P1020NXN2HFB

IC MPU QORIQ P1 800MHZ PBGA689
Part Description

PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 800MHz 689-TEPBGA II (31x31)

Quantity 1,027 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesP1020
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e500v2Device Package689-TEPBGA II (31x31)GradeIndustrial
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C – 105°C
Package / CaseTraySpeed800MHzVoltage2.5V, 3.3V

Overview of P1020NXN2HFB – Dual-Core PowerPC e500v2 800 MHz Microprocessor

The P1020NXN2HFB is an NXP Semiconductors QorIQ P1 series integrated processor featuring two Power Architecture e500v2 cores running at 800 MHz. It combines dual CPU cores with integrated system logic tailored for networking, wireless infrastructure, and telecommunications applications.

Designed for industrial-grade deployments, the device integrates memory controllers, multi-port Ethernet, USB, security acceleration and high-speed I/O to simplify system design and accelerate time-to-market for communication and infrastructure products.

Key Features

  • Dual PowerPC e500v2 Cores — Two 32-bit e500v2 processor cores at 800 MHz for parallel processing and control-plane/data-plane separation.
  • Memory Subsystem — Integrated DDR2 and DDR3 memory controllers to support system memory configurations and high-throughput data buffering.
  • Integrated Security Engine (SEC 3.3) — On-chip security acceleration with algorithms including 3DES, AES, KASUMI, MD5, RNG, SHA and SNOW 3G for offloading cryptographic workloads.
  • Multiport Ethernet — Three enhanced three-speed Ethernet controllers (10/100/1000 Mbps) with SGMII support and IEEE Std 1588 precision time protocol capability for synchronized networking.
  • USB and Storage Interfaces — Two USB 2.0 ports with PHY and an independent eSDHC SD/MMC controller for peripheral and removable storage connectivity.
  • High-Speed I/O and Peripheral Controllers — Two PCI Express controllers, TDM interface, DMA, I2C, DUART and enhanced local bus controller (eLBC) to connect a variety of system components.
  • System and Performance Monitoring — Integrated system performance monitor and programmable interrupt controller to support performance tuning and reliable interrupt handling.
  • Package and Mounting — 689-TEPBGA II exposed-pad package (31 × 31 mm), surface-mount mounting for compact board-level integration.
  • Industrial Qualification and Temperature Range — Industrial grade device with operating temperature range of −40 °C to 125 °C for demanding environments.

Typical Applications

  • High-Performance Communication Systems — Use the dual cores, DDR2/DDR3 memory controller and multiport Gigabit Ethernet to implement routing, switching and protocol offload functions.
  • Wireless Infrastructure — Integrate baseband control and backhaul interfaces leveraging PCIe, TDM and the device’s Ethernet controllers for wireless access equipment.
  • Telecommunications Equipment — Employ the integrated security engine, IEEE 1588 support and industrial temperature rating for telecom synchronization and secure packet handling.
  • Storage and RAID Controllers — Leverage the dual cores, DMA and high-speed I/O to implement RAID and storage gateway functions.
  • WLAN Access Points and SMB Gateways — Combine USB, SD/MMC host, Ethernet ports and hardware security acceleration to build compact, secure access and gateway appliances.

Unique Advantages

  • Highly Integrated Networking Peripherals: On-chip triple Gigabit Ethernet controllers, USB 2.0 ports and PCIe controllers reduce external component count and simplify board design.
  • Hardware Security Offload: SEC 3.3 with a broad set of cryptographic algorithms enables secure throughput without heavy CPU overhead.
  • Flexible Memory Support: Native DDR2 and DDR3 controllers allow designers to select memory technology that matches performance and cost targets.
  • Industrial-Grade Robustness: Qualification for industrial use and an operating range of −40 °C to 125 °C supports deployment in harsh environments.
  • Parallel Processing Capability: Dual e500v2 cores enable separation of control and data-plane processing to improve application responsiveness.

Why Choose P1020NXN2HFB?

The P1020NXN2HFB provides a balanced combination of dual-core processing, integrated networking and security engines, and broad peripheral support that positions it for embedded networking, wireless infrastructure and telecommunications designs. Its industrial-grade qualification and wide temperature range make it suitable for deployment in challenging environments.

For system designers seeking to reduce BOM complexity while retaining flexibility—through DDR2/DDR3 memory support, multiple Ethernet ports, USB/eSDHC and PCIe connectivity—the P1020NXN2HFB offers a platform that addresses integration, performance and reliability requirements of infrastructure-class applications.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the P1020NXN2HFB.

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