EP1AGX35DF780C6N

IC FPGA 341 I/O 780FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA

Quantity 688 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O341Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1676Number of Logic Elements/Cells33520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1348416

Overview of EP1AGX35DF780C6N – Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA

The EP1AGX35DF780C6N is an Intel Arria GX family FPGA provided in a 780-BBGA surface-mount package. This commercial-grade device integrates a mid-scale logic array with embedded memory and abundant I/O to address communications, signal processing, and high-performance embedded applications.

Built on the Arria GX device architecture, the FPGA combines a 1.2‑V logic array design (device supply range 1.15 V to 1.25 V) with family-level transceiver and memory features to support mainstream serial protocols and demanding data-path implementations while meeting commercial temperature requirements (0 °C to 85 °C).

Key Features

  • Logic Capacity — 33,520 logic elements providing the programmable fabric for control, processing, and glue logic.
  • Embedded Memory — Approximately 1.35 Mbits of on-chip RAM for FPGA-implemented buffers, FIFOs, and data-path storage.
  • I/O Scale — 341 user I/Os to support broad interfacing needs for parallel and serial buses.
  • Power and Mounting — Surface-mount device with a specified core supply voltage range of 1.15 V to 1.25 V to match system power domains.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Package — 780‑BBGA package (supplier device package listed as 780‑FBGA, 29×29) for high pin-count, compact board integration.
  • Arria GX Family Transceiver Architecture — Family-level support for high‑speed serial transceivers with clock data recovery (CDR) up to 3.125 Gbps and embedded SERDES circuitry suitable for common serial protocols.
  • On-chip System Features (family-level) — TriMatrix memory architecture, dedicated DSP blocks, and enhanced PLLs for clocking, as described in the Arria GX device handbook.
  • RoHS Compliant — Meets RoHS environmental compliance for lead-free manufacturing processes.

Typical Applications

  • High-speed communications — Use the Arria GX family transceiver architecture and abundant I/O to implement protocol bridging, fiber/serial interfaces, or backplane connectivity.
  • Signal processing and DSP — Leverage the device’s logic capacity, embedded memory, and family-level DSP blocks for streaming data filters, FFTs, and real-time processing pipelines.
  • Embedded system control — Implement complex control logic, peripheral interfaces, and custom state machines using large programmable fabric and 341 I/Os.
  • Memory interface and buffering — On-chip RAM and PLL resources enable implementation of interface FIFOs and memory controllers for external DDR/SDRAM systems (family-level support referenced in device handbook).

Unique Advantages

  • Balanced mid-range capacity: 33,520 logic elements provide substantial programmable resources without the footprint or power of larger families, simplifying partitioning for many system designs.
  • Integrated memory for data paths: Approximately 1.35 Mbits of embedded RAM reduces external memory requirements for buffering and FIFO implementations.
  • High I/O count: 341 user I/Os allow flexible interfacing to peripherals, parallel buses, and board-level routing options.
  • Family-level transceiver capability: Arria GX transceiver architecture (CDR up to 3.125 Gbps) enables designs targeting common serial standards and high-speed links.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation, suitable for mainstream electronics and enterprise equipment.
  • RoHS compliance: Supports lead‑free manufacturing flows for regulatory and environmental considerations.

Why Choose EP1AGX35DF780C6N?

The EP1AGX35DF780C6N brings a solid mix of programmable logic, on-chip memory, and high I/O density in a 780‑ball BGA package, making it well-suited for communications, signal processing, and embedded control applications that require mid-range FPGA capacity. With Arria GX family architecture elements such as transceiver support, TriMatrix memory, DSP resources, and enhanced PLLs, the device provides a capable platform for developers who need predictable electrical characteristics (1.15–1.25 V supply) and commercial-temperature operation.

This part is aimed at designers seeking a commercial-grade Arria GX implementation with verified family features and a compact high-pin-count package for integration into production systems where on-chip memory, logic density, and extensive I/O are priorities.

Request a quote or submit a product inquiry to obtain pricing, availability, and lifecycle details for EP1AGX35DF780C6N. Our team can assist with lead-time information and ordering support.

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