EP1AGX35DF780I6N

IC FPGA 341 I/O 780FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA

Quantity 1,935 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGANumber of I/O341Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1676Number of Logic Elements/Cells33520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1348416

Overview of EP1AGX35DF780I6N – Arria GX FPGA, 33,520 Logic Elements, 780-BBGA

The EP1AGX35DF780I6N is an Intel Arria GX field-programmable gate array (FPGA) offered in a 780-ball BGA package for surface-mount applications. It delivers a balance of programmable logic capacity, on-chip RAM, and I/O density suitable for industrial designs that require flexible hardware implementation and system integration.

This device targets designs that need moderate logic resources and substantial I/O connectivity while operating across an industrial temperature range and low-voltage core supply. Its combination of 33,520 logic elements, approximately 1.35 Mbits of embedded memory, and 341 I/O pins supports a wide range of embedded processing, communications, and interface tasks.

Key Features

  • Logic Capacity  33,520 logic elements provide the programmable resources for custom digital logic, control, and signal processing functions.
  • Embedded Memory  Approximately 1.35 Mbits of on-chip RAM to implement FIFOs, buffers, and dual-port memories close to logic for low-latency data handling.
  • I/O Density  341 I/O pins support a variety of external interfaces and parallel or serial connections for sensors, memory, and peripherals.
  • Package & Mounting  780-ball BGA (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact, board-level integration.
  • Power  Core supply support from 1.15 V to 1.25 V to match system power domains and optimize power delivery for the FPGA core.
  • Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments requiring extended temperature tolerance.
  • Arria GX Family Capabilities  Family-level features include high-speed serial transceiver technology, TriMatrix memory architecture, DSP blocks, PLLs, and broad I/O standard support as defined for Arria GX devices.

Typical Applications

  • Network & Serial Protocol Interfaces  Implement protocol bridging, packet buffering, and custom serial interfaces using the device’s logic resources and the Arria GX family’s high-speed transceiver capabilities.
  • Industrial Control & Automation  Use the FPGA for deterministic control, protocol conversion, and local processing in equipment that requires operation across −40 °C to 100 °C.
  • Embedded Acceleration  Offload compute-intensive or latency-sensitive functions (signal processing, custom acceleration blocks) into programmable logic and DSP resources.
  • High-density I/O and Memory Interfaces  Support designs that require many external connections or local buffering with 341 I/O pins and on-chip RAM for memory-mapped logic and FIFOs.

Unique Advantages

  • Balanced Logic and Memory: 33,520 logic elements and ~1.35 Mbits of embedded RAM enable mid-range designs to implement control, buffering, and custom data paths on-chip.
  • High I/O Count: 341 I/O pins reduce the need for external multiplexing, simplifying board design for multi-channel interfaces and peripheral connectivity.
  • Industrial Temperature Rating: Rated −40 °C to 100 °C for deployments in demanding environments where temperature resilience is required.
  • Compact, Board-friendly Package: 780-ball BGA (29×29 FBGA) provides a high-density footprint for space-constrained PCBs while supporting surface-mount assembly.
  • Tight Core Voltage Window: 1.15 V to 1.25 V core supply range supports controlled power delivery and integration with system power rails.

Why Choose EP1AGX35DF780I6N?

The EP1AGX35DF780I6N Arria GX FPGA positions itself as a practical choice for industrial and embedded system designs that require a mid-level mix of logic, memory, and I/O without sacrificing temperature tolerance or packaging density. Its family-level transceiver and architecture features add design flexibility for serial protocols and high-performance interfaces.

This device is suitable for engineers and designers building communications interfaces, embedded accelerators, or multi-channel I/O systems who need a reliable, industrial-grade FPGA platform with clear electrical and thermal specifications.

Request a quote or submit a pricing inquiry to check availability and delivery for EP1AGX35DF780I6N. Include your quantity and application notes to expedite a tailored response.

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