EP1AGX20CF484C6

IC FPGA 230 I/O 484FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 230 1229184 21580 484-BBGA

Quantity 1,975 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O230Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1079Number of Logic Elements/Cells21580
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1229184

Overview of EP1AGX20CF484C6 – Arria GX FPGA, 21,580 Logic Elements, 230 I/Os, 484‑BBGA

The EP1AGX20CF484C6 is an Arria GX field‑programmable gate array (FPGA) in a 484‑BBGA package designed for commercial applications. Built on the Arria GX device architecture, this device combines a mid‑density logic array with embedded memory and a broad set of I/O to support protocol bridging, high‑speed serial interfaces, and custom logic implementations.

With 21,580 logic elements, approximately 1.23 Mbits of embedded RAM, and 230 programmable I/Os in a surface‑mount 484‑ball BGA, the part targets designers who need flexible, reconfigurable hardware with dense I/O and on‑chip memory within a commercial temperature range.

Key Features

  • Arria GX Architecture Family features include high‑speed serial transceivers and a 1.2‑V logic array architecture, providing a foundation for serial protocol support and custom SERDES IP development.
  • Logic Resources 21,580 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
  • Embedded Memory Approximately 1.23 Mbits of on‑chip RAM (1229184 bits) suitable for FIFOs, buffers, and small shared memory structures.
  • I/O and Packaging 230 programmable I/Os in a 484‑BBGA (484‑FBGA 23×23 supplier package) surface‑mount package for high‑density board integration.
  • Power and Thermal Core supply range 1.15 V to 1.25 V and commercial operating temperature 0 °C to 85 °C for designs targeted at standard commercial environments.
  • Clocking and DSP Architecture includes enhanced PLL support and high‑speed DSP resources (as described for the Arria GX family) for clock management and signal processing tasks.
  • Configuration and Test Arria GX device handbook references configuration options and JTAG boundary‑scan testing capabilities for in‑system programming and board‑level test.
  • RoHS Compliant Device meets RoHS environmental requirements as stated in product data.

Typical Applications

  • High‑speed protocol bridging — Implement PCIe, Gigabit Ethernet, or other serial protocol endpoints and protocol converters using the Arria GX transceiver capabilities described in the device family documentation.
  • Networking and packet processing — Use the FPGA’s logic density, on‑chip RAM, and DSP resources for packet inspection, buffering, and custom forwarding logic.
  • Video and SDI transport — Leverage family support for SDI and related protocols to build video transport, alignment, and buffering functions.
  • Custom SERDES IP and proprietary links — Develop custom serial interfaces or proprietary high‑speed links taking advantage of the Arria GX transceiver architecture.

Unique Advantages

  • Balanced logic and memory mix: 21,580 logic elements paired with approximately 1.23 Mbits of embedded RAM enable compact implementations of control, buffering, and DSP‑adjacent logic.
  • High I/O density: 230 I/O pins in a 484‑BBGA package enable complex board-level connectivity without external I/O expanders.
  • Family‑level high‑speed transceiver support: Arria GX family features include transceivers with CDR and SERDES circuitry for mainstream serial protocols, enabling faster time to market for serial‑link designs.
  • Commercial temperature and surface‑mount packaging: Suited for standard commercial products with surface‑mount assembly in a compact FBGA footprint.
  • Programmable clocking and DSP building blocks: On‑chip PLLs and DSP resources support precise clock management and efficient implementation of signal processing algorithms.

Why Choose EP1AGX20CF484C6?

The EP1AGX20CF484C6 combines a mid‑density logic array with on‑chip memory and a high I/O count in a compact 484‑BBGA package, making it a practical choice for commercial designs that require reconfigurable logic, buffering, and serial protocol handling. Its Arria GX architecture provides the building blocks—transceivers, PLLs, DSP resources, and embedded RAM—needed for networking, video transport, and custom high‑speed link implementations.

Designers seeking a commercially graded, surface‑mount FPGA with verified family features and a measurable resource set will find this device suitable for prototype through volume designs where integration and flexible I/O are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for EP1AGX20CF484C6.

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