STM32MP133AAF3

Linear IC's
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 650MHz 320-TFBGA (11x11)

Quantity 460 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP133
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package320-TFBGA (11x11)
Display & Interface ControllersLCDECCNN/AEthernet10/100/1000Mbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case320-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesAES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key StorageSpeed650MHzSupplier Device Package320-TFBGA (11×11)
USBUSB 2.0 (2)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of STM32MP133AAF3 – ARM Cortex-A7 650 MHz Microprocessor, 1‑Core, 32‑Bit

The STM32MP133AAF3 is a single‑core ARM® Cortex®‑A7 microprocessor IC running at 650 MHz in a 320‑TFBGA (11×11) package. Designed for embedded systems, it integrates compute, connectivity, display and security features to address a range of embedded processing needs.

With built‑in Ethernet, USB, CANbus, LCD display controller and multiple memory controller options, the device targets applications that require balanced processing performance, peripheral integration and on‑chip security capabilities.

Key Features

  • Core  ARM® Cortex®‑A7 single core, 32‑bit architecture running at 650 MHz for general‑purpose embedded processing.
  • Co‑processing  Multimedia co‑processor support including NEON™ SIMD for accelerated media and signal processing workloads.
  • Memory interfaces  Integrated memory controllers supporting DDR3, DDR3L, LPDDR2 and LPDDR3 to match a range of system memory configurations.
  • Connectivity  Dual 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 ports provide high‑throughput network and peripheral connectivity.
  • Display and graphics  LCD display controller and graphics acceleration support enable graphical user interfaces and display offload.
  • Automotive grade listing  Device grade is listed as Automotive in the product specifications.
  • Security  Comprehensive security feature set including AES, ARM TrustZone, boot security, cryptography, secure debug, SHA‑1/2, tamper detection, TRNG and volatile key storage.
  • Additional interfaces  CANbus interface support for control and messaging applications.
  • Package & mounting  320‑TFBGA (11×11) supplier device package with surface‑mount mounting type for compact board integration.
  • Operating temperature  Rated for an operating temperature range of −40 °C to 125 °C.
  • Environmental  RoHS compliant.

Typical Applications

  • Embedded systems  General embedded processing where a single ARM Cortex‑A7 core and integrated peripherals deliver system control and application processing.
  • Networked devices  Products requiring wired connectivity and throughput, leveraging the dual 10/100/1000 Mbps Ethernet interfaces and USB 2.0 ports.
  • Graphical user interfaces  Systems that drive LCDs and need graphics acceleration for UI rendering and display handling.
  • Secure devices  Applications that require hardware security primitives such as AES, TRNG and ARM TrustZone for secure boot and cryptographic functions.
  • Control and messaging systems  CANbus support for real‑time control and messaging in embedded control environments.

Unique Advantages

  • Integrated connectivity: Dual gigabit Ethernet and dual USB 2.0 ports reduce the need for external controllers and simplify system design.
  • Flexible memory support: DDR3/DDR3L and LPDDR2/LPDDR3 controller options allow designers to choose memory types that match performance and power targets.
  • Built‑in security suite: Hardware AES, TrustZone, TRNG and secure debug features provide a foundation for secure device architectures.
  • Display and graphics acceleration: On‑chip LCD controller and graphics acceleration enable richer user interfaces without separate GPUs.
  • Broad temperature range: Rated from −40 °C to 125 °C for deployment in thermally demanding embedded environments.
  • Compact surface‑mount package: 320‑TFBGA (11×11) package supports compact board layouts for space‑constrained designs.

Why Choose STM32MP133AAF3?

The STM32MP133AAF3 combines an ARM Cortex‑A7 core with a comprehensive set of interfaces and security features to deliver a balanced platform for embedded applications. Its integrated Ethernet, USB, CANbus, display and memory controller options reduce external component count and streamline system integration.

Designed for engineers seeking a compact, feature‑rich microprocessor with hardware security primitives and a wide operating temperature range, the STM32MP133AAF3 offers a scalable foundation for designs that require connectivity, display capabilities and secure boot/crypto functions.

Request a quote or submit a pricing inquiry to get availability and volume pricing for the STM32MP133AAF3. Our team will respond with a tailored quote for your design and ordering needs.

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