Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ENC424J600-I/ML
ENC424J600-I/MLMicrochip TechnologyIC ETHERNET CTRLR W/SPI 44QFNControllers44-QFN (8x8)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
44-VQFN Exposed Pad
Supplier Device Package:
44-QFN (8×8)
441
ENC424J600-I/PT
ENC424J600-I/PTMicrochip TechnologyIC ETHERNET CTRLR W/SPI 44-TQFPControllers44-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
44-TQFP
Supplier Device Package:
44-TQFP (10×10)
1,781
ENC424J600T-I/ML
ENC424J600T-I/MLMicrochip TechnologyIC ETHERNET CTRLR W/SPI 44QFNControllers44-QFN (8x8)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
44-VQFN Exposed Pad
Supplier Device Package:
44-QFN (8×8)
1,185
ENC424J600T-I/PT
ENC424J600T-I/PTMicrochip TechnologyIC ETHERNET CTRLR W/SPI 44-TQFPControllers44-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
44-TQFP
Supplier Device Package:
44-TQFP (10×10)
33
ENC624J600-I/PT
ENC624J600-I/PTMicrochip TechnologyIC ETHERNET CTRLR W/SPI 64-TQFPControllers64-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
64-TQFP
Supplier Device Package:
64-TQFP (10×10)
221
ENC624J600T-I/PT
ENC624J600T-I/PTMicrochip TechnologyIC ETHERNET CTRLR W/SPI 64-TQFPControllers64-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Controller
Interface:
SPI, Parallel
Standards:
10/100 Base-T PHY
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
96mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
64-TQFP
Supplier Device Package:
64-TQFP (10×10)
266
EP1AGX20CF484C6
EP1AGX20CF484C6IntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,382
EP1AGX20CF484C6N
EP1AGX20CF484C6NIntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,994
EP1AGX20CF484I6
EP1AGX20CF484I6IntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
152
EP1AGX20CF484I6N
EP1AGX20CF484I6NIntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
759
EP1AGX20CF780C6EP1AGX20CF780C6IntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
341
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Qualification:
N/A
Total RAM Bits:
1229184
533
EP1AGX20CF780C6N
EP1AGX20CF780C6NIntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
341
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA
Supplier Device Package:
780-FBGA (29×29)
1,431
EP1AGX20CF780I6
EP1AGX20CF780I6IntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1079
Number of Logic Elements/Cells:
21580
Total RAM Bits:
1229184
Number of I/O:
341
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA
Supplier Device Package:
780-FBGA (29×29)
1,090
EP1AGX35CF484C6
EP1AGX35CF484C6IntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Total RAM Bits:
1348416
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
362
EP1AGX35CF484C6N
EP1AGX35CF484C6NIntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Total RAM Bits:
1348416
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,213
EP1AGX35CF484I6
EP1AGX35CF484I6IntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Total RAM Bits:
1348416
Number of I/O:
230
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
442
EP1AGX35CF484I6NEP1AGX35CF484I6NIntelIC FPGA 230 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
230
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Qualification:
N/A
Total RAM Bits:
1348416
306
EP1AGX35DF780C6
EP1AGX35DF780C6IntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Total RAM Bits:
1348416
Number of I/O:
341
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA
Supplier Device Package:
780-FBGA (29×29)
112
EP1AGX35DF780C6N
EP1AGX35DF780C6NIntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Total RAM Bits:
1348416
Number of I/O:
341
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA
Supplier Device Package:
780-FBGA (29×29)
117
EP1AGX35DF780I6NEP1AGX35DF780I6NIntelIC FPGA 341 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
341
Number of LABs/CLBs:
1676
Number of Logic Elements/Cells:
33520
Qualification:
N/A
Total RAM Bits:
1348416
1,162

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