P1021NSE2DFB
| Part Description |
PowerPC e500v2 Microprocessor IC - 2 Core, 32-Bit 533MHz 689-TEPBGA II (31x31) |
|---|---|
| Quantity | 299 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | P1021 |
| Manufacturer | NXP Semiconductors |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; QUICC Engine, Security; SEC 3.3 | Core Processor | PowerPC e500v2 | Device Package | 689-TEPBGA II (31x31) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002 | Ethernet | 10/100/1000Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | 0°C ~ 125°C (TA) | ||
| Package / Case | 689-BBGA Exposed Pad | RAM Controllers | DDR2, DDR3 | REACH Compliance | REACH not applicable | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography, Random Number Generator | Speed | 533MHz | ||
| Supplier Device Package | 689-TEPBGA II (31×31) | USB | USB 2.0 + PHY (1) |
Overview of P1021NSE2DFB – IC MPU 533MHz PBGA689
The P1021NSE2DFB is a PowerPC e500v2 microprocessor IC featuring two 32-bit cores running at 533 MHz, packaged in a 689-TEPBGA II (31×31) surface-mount package. It is designed for embedded applications where integrated communications and security co-processing, along with flexible memory and I/O support, are required.
Targeted at embedded system designs, the device combines multi-core processing with on-chip communications and security engines to address networking and secure communications use cases while offering DDR2/DDR3 memory controller support and multiple Ethernet interfaces.
Key Features
- Core & Performance PowerPC e500v2 architecture with two 32-bit cores running at 533 MHz for parallel embedded processing.
- Memory Subsystem Integrated controllers for DDR2 and DDR3 memory to support a range of system memory configurations.
- Communications & Offload Engines On-chip co-processors including QUICC Engine for communications and SEC 3.3 for security offload.
- Ethernet Three 10/100/1000 Mbps Ethernet interfaces for multi-port networking and connectivity.
- USB & Serial I/O One USB 2.0 port with PHY and additional DUART interface for serial communications and peripheral connectivity.
- Security Features Built-in cryptography capabilities and a random number generator to support secure communications and data protection.
- Package & Mounting 689-BBGA exposed pad in a 689-TEPBGA II (31×31) supplier device package; surface-mount mounting type.
- Operating Range & Qualification Consumer-qualified device with an operating temperature range of 0 °C to 125 °C and RoHS compliance.
- Graphics No graphics acceleration included.
Typical Applications
- Embedded Networking Equipment Multi-port Gigabit Ethernet and QUICC Engine co-processor make the device suitable for routing, switching, and other networking functions.
- Secure Communications Appliances SEC 3.3 and on-chip cryptography with RNG support secure data transmission and offload security tasks from the main cores.
- General Embedded Controllers Dual-core PowerPC architecture with DDR2/DDR3 support is suitable for control platforms requiring balanced compute and I/O.
- Connectivity Gateways Integrated USB 2.0 + PHY, DUART, and multiple Ethernet ports enable gateway and bridge applications in embedded systems.
Unique Advantages
- Integrated Communications and Security: Combines QUICC Engine and SEC 3.3 co-processors with cryptography and RNG to reduce host CPU load for networking and secure transactions.
- Dual-Core 533 MHz Performance: Two PowerPC e500v2 cores provide parallel processing capability for multitasking embedded workloads.
- Flexible Memory Support: DDR2 and DDR3 memory controller compatibility allows designers to choose memory technologies that match performance and cost targets.
- Multi-Port Ethernet: Three 10/100/1000 Mbps Ethernet interfaces enable multi-link connectivity within compact embedded designs.
- Compact Surface-Mount Package: 689-TEPBGA II (31×31) package with exposed pad supports high-density board designs and thermal management.
- RoHS-Compliant, Consumer-Qualified: RoHS status is compliant and the device is qualified for consumer applications, simplifying regulatory considerations for those markets.
Why Choose P1021NSE2DFB?
The P1021NSE2DFB positions itself as a balanced embedded processing solution that pairs dual PowerPC e500v2 cores with dedicated communications and security co-processors. Its combination of multi-core performance, DDR2/DDR3 memory controller support, and multi-port Gigabit Ethernet makes it suitable for designs that require integrated networking and secure data handling.
Manufactured by NXP Semiconductors and offered in a compact 689-TEPBGA II (31×31) surface-mount package, the device delivers a scalable platform for embedded system designers focused on connectivity and security, while meeting consumer qualification and RoHS compliance requirements.
Request a quote or submit an inquiry for P1021NSE2DFB to receive pricing and availability information tailored to your project requirements.

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