑speed Ethernet controllers (10/100/1000 Mbps) with SGMII support and IEEE‑1588 precision time protocol capabilities for synchronized network applications.
- High‑speed I/O and Peripherals Two USB 2.0 controllers with PHY, two PCI Express controllers, an independent SD/MMC host (eSDHC), and a TDM interface for diverse peripheral and backplane connectivity.
- System Features Integrated DMA, programmable interrupt controller, and a system performance monitor to aid system integration and performance tuning.
- Package and Mounting 689‑TEPBGA II (31×31) package (689‑BBGA exposed pad), surface‑mount mounting for compact board designs.
- Industrial Qualification Industrial grade device with an operating temperature range of −40°C to 125°C.
- Graphics No graphics acceleration (processor focuses on control, networking, and security functions).
Typical Applications
- High‑performance communication systems Multiport networking equipment and infrastructure devices leveraging the triple gigabit Ethernet controllers and IEEE‑1588 support for synchronized traffic.
- Wireless infrastructure Baseband and edge controllers using dual CPU cores, security acceleration, and high‑speed I/O for protocol offload and secure transport.
- Telecommunications equipment TDM interfaces, PCIe connectivity, and robust thermal range make it suitable for telecom control and gateway functions.
- Storage and RAID controllers On‑chip DMA, PCIe, and memory subsystem support enable RAID and storage‑controller applications.
- SMB gateways and WLAN access points Integrated security engine and multiple Ethernet ports support secure, managed gateway and access point designs.
Unique Advantages
- Dual‑core processing for parallel workloads: Two PowerPC e500v2 cores enable separation of control and data‑plane tasks within a single device.
- Integrated security acceleration: SEC 3.3 with broad algorithm support reduces CPU load for cryptographic operations and simplifies secure design.
- Multi‑port Ethernet with timing: Three 10/100/1000 controllers plus IEEE‑1588 support deliver synchronized, multiport networking without extensive external logic.
- Flexible memory and PCIe connectivity: DDR2/DDR3 controller and two PCI Express controllers simplify high‑bandwidth subsystem designs.
- Industrial temperature rating: −40°C to 125°C qualification supports deployment in demanding environmental conditions.
- Compact BGA package: 689‑TEPBGA II (31×31) package provides a high‑density, surface‑mount form factor for space‑constrained boards.
Why Choose P1020NXE2HFB?
The P1020NXE2HFB positions itself as a highly integrated processor combining dual PowerPC e500v2 cores with a comprehensive set of networking, security, and I/O features. Its blend of processing performance, on‑chip acceleration, and multiple high‑speed interfaces makes it well suited to embedded designs in networking, wireless infrastructure, and telecommunications.
Built to industrial temperature specifications and delivered in a compact BGA package, this device is appropriate for designers seeking an integrated, field‑ready processing element that reduces external component count while supporting scalable, performance‑oriented system architectures backed by the QorIQ P1020 product family.
Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for P1020NXE2HFB. Our team can provide technical and procurement details to support your design evaluation and purchasing process.

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