P1021NSE2DFB

IC MPU 533MHZ PBGA689
Part Description

PowerPC e500v2 Microprocessor IC - 2 Core, 32-Bit 533MHz 689-TEPBGA II (31x31)

Quantity 299 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP1021
ManufacturerNXP Semiconductors
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; QUICC Engine, Security; SEC 3.3Core ProcessorPowerPC e500v2Device Package689-TEPBGA II (31x31)
ECCN5A002Ethernet10/100/1000Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 125°C (TA)
Package / Case689-BBGA Exposed PadRAM ControllersDDR2, DDR3REACH ComplianceREACH not applicable
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed533MHz
Supplier Device Package689-TEPBGA II (31×31)USBUSB 2.0 + PHY (1)

Overview of P1021NSE2DFB – IC MPU 533MHz PBGA689

The P1021NSE2DFB is a PowerPC e500v2 microprocessor IC featuring two 32-bit cores running at 533 MHz, packaged in a 689-TEPBGA II (31×31) surface-mount package. It is designed for embedded applications where integrated communications and security co-processing, along with flexible memory and I/O support, are required.

Targeted at embedded system designs, the device combines multi-core processing with on-chip communications and security engines to address networking and secure communications use cases while offering DDR2/DDR3 memory controller support and multiple Ethernet interfaces.

Key Features

  • Core & Performance  PowerPC e500v2 architecture with two 32-bit cores running at 533 MHz for parallel embedded processing.
  • Memory Subsystem  Integrated controllers for DDR2 and DDR3 memory to support a range of system memory configurations.
  • Communications & Offload Engines  On-chip co-processors including QUICC Engine for communications and SEC 3.3 for security offload.
  • Ethernet  Three 10/100/1000 Mbps Ethernet interfaces for multi-port networking and connectivity.
  • USB & Serial I/O  One USB 2.0 port with PHY and additional DUART interface for serial communications and peripheral connectivity.
  • Security Features  Built-in cryptography capabilities and a random number generator to support secure communications and data protection.
  • Package & Mounting  689-BBGA exposed pad in a 689-TEPBGA II (31×31) supplier device package; surface-mount mounting type.
  • Operating Range & Qualification  Consumer-qualified device with an operating temperature range of 0 °C to 125 °C and RoHS compliance.
  • Graphics  No graphics acceleration included.

Typical Applications

  • Embedded Networking Equipment  Multi-port Gigabit Ethernet and QUICC Engine co-processor make the device suitable for routing, switching, and other networking functions.
  • Secure Communications Appliances  SEC 3.3 and on-chip cryptography with RNG support secure data transmission and offload security tasks from the main cores.
  • General Embedded Controllers  Dual-core PowerPC architecture with DDR2/DDR3 support is suitable for control platforms requiring balanced compute and I/O.
  • Connectivity Gateways  Integrated USB 2.0 + PHY, DUART, and multiple Ethernet ports enable gateway and bridge applications in embedded systems.

Unique Advantages

  • Integrated Communications and Security: Combines QUICC Engine and SEC 3.3 co-processors with cryptography and RNG to reduce host CPU load for networking and secure transactions.
  • Dual-Core 533 MHz Performance: Two PowerPC e500v2 cores provide parallel processing capability for multitasking embedded workloads.
  • Flexible Memory Support: DDR2 and DDR3 memory controller compatibility allows designers to choose memory technologies that match performance and cost targets.
  • Multi-Port Ethernet: Three 10/100/1000 Mbps Ethernet interfaces enable multi-link connectivity within compact embedded designs.
  • Compact Surface-Mount Package: 689-TEPBGA II (31×31) package with exposed pad supports high-density board designs and thermal management.
  • RoHS-Compliant, Consumer-Qualified: RoHS status is compliant and the device is qualified for consumer applications, simplifying regulatory considerations for those markets.

Why Choose P1021NSE2DFB?

The P1021NSE2DFB positions itself as a balanced embedded processing solution that pairs dual PowerPC e500v2 cores with dedicated communications and security co-processors. Its combination of multi-core performance, DDR2/DDR3 memory controller support, and multi-port Gigabit Ethernet makes it suitable for designs that require integrated networking and secure data handling.

Manufactured by NXP Semiconductors and offered in a compact 689-TEPBGA II (31×31) surface-mount package, the device delivers a scalable platform for embedded system designers focused on connectivity and security, while meeting consumer qualification and RoHS compliance requirements.

Request a quote or submit an inquiry for P1021NSE2DFB to receive pricing and availability information tailored to your project requirements.

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