EP1AGX20CF780I6

The EP1AGX20CF780I6 is an Intel Arria GX FPGA provided in a 780-ball BGA package. It integrates a mid-density logic array with high-speed serial transceivers and a flexible memory architecture, targeting industrial applications that require configurable logic, on-chip memory, and multi-protocol serial interfaces.

Built for systems that demand programmable processing and serial connectivity, this device combines 21,580 logic elements, approximately 1.23 Mbits of embedded memory, and up to 12 high-speed transceiver channels (series capability) to support a range of communications and signal-processing use cases.

Key Features

• Logic Capacity – 21,580 logic elements for implementing custom FPGA logic and control functions.
• On-chip Memory – Approximately 1.23 Mbits of embedded RAM for FIFOs, buffering, and local storage.
• I/O Density – 341 I/O pins to support broad interfacing needs with external devices and peripherals.
• High-Speed Transceivers – Series Arria GX transceiver architecture with multigigabit channels supporting clock-data recovery (CDR) up to 3.125 Gbps and protocol support options including PCI Express, Gigabit Ethernet, SDI, SerialLite II, XAUI, and Serial RapidIO.
• Memory Architecture (TriMatrix) – Multiple RAM block sizes enabling true dual-port memory and FIFO implementations with performance up to series-stated frequencies.
• DSP & Timing Resources – Dedicated high-speed DSP blocks for multiply and multiply-accumulate operations and up to four enhanced PLLs for clock management and phase shifting.
• Clocking – Up to 16 global clock networks and multiple regional clock networks to simplify clock distribution across designs.
• Package & Mounting – 780-BBGA package, supplier device package 780-FBGA (29×29), surface-mount mounting type for standard PCB assembly.
• Power & Operating Range – Core supply range 1.15 V to 1.25 V; industrial operating temperature range −40 °C to 100 °C.
• Environmental – RoHS compliant.

Typical Applications

• High‑speed serial communications – Implement protocol engines and bridging functions using the device’s multigigabit transceivers and CDR support for standards like PCI Express and Gigabit Ethernet.
• Video and broadcast interfaces – Support SDI transport and related video serial links using the integrated transceiver capabilities.
• Networking and interconnect – Build packet processing, aggregation, or interface bridging systems leveraging the device’s logic capacity, embedded memory, and serial protocol support.
• Signal processing and DSP – Deploy DSP blocks and dedicated RAM for FIR filters, multiply‑accumulate tasks, and real‑time data paths.
• Custom serial IP development – Create proprietary serial-based links using the transceiver Basic mode and embedded SERDES circuitry.

Unique Advantages

• Integrated multigigabit connectivity: On-device transceivers with CDR up to 3.125 Gbps reduce external SERDES requirements and simplify high-speed link implementations.
• Balanced logic and memory resources: 21,580 logic elements paired with approximately 1.23 Mbits of RAM support medium-complexity designs requiring local buffering and state storage.
• Robust clocking and DSP support: Multiple PLLs, extensive clock networks, and dedicated DSP blocks accelerate signal-processing development and clock-domain management.
• Industrial temperature range: −40 °C to 100 °C operation enables deployment in demanding environments where extended temperature performance is required.
• High I/O count in compact package: 341 I/Os in a 780-ball BGA (29×29) package provide plentiful external connectivity while keeping board area efficient.
• Standards-oriented feature set: Transceiver and SERDES features target common serial protocols, shortening time to market for communications and video applications.

Why Choose EP1AGX20CF780I6?

The EP1AGX20CF780I6 positions itself as a versatile Arria GX FPGA option for industrial designs that require a combination of moderate logic capacity, on-chip memory, and high-speed serial interfaces. Its integrated transceivers, DSP resources, and comprehensive clocking make it suitable for communications, video, and signal-processing applications where configurable hardware and protocol flexibility are important.

With a surface-mount 780-ball BGA package and RoHS compliance, this device offers a balanced platform for engineers aiming to reduce external components while maintaining the I/O and performance headroom needed for mid-range FPGA implementations.

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