P3041NSE1MMB

IC MPU QORIQ P3 1.2GHZ 1295BGA
Part Description

PowerPC e500mc Microprocessor IC QorIQ P3 4 Core, 32-Bit 1.2GHz 1295-FCPBGA (37.5x37.5)

Quantity 820 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP3041
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 4.2Core ProcessorPowerPC e500mcDevice Package1295-FCPBGA (37.5x37.5)
ECCN5A002A1 FREEthernet10/100/1000Mbps (5), 10Gbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1295-BBGA, FCBGARAM ControllersDDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (2)Security FeaturesBoot Security, Cryptography, Random Number Generator, Secure Fusebox
Speed1.2GHzSupplier Device Package1295-FCPBGA (37.5×37.5)USBUSB 2.0 + PHY (2)
Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of P3041NSE1MMB – IC MPU QORIQ P3 1.2GHZ 1295BGA

The P3041NSE1MMB is a PowerPC e500mc microprocessor from the NXP QorIQ P3 family, delivered as a 4-core, 32-bit MPU running at 1.2 GHz in a 1295-FCPBGA (37.5×37.5 mm) package. It targets embedded applications requiring multi-core processing combined with integrated high-speed interfaces and security capabilities.

With integrated DDR3/DDR3L memory controllers, multiple Gigabit Ethernet ports plus a 10Gbps port, SATA and USB interfaces, and hardware security features, this device is positioned for designs that need processing performance alongside networking, storage and secure boot capabilities.

Key Features

  • Core and Performance PowerPC e500mc architecture with 4 cores at 1.2 GHz delivering parallel 32-bit processing for multithreaded embedded workloads.
  • Memory Interfaces Integrated RAM controllers supporting DDR3 and DDR3L memory technologies to enable system memory configurations for embedded operating systems and applications.
  • Networking Multiple Ethernet interfaces including five 10/100/1000 Mbps ports and one 10 Gbps port for high-throughput network connectivity.
  • Storage and USB Two SATA 3 Gbps ports for storage subsystems and two USB 2.0 ports with PHY for peripheral connectivity and data transfer.
  • Security Subsystem On-chip security features including Boot Security, Cryptography, Random Number Generator and a Secure Fusebox, supported by a Security co-processor (SEC 4.2).
  • Package and Mounting 1295-BBGA (FCBGA) package supplied as 1295-FCPBGA (37.5×37.5 mm) for surface-mount PCB assembly.
  • Operating Temperature Rated for an operating temperature range of 0 °C to 105 °C.
  • Additional Interfaces DUART interface for serial communications and system control.

Typical Applications

  • Networking Equipment — Multi-core processing combined with five Gigabit Ethernet ports and one 10Gbps port supports control-plane and data-plane tasks in embedded network devices.
  • Storage Appliances — Dual SATA 3 Gbps ports enable integration into storage subsystems and NAS-type designs requiring on-board processing and data transport.
  • Industrial Embedded Systems — 4-core processing, DDR3/DDR3L support and a 0 °C to 105 °C operating range make it suitable for industrial control and automation platforms.
  • Secure Embedded Platforms — Hardware boot security, cryptography and RNG features provide the building blocks for secure device authentication and trusted boot flows.

Unique Advantages

  • Multi-Core Processing: Four e500mc cores at 1.2 GHz enable parallel task execution for responsive embedded applications.
  • Integrated High-Speed I/O: On-chip Gigabit and 10Gbps Ethernet, SATA and USB interfaces reduce external component count and simplify board-level design.
  • Hardware Security: Built-in security features and a dedicated SEC 4.2 co-processor help implement secure boot and cryptographic functions without external accelerators.
  • Memory Flexibility: DDR3 and DDR3L controller support allows designers to choose memory types that match power and performance targets.
  • Commercial Temperature Range: Rated 0 °C to 105 °C for deployment in a variety of embedded environments requiring extended operating range.
  • Compact Surface-Mount Package: 1295-FCPBGA (37.5×37.5 mm) package supports high-density PCB layouts and surface-mount assembly processes.

Why Choose P3041NSE1MMB?

The P3041NSE1MMB combines a 4-core PowerPC e500mc architecture with integrated memory controllers, extensive networking and storage interfaces, and on-chip security features—providing a balanced platform for embedded designs that require multi-core processing, high-speed I/O and trusted boot capabilities. Its 1295-FCPBGA package and surface-mount form factor support compact system designs.

Manufactured by NXP Semiconductors and equipped with features such as DDR3/DDR3L support, multiple Ethernet ports including 10Gbps, dual SATA and hardware security, the device is appropriate for developers and system architects building networking, storage, industrial or secure embedded systems who need a scalable, integrated processing solution.

If you would like pricing, availability, or to request a quote for P3041NSE1MMB, please submit a request or contact our sales channel to get a competitive quote tailored to your project needs.

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