EP1AGX35DF780I6N
| Part Description |
Arria GX Field Programmable Gate Array (FPGA) IC 341 1348416 33520 780-BBGA |
|---|---|
| Quantity | 1,935 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA | Number of I/O | 341 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1676 | Number of Logic Elements/Cells | 33520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1348416 |
Overview of EP1AGX35DF780I6N – Arria GX FPGA, 33,520 Logic Elements, 780-BBGA
The EP1AGX35DF780I6N is an Intel Arria GX field-programmable gate array (FPGA) offered in a 780-ball BGA package for surface-mount applications. It delivers a balance of programmable logic capacity, on-chip RAM, and I/O density suitable for industrial designs that require flexible hardware implementation and system integration.
This device targets designs that need moderate logic resources and substantial I/O connectivity while operating across an industrial temperature range and low-voltage core supply. Its combination of 33,520 logic elements, approximately 1.35 Mbits of embedded memory, and 341 I/O pins supports a wide range of embedded processing, communications, and interface tasks.
Key Features
- Logic Capacity 33,520 logic elements provide the programmable resources for custom digital logic, control, and signal processing functions.
- Embedded Memory Approximately 1.35 Mbits of on-chip RAM to implement FIFOs, buffers, and dual-port memories close to logic for low-latency data handling.
- I/O Density 341 I/O pins support a variety of external interfaces and parallel or serial connections for sensors, memory, and peripherals.
- Package & Mounting 780-ball BGA (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact, board-level integration.
- Power Core supply support from 1.15 V to 1.25 V to match system power domains and optimize power delivery for the FPGA core.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, suitable for industrial environments requiring extended temperature tolerance.
- Arria GX Family Capabilities Family-level features include high-speed serial transceiver technology, TriMatrix memory architecture, DSP blocks, PLLs, and broad I/O standard support as defined for Arria GX devices.
Typical Applications
- Network & Serial Protocol Interfaces Implement protocol bridging, packet buffering, and custom serial interfaces using the device’s logic resources and the Arria GX family’s high-speed transceiver capabilities.
- Industrial Control & Automation Use the FPGA for deterministic control, protocol conversion, and local processing in equipment that requires operation across −40 °C to 100 °C.
- Embedded Acceleration Offload compute-intensive or latency-sensitive functions (signal processing, custom acceleration blocks) into programmable logic and DSP resources.
- High-density I/O and Memory Interfaces Support designs that require many external connections or local buffering with 341 I/O pins and on-chip RAM for memory-mapped logic and FIFOs.
Unique Advantages
- Balanced Logic and Memory: 33,520 logic elements and ~1.35 Mbits of embedded RAM enable mid-range designs to implement control, buffering, and custom data paths on-chip.
- High I/O Count: 341 I/O pins reduce the need for external multiplexing, simplifying board design for multi-channel interfaces and peripheral connectivity.
- Industrial Temperature Rating: Rated −40 °C to 100 °C for deployments in demanding environments where temperature resilience is required.
- Compact, Board-friendly Package: 780-ball BGA (29×29 FBGA) provides a high-density footprint for space-constrained PCBs while supporting surface-mount assembly.
- Tight Core Voltage Window: 1.15 V to 1.25 V core supply range supports controlled power delivery and integration with system power rails.
Why Choose EP1AGX35DF780I6N?
The EP1AGX35DF780I6N Arria GX FPGA positions itself as a practical choice for industrial and embedded system designs that require a mid-level mix of logic, memory, and I/O without sacrificing temperature tolerance or packaging density. Its family-level transceiver and architecture features add design flexibility for serial protocols and high-performance interfaces.
This device is suitable for engineers and designers building communications interfaces, embedded accelerators, or multi-channel I/O systems who need a reliable, industrial-grade FPGA platform with clear electrical and thermal specifications.
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