Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AA80386DXL-33Advanced Micro DevicesIC MPU 33MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
67
N/AA80386DXL-40Advanced Micro DevicesIC MPU 40MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
715
N/AA80486DX2DA66IntelIC MPU INTEL486DX 66MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A-55°C ~ 125°C (TC)
Core Processor:
i486
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-55°C ~ 125°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
625
N/AA80486DX2SA66IntelIC MPU INTELDX2 66MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A0°C ~ 85°C (TC)
Core Processor:
EMBEDDED IntelDX2™ PROCESSOR
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Intel 387™
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
Additional Interfaces:
EBI/EMI
1,922
N/AA80860XP-40IntelIC MPU I860 XR 40MHZ 262CPGAMicroprocessors262-CPGA (49.53x49.53)N/A-40°C ~ 125°C (TC)
Core Processor:
i860® XR
Speed:
40MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-40°C ~ 125°C (TC)
Mounting Type:
Through Hole
Package / Case:
262-CPGA
Supplier Device Package:
262-CPGA (49.53×49.53)
30
N/AA80860XP-50IntelRISC MPU, 64-BIT, 50MHZ CPGA262MicroprocessorsN/AN/AN/A

N/A

85
A80960CF40A80960CF40IntelIC MPU I960 40MHZ 168PGAMicroprocessors168-PGAN/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-PGA
Supplier Device Package:
168-PGA
598
A80960HA33SL2GYA80960HA33SL2GYIntelIC MPU I960 33MHZ 168PGAMicroprocessors168-PGAN/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-PGA
Supplier Device Package:
168-PGA
785
N/AA80960HA40IntelIC MPU 40MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
125
N/AA80960HD66IntelIC MPU 66MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
488
N/AA80960HD80IntelIC MPU I960 80MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
399
N/AA80960HT75IntelIC MPU 75MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
3 Core, 32-Bit
Speed:
75MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
812
A80960HT75SL2GPA80960HT75SL2GPIntelIC MPU I960 75MHZ 168CPGAMicroprocessors168-CPGAN/A0°C ~ 85°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-CPGA
Supplier Device Package:
168-CPGA
290
N/AA80960JD50IntelIC MPU I960 50MHZ 132PGAMicroprocessors132-PGA (36.8x36.8)N/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BPGA
Supplier Device Package:
132-PGA (36.8×36.8)
308
N/AA80960JF33IntelIC MPU I960 33MHZ 132CPGAMicroprocessors132-CPGA (36.8x36.8)N/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (36.8×36.8)
441
A80C188XL25A80C188XL25IntelIC MPU I186 25MHZ 68CPGAMicroprocessors68-CPGAN/A0°C ~ 70°C (TA)
Core Processor:
80C186
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
68-BECPGA
Supplier Device Package:
68-CPGA
708
ACE1001EM8ACE1001EM8Fairchild Semiconductor8-BIT, EEPROM, ACE1001 CPU, 1MHZMicrocontrollers8-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
ACE1001
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O:
6
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
EEPROM
EEPROM Size:
64 x 8
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 5.5V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
451
ACE1001EM8XACE1001EM8XFairchild SemiconductorACE1001 - MICROCONTROLLER, 8-BITMicrocontrollersN/AN/AN/A

N/A

435
ACE1001ENACE1001ENFairchild SemiconductorIC MCU 8BIT 1KB EEPROM 8DIPMicrocontrollers8-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
ACE1001
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O:
6
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
EEPROM
EEPROM Size:
64 x 8
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
8-DIP
Package / Case:
8-DIP (0.300″”, 7.62mm)
466
ACE1001MT8XACE1001MT8XFairchild SemiconductorIC MCU 8BIT 1KB EEPROM 8TSSOPMicrocontrollers8-TSSOPN/A0°C ~ 70°C (TA)
Core Processor:
ACE1001
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O:
6
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
EEPROM
EEPROM Size:
64 x 8
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSSOP
Package / Case:
8-TSSOP (0.173″”, 4.40mm Width)
895

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