EP1AGX20CF780C6N

IC FPGA 341 I/O 780FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 341 1229184 21580 780-BBGA

Quantity 780 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O341Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1079Number of Logic Elements/Cells21580
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1229184

Overview of EP1AGX20CF780C6N – Arria GX FPGA, 21,580 logic elements, 341 I/O, 780-BBGA

The EP1AGX20CF780C6N is an Arria GX Field Programmable Gate Array (FPGA) from Intel, configured in a 780-ball BGA package. It provides 21,580 logic elements, approximately 1.23 Mbits of embedded RAM, and 341 general-purpose I/O signals in a commercial-grade, surface-mount form factor.

Designed for applications that require dense logic, on-chip memory, and high I/O count, this device is suitable for commercial communications, signal processing and system integration tasks where a low-voltage core (1.15–1.25 V) and standard commercial temperature range (0 °C to 85 °C) are required.

Key Features

  • Logic Capacity  21,580 logic elements provide a substantial programmable fabric for glue logic, control engines, and mid-density processing functions.
  • Embedded Memory  Approximately 1.23 Mbits of on-chip RAM for FIFOs, buffers, and local data storage.
  • High I/O Count  341 I/O pins support broad interfacing to external devices, memory, and high-speed I/O standards.
  • Family-Level Transceiver Support  Arria GX family devices include high-speed serial transceivers with CDR support up to 3.125 Gbps and multi-channel configurations; use this fabric where serial protocol support and SERDES capability are required.
  • Programmable DSP and Clocking Resources  Family architecture provides high-speed DSP blocks and up to four enhanced PLLs for advanced clocking and signal processing tasks.
  • Flexible Memory and I/O Interfaces  TriMatrix block RAM architecture in the family enables true dual-port memories and FIFOs; Arria GX family devices support common external memory interfaces and numerous single-ended and differential I/O standards.
  • Package and Mounting  Surface-mount 780-BBGA package; supplier device package listed as 780-FBGA (29×29).
  • Power and Temperature  Core voltage range 1.15 V to 1.25 V; operating temperature 0 °C to 85 °C (commercial grade).
  • Environmental  RoHS compliant.

Typical Applications

  • High‑speed communications  Implement protocol bridging, SERDES-based links, and packet processing leveraging the Arria GX family transceiver architecture and high I/O count.
  • Video and imaging  Use on-chip RAM and DSP resources for buffering and mid‑pipeline image processing in commercial AV and broadcast equipment.
  • Networking and backplane control  Deploy logic and clocking resources for control-plane functions, aggregation, and interface conversion in networking gear.
  • Embedded system integration  Act as a central programmable glue logic and peripheral interface hub where dense I/O and embedded memory simplify board-level design.

Unique Advantages

  • Substantial logic and memory in a single device: 21,580 logic elements and ~1.23 Mbits of embedded RAM reduce external components and board complexity.
  • High I/O density: 341 I/O pins enable broad interfacing options for peripherals, memory, and high-speed links without multiple FPGAs.
  • Commercial temperature and RoHS compliance: Designed for commercial deployments with standard operating temperature and environmental compliance.
  • Low-voltage core compatibility: 1.15–1.25 V supply range aligns with contemporary system power domains for efficient integration.
  • Proven family architecture: Arria GX family features—such as TriMatrix memory, DSP blocks, enhanced PLLs and high-speed transceivers—provide architectural flexibility for signal processing and serial communications tasks.

Why Choose EP1AGX20CF780C6N?

The EP1AGX20CF780C6N positions itself as a mid- to high‑density programmable solution for commercial applications that require a balance of logic resources, embedded RAM, and a large I/O complement in a compact BGA package. Its Arria GX family architecture brings specialized blocks and transceiver capabilities useful for communications, video processing, and system integration designs.

Choose this device when your design requires integrated memory and DSP resources, extensive I/O, and a commercial temperature and RoHS-compliant offering that fits within a 780-ball BGA footprint.

If you need pricing, availability, or a formal quote for EP1AGX20CF780C6N, request a quote or submit an inquiry to receive sales and ordering information.

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