Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
A54SX72A-FGG256IA54SX72A-FGG256IMicrochip TechnologyIC FPGA 203 I/O 256FBGAFPGAs256-FPBGA (17x17)2.25 V - 5.25 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
108000
Number of I/O:
203
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
779
A54SX72A-FGG256MA54SX72A-FGG256MMicrochip TechnologyIC FPGA 203 I/O 256FBGAFPGAs256-FPBGA (17x17)2.25V ~ 5.25V-55°C ~ 125°C (TC)
Number of LABs/CLBs:
6036
Number of I/O:
203
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
256-BGA
Supplier Device Package:
256-FPBGA (17×17)
595
A54SX72A-FGG484A54SX72A-FGG484Microchip TechnologyIC FPGA 360 I/O 484FBGAFPGAs484-FPBGA (27X27)2.25 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
108000
Number of I/O:
360
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
676
A54SX72A-FGG484AA54SX72A-FGG484AMicrochip TechnologyIC FPGA 360 I/O 484FBGAFPGAs484-FPBGA (27X27)2.25 V - 5.25 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
108000
Number of I/O:
360
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
AEC-Q100
409
A54SX72A-FGG484IA54SX72A-FGG484IMicrochip TechnologyIC FPGA 360 I/O 484FBGAFPGAs484-FPBGA (27X27)2.25 V - 5.25 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
108000
Number of I/O:
360
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
385
A54SX72A-FGG484MA54SX72A-FGG484MMicrochip TechnologyIC FPGA 360 I/O 484FBGAFPGAs484-FPBGA (27X27)2.25 V - 5.25 V-55°C – 125°C
Grade:
Military
Number of Gates:
108000
Number of I/O:
360
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
31
A54SX72A-FPQ208A54SX72A-FPQ208Microchip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
108000
Number of I/O:
171
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
565
A54SX72A-FPQG208A54SX72A-FPQG208Microchip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
108000
Number of I/O:
171
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
706
A54SX72A-PQ208A54SX72A-PQ208Microchip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25V ~ 5.25V0°C ~ 70°C (TA)
Number of LABs/CLBs:
6036
Number of I/O:
171
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
827
A54SX72A-PQ208AA54SX72A-PQ208AMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25 V - 5.25 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
108000
Number of I/O:
171
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
AEC-Q100
275
A54SX72A-PQ208IA54SX72A-PQ208IMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25V ~ 5.25V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
6036
Number of I/O:
171
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
670
A54SX72A-PQ208MA54SX72A-PQ208MMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25V ~ 5.25V-55°C ~ 125°C (TC)
Number of LABs/CLBs:
6036
Number of I/O:
171
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,130
A54SX72A-PQG208A54SX72A-PQG208Microchip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25 V - 5.25 V0°C – 70°C
Grade:
Commercial
Number of Gates:
108000
Number of I/O:
171
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
N/A
487
A54SX72A-PQG208AA54SX72A-PQG208AMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25 V - 5.25 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
108000
Number of I/O:
171
Number of LABs/CLBs:
6036
Number of Logic Elements/Cells:
6036
Qualification:
AEC-Q100
329
A54SX72A-PQG208IA54SX72A-PQG208IMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25V ~ 5.25V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
6036
Number of I/O:
171
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
72
A54SX72A-PQG208MA54SX72A-PQG208MMicrochip TechnologyIC FPGA 171 I/O 208QFPFPGAs208-PQFP (28x28)2.25V ~ 5.25V-55°C ~ 125°C (TC)
Number of LABs/CLBs:
6036
Number of I/O:
171
Number of Gates:
108000
Voltage – Supply:
2.25V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
167
A80188A80188IntelIC MPU IAPX86 8MHZ 68PGAMicroprocessors68-PGA (29.46x29.46)N/A0°C ~ 70°C (TA)
Core Processor:
80188
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BPGA
Supplier Device Package:
68-PGA (29.46×29.46)
1,124
A8028610A8028610IntelIC MPU IAPX86 10MHZ 68CPGAMicroprocessors68-CPGAN/A0°C ~ 85°C (TC)
Core Processor:
80286
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
68-CPGA
Supplier Device Package:
68-CPGA
1,133
A8028612A8028612IntelIC MPU IAPX86 12MHZ 68CPGAMicroprocessors68-CPGAN/A0°C ~ 85°C (TC)
Core Processor:
80286
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
68-CPGA
Supplier Device Package:
68-CPGA
624
N/AA80386DXL-25Advanced Micro DevicesIC MPU 25MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
1,327

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