P5021NXN7TMC

IC MPU QORIQ P5 1.8GHZ 1295BGA
Part Description

PowerPC e5500 Microprocessor IC QorIQ P5 2 Core, 64-Bit 1.8GHz 1295-FCPBGA (37.5x37.5)

Quantity 117 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesP5021
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e5500Device Package1295-FCPBGA (37.5x37.5)ECCN3A991A2
Ethernet1Gbps (10), 10Gbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40°C ~ 105°C (TA)Package / Case1295-BBGA, FCBGA
RAM ControllersDDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (2)Speed1.8GHzSupplier Device Package1295-FCPBGA (37.5×37.5)
USBUSB 2.0 + PHY (2)Voltage – I/O1.0V, 1.1V

Overview of P5021NXN7TMC – IC MPU QORIQ P5 1.8GHZ 1295BGA

The P5021NXN7TMC is an industrial-grade QorIQ P5 integrated communications processor from NXP Semiconductors based on two Power Architecture® e5500 cores running at 1.8 GHz. It combines multicore CPU performance with a high-performance data path acceleration architecture and extensive on-chip networking and peripheral interfaces.

Designed for embedded networking, telecom/datacom, wireless infrastructure and aerospace applications, the device delivers integrated packet and storage acceleration, wide-ranging I/O, and hardware security features to simplify system design and improve throughput for control, data‑path and application processing.

Key Features

  • CPU Core  Two PowerPC e5500 cores, 64-bit, each with a backside 512 KB L2 cache and independent boot/reset capability; processor frequency 1.8 GHz.
  • Data Path Acceleration (DPAA)  Integrated DPAA with Frame Manager (FMan), Queue Manager (QMan), Hardware Buffer Manager (BMan) and hardware encryption/decryption to accelerate packet processing and buffer management.
  • Memory Subsystem  Two 64-bit DDR3/DDR3L SDRAM controllers with ECC and a 2 MB CoreNet platform cache with ECC for coherent shared-memory performance.
  • High‑Speed Networking  Two 10‑Gigabit Ethernet (XAUI) controllers plus ten 1‑Gigabit Ethernet controllers with SGMII/2.5Gb/s SGMII/RGMII support for flexible network topologies.
  • Storage and USB  Two SATA 3 Gbps controllers and two high-speed USB 2.0 controllers with integrated PHYs for storage and peripheral connectivity.
  • Peripheral Interfaces  Three PCI Express 2.0 ports, four I2C controllers, multiple UART configurations and enhanced SD/MMC and SPI interfaces to support diverse peripheral ecosystems.
  • Storage Acceleration  RAID 5 and RAID 6 storage accelerator support with end-to-end data protection information for robust storage solutions.
  • Security and Trust  Boot security, cryptographic acceleration, secure fusebox, secure debug, tamper detection and volatile key storage for layered device protection.
  • Package and Thermal  1295‑ball FC‑PBGA package, 37.5 mm × 37.5 mm; industrial operating temperature range −40 °C to 105 °C.
  • Qualification  Industrial qualification for designs requiring extended environmental range and reliability.

Typical Applications

  • Network Routers and Switches  Packet classification, scheduling and data‑plane acceleration using on‑chip DPAA and multiple 10G/1G Ethernet controllers.
  • Telecom/Datacom Systems  Control and data‑path processing in base station controllers and aggregation equipment leveraging multicore performance and high‑speed I/O.
  • Wireless Infrastructure  Real‑time packet processing and protocol handling for wireless backhaul and infrastructure nodes.
  • Aerospace and Rugged Embedded Systems  Industrial temperature range and extensive security features for robust embedded computing in harsh environments.
  • Storage and NAS Appliances  RAID acceleration plus SATA and PCIe interfaces for compact, high‑throughput storage controllers.

Unique Advantages

  • Highly integrated communications processor: Combines multicore CPUs, DPAA, memory controllers and wide-ranging I/O to reduce BOM and simplify board design.
  • Accelerated data‑path processing: DPAA components (FMan, QMan, BMan) and hardware crypto accelerate packet handling and security without off‑chip engines.
  • Rich connectivity options: Multiple 10GbE and 1GbE ports, PCIe, SATA, USB and SD/MMC support flexible system architectures and peripheral choices.
  • Designed for industrial environments: Industrial qualification and −40 °C to 105 °C operating range support deployments in demanding conditions.
  • Comprehensive on‑chip security: Secure boot, cryptography and tamper detection provide layered protection for sensitive applications.

Why Choose P5021NXN7TMC?

The P5021NXN7TMC positions high‑performance multicore processing alongside dedicated packet and storage acceleration to deliver a compact, integrated platform for networking, telecom and rugged embedded systems. Its combination of two PowerPC e5500 cores, DPAA, ECC‑protected memory controllers and extensive I/O reduces system complexity while enabling high throughput for mixed control and data‑path workloads.

Backed by NXP Semiconductors documentation and datasheet details, this device is suited to developers seeking a scalable, secure and industrially qualified processor for communication‑centric embedded designs that demand both compute and specialized acceleration on a single silicon platform.

Request a quote or submit a sales inquiry to discuss pricing, availability and volume options for the P5021NXN7TMC.

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