STM32MP133CAE3

Linear IC's
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 650MHz 289-LFBGA (14x14)

Quantity 949 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP133
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package289-LFBGA (14x14)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case289-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key StorageSpeed650MHzSupplier Device Package289-LFBGA (14×14)
USBUSB 2.0 (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of STM32MP133CAE3 – Linear IC's

The STM32MP133CAE3 is an ARM® Cortex®-A7 microprocessor IC in the STM32MP133 series, offering a single 32-bit core operating at 650 MHz. Designed for embedded applications, it combines processing performance with integrated multimedia, connectivity, and security capabilities for systems that require a compact, surface-mount solution.

With on-chip support for multiple memory types, display control, high-speed Ethernet, USB, and hardware security primitives, the device targets embedded designs that need balanced compute, I/O integration, and robust operation across a wide temperature range.

Key Features

  • Core  ARM® Cortex®-A7 single core, 32-bit at 650 MHz providing general-purpose application processing.
  • Multimedia DSP  Includes multimedia co-processors and NEON™ SIMD for accelerated media and signal processing workloads.
  • Memory Interfaces  On-chip controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memory types for flexible system memory configurations.
  • Display and Graphics  LCD display interface controller plus graphics acceleration for driving user interfaces and visual output.
  • Ethernet and USB  Dual Gigabit Ethernet (10/100/1000 Mbps ×2) and two USB 2.0 ports for high-bandwidth networking and peripheral connectivity.
  • Additional Field Interfaces  CANbus support to integrate with vehicle networks and industrial control buses.
  • Security  Hardware security suite including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA-1/2, tamper detection, TRNG, and volatile key storage.
  • Package and Mounting  289-LFBGA (14×14) surface-mount package suitable for compact board designs.
  • Operating Range  Rated for operation from −40 °C to 125 °C for demanding thermal environments.

Typical Applications

  • Embedded Systems  General-purpose embedded controllers that require a balance of compute, I/O, and security.
  • Industrial Networking  Devices leveraging dual Gigabit Ethernet and CANbus for networked control and data aggregation.
  • Human–Machine Interfaces (HMI)  Display-driven interfaces using the LCD controller and graphics acceleration for responsive visuals.
  • Multimedia Devices  Applications that benefit from NEON™ SIMD and multimedia co-processing for media handling and signal processing.
  • Secure Embedded Controllers  Systems requiring hardware-anchored security functions such as AES, TRNG, and secure boot.

Unique Advantages

  • Compact, high-density package: The 289-LFBGA (14×14) package provides a surface-mount form factor suitable for space-constrained boards.
  • Integrated connectivity: Dual Gigabit Ethernet and multiple USB ports reduce external components for networked and peripheral-rich designs.
  • Flexible memory support: DDR3, DDR3L, LPDDR2 and LPDDR3 controllers enable a range of memory choices to match performance and power targets.
  • Built-in security primitives: AES, ARM TrustZone, secure boot, TRNG, and other features support secure device operation and protected key storage.
  • Media acceleration: Multimedia co-processors and NEON™ SIMD provide hardware acceleration for media and signal processing tasks.
  • Wide temperature capability: Operation from −40 °C to 125 °C supports deployment in thermally challenging environments.

Why Choose STM32MP133CAE3?

The STM32MP133CAE3 positions a 650 MHz ARM® Cortex®-A7 core alongside integrated multimedia, connectivity, and security features in a compact LFBGA package. Its combination of memory flexibility, dual Gigabit Ethernet, USB, display support, and hardware security provides a well-rounded foundation for embedded designs that require both processing capability and extensive on-chip integration.

Manufactured by STMicroelectronics and part of the STM32MP133 series, this device is suited for designers building embedded systems that demand connectivity, media handling, and hardware-backed security while operating across a broad temperature range.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the STM32MP133CAE3.

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