XJ7200GALM
| Part Description |
Dual ARM® Cortex®-A72, Dual ARM® Cortex®-R5F Microprocessor IC - 4 Core, 32-Bit, 64-Bit 2GHz 433-FCBGA (17.2x17.2) |
|---|---|
| Quantity | 312 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Jacinto J7200 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-R5F | Core Processor | Dual ARM® Cortex®-A72, Dual ARM® Cortex®-R5F | Device Package | 433-FCBGA (17.2x17.2) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | Vendor Undefined | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32-Bit, 64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 433-BFBGA, FCBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | 3DES, AES, DRBG TRNG, MD5, PKA, SHA1, SHA2 | ||
| Speed | 2GHz | Supplier Device Package | 433-FCBGA (17.2×17.2) | USB | USB 3.0 (1) | ||
| Voltage – I/O | 1.1V, 1.8V, 3.3V |
Overview of XJ7200GALM – PROTOTYPE
The XJ7200GALM is a microprocessor from Texas Instruments' Jacinto J7200 series featuring a heterogeneous quad-core configuration: dual ARM® Cortex®-A72 and dual ARM® Cortex®-R5F cores. It delivers up to 2 GHz core clocking and integrates high-speed interfaces and hardware security primitives for demanding embedded applications.
Built with LPDDR4 memory controller support, multiple gigabit Ethernet ports and a USB 3.0 interface, the device targets embedded systems that require a balance of high-performance application processing, real-time control, and integrated security features.
Key Features
- Core Architecture Dual ARM® Cortex®-A72 plus dual ARM® Cortex®-R5F cores, providing a 4‑core heterogeneous processing platform combining 64‑bit and 32‑bit execution.
- Performance Up to 2 GHz operating speed for high-throughput application processing.
- Memory Support LPDDR4 memory controller compatibility for high-bandwidth system memory.
- Networking and I/O Two 10/100/1000 Mbps Ethernet interfaces and one USB 3.0 port for high-speed connectivity and peripheral support.
- Security Engine Hardware security features including 3DES, AES, DRBG TRNG, MD5, PKA, SHA1 and SHA2 to support cryptographic and secure boot workflows.
- Package & Mounting Available in a 433‑ball FCBGA package (433‑FCBGA, 17.2×17.2 mm) suitable for surface mount PCB assembly.
- Operating Range Designed for wide temperature operation from −40 °C to 125 °C for thermally demanding environments.
- Environmental Compliance RoHS compliant.
- Additional Interfaces I²C interface for peripheral control and system management.
Typical Applications
- Embedded Systems Used as the primary processing element in embedded platforms that require mixed 64‑bit application processing and 32‑bit real‑time control.
- Industrial Control Suitable for industrial controllers and automation where wide operating temperature range and integrated I/O are important.
- Networked Devices Applied in networked embedded devices leveraging the dual gigabit Ethernet interfaces and USB 3.0 for connectivity and data transfer.
- Secure Processing Deployed in systems that require hardware cryptography and random number generation to protect data and communications.
Unique Advantages
- Heterogeneous Quad‑Core Design: Combines dual Cortex‑A72 and dual Cortex‑R5F cores to separate high‑level application workloads from real‑time tasks.
- High Clock Speed: 2 GHz frequency headroom for compute‑intensive application processing.
- Integrated High‑Speed I/O: Dual gigabit Ethernet and USB 3.0 simplify system architecture for connected embedded designs.
- Robust Security Feature Set: On‑chip AES, 3DES, SHA, PKA and TRNG support secure communications and cryptographic operations without external accelerators.
- Wide Temperature Capability: −40 °C to 125 °C operating range supports deployment in thermally challenging environments.
- Compact FCBGA Package: 433‑ball FCBGA (17.2×17.2 mm) enables high integration density for space‑constrained PCBs.
Why Choose XJ7200GALM?
The XJ7200GALM positions itself as an integrated microprocessor solution for embedded designs that need a mix of high‑performance application processing, deterministic real‑time control and on‑chip security. Its combination of dual Cortex‑A72 and dual Cortex‑R5F cores, LPDDR4 support, multiple Ethernet ports and hardware crypto primitives provides a focused platform for complex embedded systems.
Design teams targeting connected, secure and thermally demanding deployments will find the XJ7200GALM suited to scalable architectures where performance, integrated I/O and cryptographic capabilities are required for long‑term system robustness.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the XJ7200GALM. A sales contact will provide the next steps to procure samples or production quantities.

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