A54SX72A-FGG256I

The A54SX72A-FGG256I is an SX-A family FPGA offered in a 256-ball fine-pitch BGA package and specified for industrial temperature operation. It provides a nonvolatile, single-chip FPGA implementation with 6,036 logic elements and a system-gate capacity of 108,000, along with 203 user I/O pins for moderate-density designs.

Designed for applications that require configurable, nonvolatile logic in an industrial-grade package, the device combines multi-voltage I/O flexibility, hot-swap compatible I/Os and support for boundary-scan diagnostics to simplify system integration and in-system verification.

Key Features

• Logic Capacity — 6,036 logic elements and 108,000 system gates provide substantial programmable logic for glue logic, control functions and custom interfaces.
• User I/O — 203 user-configurable I/O pins support diverse interface requirements and allow for 100% pin locking as documented for the SX-A family.
• Performance — Family-level performance indicators include up to 250 MHz system performance and up to 350 MHz internal performance as published for SX-A devices.
• Nonvolatile Single-Chip Solution — On-chip nonvolatile configuration removes the need for external configuration ROMs for single-chip, persistent configuration.
• Configurable I/O Voltage Support — I/O support for PCI 3.3 V/5 V, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 allows mixed-voltage interfacing and 5 V input tolerance where required by the family specification.
• Power and Supply Handling — Power-up/power-down friendly design with no required supply sequencing; operating supply range listed as 2.25 V to 5.25 V.
• Security and Test — Actel Secure Programming Technology with FuseLock™ for protection against reverse engineering, plus boundary-scan testing compliant with IEEE 1149.1 (JTAG).
• In-System Diagnostics — Family supports in-system diagnostic and verification capability (Silicon Explorer II referenced for SX-A family diagnostics).
• Package and Mounting — 256-ball fine-pitch BGA (256-FPBGA, 17×17) in a surface-mount package; RoHS compliant packaging available (G lead-free option noted in family ordering).
• Industrial Temperature Grade — Specified operating temperature range: −40 °C to +85 °C.

Typical Applications

• PCI and Bus Interface Logic — I/O support and family-level 66 MHz PCI compliance make the device suitable for implementing PCI bus interface glue logic and custom peripherals.
• Industrial Control — Industrial temperature rating and flexible I/O voltages support sensor interfacing, motor-control logic and general-purpose automation tasks.
• Hot-Swap and Field-Replaceable Modules — Hot-swap compatible I/Os and power-up/power-down friendly behavior enable deployment in systems requiring live insertion or serviceability.
• Secure Embedded Logic — Nonvolatile configuration with FuseLock™ supports designs where IP protection and persistent configuration are required.

Unique Advantages

• Nonvolatile, single-chip configuration: Eliminates the need for external configuration memory, simplifying board design and improving system reliability.
• Flexible I/O voltage support: Enables mixed-voltage interfaces (including PCI voltage levels and 5 V tolerance) to reduce level-shifting components in the BOM.
• Industrial temperature rating: Qualified for −40 °C to +85 °C operation, appropriate for a wide range of industrial and embedded deployments.
• In-system test and security: Boundary-scan (IEEE 1149.1) support and Actel FuseLock™ technology provide both testability and IP protection during product lifecycle.
• Deterministic timing and diagnostics: Family-documented deterministic timing and in-system diagnostic features aid debugging and predictable system behavior.
• RoHS-compliant packaging: Available in lead-free packaging options to meet environmental and manufacturing requirements.

Why Choose A54SX72A-FGG256I?

The A54SX72A-FGG256I positions itself as a robust, nonvolatile FPGA option for industrial designs that require medium-density logic, multi-voltage I/O flexibility and industry-proven test and security features. Its 6,036 logic elements, 203 I/Os and family-level performance characteristics deliver a balance of capacity and I/O capability for control logic, interface bridging and secure embedded functions.

With industrial temperature rating, surface-mount 256-FPBGA packaging and RoHS-compliant options, the device is aimed at engineering teams seeking a compact, single-chip programmable solution that simplifies board-level design, supports in-system diagnostics and addresses IP protection concerns.

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