Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8378VRALGAMPC8378VRALGANXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
928
MPC8378VRANGMPC8378VRANGNXP SemiconductorsIC MPU MPC83XX 800MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V0°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
155
MPC8378VRANGAMPC8378VRANGANXP SemiconductorsIC MPU MPC83XX 800MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
742
MPC8379CVRALGAMPC8379CVRALGANXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (4)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
531
MPC8379ECVRALGMPC8379ECVRALGNXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)1.8V, 2.5V, 3.3V-40°C – 125°C
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
737
MPC8379ECVRALGAMPC8379ECVRALGANXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC 3.0
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (4)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
964
N/AMPC8379EVRAGDANXP SemiconductorsPOWERQUICC, 32 BIT POWER ARCH SOMicroprocessorsN/AN/AN/A
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Security; SEC 3.0
SATA:
SATA 3Gbps (4)
Qualification:
Consumer
1,424
MPC8379EVRALGAMPC8379EVRALGANXP SemiconductorsIC MPU MPC83XX 667MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC 3.0
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (4)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 125°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
618
MPC8379VRAJFAMPC8379VRAJFANXP SemiconductorsIC MPU MPC83XX 533MHZ PBGA689Microprocessors689-TEPBGA II (31x31)N/A0°C ~ 125°C (TA)
Core Processor:
PowerPC e300c4s
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (4)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
689-BBGA Exposed Pad
Supplier Device Package:
689-TEPBGA II (31×31)
459
MPC850CVR50BUMPC850CVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,364
MPC850CVR66BUMPC850CVR66BUNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,315
MPC850CZQ50BUMPC850CZQ50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
434
MPC850CZQ50BUR2MPC850CZQ50BUR2NXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
903
MPC850DECVR50BUMPC850DECVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
208
MPC850DECVR66BUMPC850DECVR66BUNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,248
MPC850DEVR50BUMPC850DEVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
458
MPC850DEVR66BUMPC850DEVR66BUNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
126
MPC850DEZQ50BUMPC850DEZQ50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,124
MPC850DSLCVR50BUMPC850DSLCVR50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
596
MPC850DSLCZQ50BUMPC850DSLCZQ50BUNXP SemiconductorsIC MPU MPC8XX 50MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
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