EP1AGX35DF780C6N
| Part Description |
Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA |
|---|---|
| Quantity | 688 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 341 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1676 | Number of Logic Elements/Cells | 33520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1348416 |
Overview of EP1AGX35DF780C6N – Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA
The EP1AGX35DF780C6N is an Intel Arria GX family FPGA provided in a 780-BBGA surface-mount package. This commercial-grade device integrates a mid-scale logic array with embedded memory and abundant I/O to address communications, signal processing, and high-performance embedded applications.
Built on the Arria GX device architecture, the FPGA combines a 1.2‑V logic array design (device supply range 1.15 V to 1.25 V) with family-level transceiver and memory features to support mainstream serial protocols and demanding data-path implementations while meeting commercial temperature requirements (0 °C to 85 °C).
Key Features
- Logic Capacity — 33,520 logic elements providing the programmable fabric for control, processing, and glue logic.
- Embedded Memory — Approximately 1.35 Mbits of on-chip RAM for FPGA-implemented buffers, FIFOs, and data-path storage.
- I/O Scale — 341 user I/Os to support broad interfacing needs for parallel and serial buses.
- Power and Mounting — Surface-mount device with a specified core supply voltage range of 1.15 V to 1.25 V to match system power domains.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- Package — 780‑BBGA package (supplier device package listed as 780‑FBGA, 29×29) for high pin-count, compact board integration.
- Arria GX Family Transceiver Architecture — Family-level support for high‑speed serial transceivers with clock data recovery (CDR) up to 3.125 Gbps and embedded SERDES circuitry suitable for common serial protocols.
- On-chip System Features (family-level) — TriMatrix memory architecture, dedicated DSP blocks, and enhanced PLLs for clocking, as described in the Arria GX device handbook.
- RoHS Compliant — Meets RoHS environmental compliance for lead-free manufacturing processes.
Typical Applications
- High-speed communications — Use the Arria GX family transceiver architecture and abundant I/O to implement protocol bridging, fiber/serial interfaces, or backplane connectivity.
- Signal processing and DSP — Leverage the device’s logic capacity, embedded memory, and family-level DSP blocks for streaming data filters, FFTs, and real-time processing pipelines.
- Embedded system control — Implement complex control logic, peripheral interfaces, and custom state machines using large programmable fabric and 341 I/Os.
- Memory interface and buffering — On-chip RAM and PLL resources enable implementation of interface FIFOs and memory controllers for external DDR/SDRAM systems (family-level support referenced in device handbook).
Unique Advantages
- Balanced mid-range capacity: 33,520 logic elements provide substantial programmable resources without the footprint or power of larger families, simplifying partitioning for many system designs.
- Integrated memory for data paths: Approximately 1.35 Mbits of embedded RAM reduces external memory requirements for buffering and FIFO implementations.
- High I/O count: 341 user I/Os allow flexible interfacing to peripherals, parallel buses, and board-level routing options.
- Family-level transceiver capability: Arria GX transceiver architecture (CDR up to 3.125 Gbps) enables designs targeting common serial standards and high-speed links.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation, suitable for mainstream electronics and enterprise equipment.
- RoHS compliance: Supports lead‑free manufacturing flows for regulatory and environmental considerations.
Why Choose EP1AGX35DF780C6N?
The EP1AGX35DF780C6N brings a solid mix of programmable logic, on-chip memory, and high I/O density in a 780‑ball BGA package, making it well-suited for communications, signal processing, and embedded control applications that require mid-range FPGA capacity. With Arria GX family architecture elements such as transceiver support, TriMatrix memory, DSP resources, and enhanced PLLs, the device provides a capable platform for developers who need predictable electrical characteristics (1.15–1.25 V supply) and commercial-temperature operation.
This part is aimed at designers seeking a commercial-grade Arria GX implementation with verified family features and a compact high-pin-count package for integration into production systems where on-chip memory, logic density, and extensive I/O are priorities.
Request a quote or submit a product inquiry to obtain pricing, availability, and lifecycle details for EP1AGX35DF780C6N. Our team can assist with lead-time information and ordering support.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018