A54SX72A-FGG256
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA |
|---|---|
| Quantity | 275 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 203 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6036 | Number of Logic Elements/Cells | 6036 | ||
| Number of Gates | 108000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX72A-FGG256 – SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA
The A54SX72A-FGG256 is an SX-A family FPGA from Microchip Technology provided in a 256-pin fine-pitch BGA package. It integrates 6,036 logic elements (logic cells) and approximately 108,000 system gates with up to 203 user-programmable I/O pins, delivering a nonvolatile, single-chip programmable logic solution for mixed-voltage embedded designs.
Designed for commercial applications, the device supports flexible I/O standards, configurable I/O behavior, and features for in-system diagnostics and boundary-scan testing, making it well suited for mixed-signal interfaces, board-level control, and embedded host interface functions that require compact, reprogrammable logic.
Key Features
- Core & Capacity — 6,036 logic elements (logic cells) and approximately 108,000 system gates provide a substantial logic resource for mid-density designs.
- I/O & Interface Flexibility — 203 user I/Os with configurable I/O support for multiple standards and selectable weak pull-up or pull-down on power-up to simplify mixed-voltage interfacing.
- Performance — Family-level performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance (SX-A family datasheet), supporting responsive logic and interface timing.
- Power & Voltage — Supports a voltage supply range of 2.25 V to 5.25 V and mixed 2.5 V / 3.3 V / 5 V operation per family configuration options, enabling flexible system power integration.
- Package & Mounting — 256-pin fine-pitch BGA (256-FPBGA, 17×17) in a surface-mount package for dense board layouts and reliable soldered connections.
- Nonvolatile Configuration & Security — Single-chip, nonvolatile configuration with family-level secure programming technology (FuseLock™) to protect design IP and prevent reverse engineering.
- System Test & Diagnostics — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and unique in-system diagnostic and verification capability (Silicon Explorer II support noted at the family level) to aid manufacturing and field diagnostics.
- Commercial Temperature Grade — Rated for 0 °C to 70 °C operation, matching commercial application environments.
- Regulatory — RoHS compliant, supporting lead-free assembly processes and regulatory requirements.
Typical Applications
- PCI and host-interface subsystems — Family-level PCI compliance and flexible I/O make the device suitable for PCI-compliant board functions and host interface logic.
- Mixed-voltage interface bridging — Configurable I/O standards and wide supply range enable bridging between 2.5 V, 3.3 V and 5 V domains on a single chip.
- Board-level control and glue logic — Mid-density logic capacity and abundant user I/Os are suited to control, sequencing, and glue-logic roles on complex PCBs.
- Manufacturing test and diagnostics — Boundary-scan (JTAG) support and in-system diagnostic features help streamline production test and field verification.
Unique Advantages
- High logic density in a compact package: 6,036 logic elements and ~108,000 system gates in a 256-FPBGA (17×17) enable substantial integration while minimizing board area.
- Flexible I/O and mixed-voltage operation: Configurable I/O standards and a 2.25 V–5.25 V supply range simplify interfacing across different voltage domains without external level shifters.
- Nonvolatile, single-chip solution: On-chip nonvolatile configuration removes the need for external configuration memory, reducing BOM and system complexity.
- Production and field diagnostics: Boundary-scan (IEEE 1149.1) and family-level in-system diagnostic tools improve test coverage and accelerate fault isolation.
- IP protection: Family secure programming technology (FuseLock™) provides a mechanism to protect design intellectual property against reverse engineering.
- RoHS compliant package: Supports lead-free manufacturing processes for regulatory and assembly requirements.
Why Choose A54SX72A-FGG256?
The A54SX72A-FGG256 positions itself as a versatile, mid-density FPGA for commercial embedded systems that require a balance of logic capacity, flexible I/O, and single-chip nonvolatile configuration. Its combination of ~108,000 system gates, 6,036 logic elements, and 203 user I/Os in a 256-FPBGA package offers designers the ability to consolidate glue logic, interface conversion, and control functions into a single programmable device.
This device is well suited for engineers seeking scalable, reprogrammable logic with family-level features for secure programming, production testability, and mixed-voltage interfacing. The commercial temperature rating and RoHS-compliant packaging support typical board-level and system integration requirements in commercial product lines.
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