 | | MPC8378VRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 928 | |
 | | MPC8378VRANG | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | 0°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 155 | |
 | | MPC8378VRANGA | NXP Semiconductors | IC MPU MPC83XX 800MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 742 | |
 | | MPC8379CVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 531 | |
 | | MPC8379ECVRALG | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | 1.8V, 2.5V, 3.3V | -40°C – 125°C | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 737 | |
 | | MPC8379ECVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | -40°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 964 | |
| N/A | | MPC8379EVRAGDA | NXP Semiconductors | POWERQUICC, 32 BIT POWER ARCH SO | Microprocessors | N/A | N/A | N/A | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Co-Processors/DSP: Security; SEC 3.0 | 1,424 | |
 | | MPC8379EVRALGA | NXP Semiconductors | IC MPU MPC83XX 667MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 618 | |
 | | MPC8379VRAJFA | NXP Semiconductors | IC MPU MPC83XX 533MHZ PBGA689 | Microprocessors | 689-TEPBGA II (31x31) | N/A | 0°C ~ 125°C (TA) | Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (2) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31×31) | 459 | |
 | | MPC850CVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,364 | |
 | | MPC850CVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,315 | |
 | | MPC850CZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 434 | |
 | | MPC850CZQ50BUR2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 903 | |
 | | MPC850DECVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 208 | |
 | | MPC850DECVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,248 | |
 | | MPC850DEVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 458 | |
 | | MPC850DEVR66BU | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 126 | |
 | | MPC850DEZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,124 | |
 | | MPC850DSLCVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 596 | |
 | | MPC850DSLCZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 728 | |