STM32MP133AAE3

Linear IC's
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 650MHz 289-LFBGA (14x14)

Quantity 764 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP133
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-LFBGA (14x14)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key StorageSpeed650MHzSupplier Device Package289-LFBGA (14×14)
USBUSB 2.0 (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of STM32MP133AAE3 – Linear IC's

The STM32MP133AAE3 is an ARM® Cortex®-A7 microprocessor IC in the STM32MP133 series, featuring a single 32‑bit core running at 650 MHz in a 289‑LFBGA (14×14) package. Designed for embedded microprocessor applications, it combines processing performance with integrated multimedia, memory and connectivity support to address a range of embedded use cases.

With on-chip display controllers, graphics acceleration and a broad set of interfaces, this device targets connected and display-driven embedded systems where integration, security features and wide operating temperature range are important design considerations.

Key Features

  • Core  ARM® Cortex®-A7 single core, 32‑bit, operating at 650 MHz for general-purpose embedded processing.
  • Multimedia Acceleration  Includes multimedia co‑processing with NEON™ SIMD to accelerate media and signal processing workloads.
  • Memory Support  Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memories to support a range of system memory configurations.
  • Display and Graphics  On-chip LCD display interface and graphics acceleration for display-driven embedded applications.
  • Connectivity  Two 10/100/1000 Mbps Ethernet interfaces, two USB 2.0 ports and CANbus support enable wired networking and peripheral connectivity.
  • Security  Hardware security features including AES, ARM TrustZone, boot security, cryptography accelerators, secure debug controls, SHA‑1/2, tamper detection, TRNG and volatile key storage.
  • Package and Mounting  289‑LFBGA package (14×14) designed for surface-mount assembly.
  • Operating Temperature  Designed to operate across a wide temperature range of −40°C to 125°C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Connected Embedded Systems  Dual Gigabit Ethernet, USB and CANbus interfaces make this device suitable for networked gateways and edge appliances that require multiple wired interfaces.
  • Human‑Machine Interfaces  Integrated LCD controller and graphics acceleration support interactive display panels and operator interfaces.
  • Industrial Control  Single‑core processing plus extensive security and a wide temperature range suit industrial automation controllers and embedded instrumentation.
  • Multimedia Edge Devices  NEON™ SIMD multimedia capabilities enable local media processing in compact embedded products.

Unique Advantages

  • Single‑chip integration: Combines processor core, display controller, memory interfaces and multiple communications ports to reduce system BOM and simplify board design.
  • Broad memory compatibility: Support for DDR3, DDR3L, LPDDR2 and LPDDR3 allows flexible memory choices to match performance and power targets.
  • Comprehensive security: On‑chip AES, SHA, TRNG, secure debug and boot security provide hardware-level mechanisms to protect keys and boot integrity.
  • Rich wired connectivity: Dual Gigabit Ethernet, USB 2.0 and CANbus support enable high-throughput and fieldbus connections for a variety of applications.
  • Wide thermal range: −40°C to 125°C operating range supports deployment in thermally demanding environments.
  • Compact surface-mount package: 289‑LFBGA (14×14) offers a condensed footprint for space-constrained embedded designs.

Why Choose STM32MP133AAE3?

The STM32MP133AAE3 positions itself as a highly integrated embedded microprocessor solution that pairs a 650 MHz ARM® Cortex®‑A7 core with extensive multimedia, memory and connectivity features. It is aimed at designs that require a balanced combination of processing capability, hardware security primitives and multiple wired interfaces in a compact LFBGA package.

Manufactured by STMicroelectronics as part of the STM32MP133 series, this device offers a clear path for embedded designs demanding robust connectivity, display support and secure boot/cryptography features while accommodating a wide operating temperature range.

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