 | | MPC850DSLVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,044 | |
 | | MPC850DSLZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 119 | |
 | | MPC850SRVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 442 | |
 | | MPC850SRVR80BU | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,122 | |
 | | MPC850SRZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 192 | |
 | | MPC850VR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 634 | |
 | | MPC850ZQ50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 317 | |
 | | MPC852TCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,225 | |
 | | MPC852TCVR50A | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 251 | |
 | | MPC852TCVR66A | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 722 | |
 | | MPC852TCVR80A | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,396 | |
 | | MPC852TCZT100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 517 | |
 | | MPC852TCZT50A | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 527 | |
 | | MPC852TCZT66A | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 564 | |
 | | MPC852TVR100 | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,091 | |
 | | MPC852TVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 573 | |
 | | MPC852TVR50A | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 925 | |
 | | MPC852TVR66A | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 931 | |
 | | MPC852TZT100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 478 | |
 | | MPC852TZT50A | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 514 | |