A54SX72A-FGG256

IC FPGA 203 I/O 256FBGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

Quantity 275 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O203Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6036Number of Logic Elements/Cells6036
Number of Gates108000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX72A-FGG256 – SX-A Field Programmable Gate Array (FPGA) IC 203 256-BGA

The A54SX72A-FGG256 is an SX-A family FPGA from Microchip Technology provided in a 256-pin fine-pitch BGA package. It integrates 6,036 logic elements (logic cells) and approximately 108,000 system gates with up to 203 user-programmable I/O pins, delivering a nonvolatile, single-chip programmable logic solution for mixed-voltage embedded designs.

Designed for commercial applications, the device supports flexible I/O standards, configurable I/O behavior, and features for in-system diagnostics and boundary-scan testing, making it well suited for mixed-signal interfaces, board-level control, and embedded host interface functions that require compact, reprogrammable logic.

Key Features

  • Core & Capacity — 6,036 logic elements (logic cells) and approximately 108,000 system gates provide a substantial logic resource for mid-density designs.
  • I/O & Interface Flexibility — 203 user I/Os with configurable I/O support for multiple standards and selectable weak pull-up or pull-down on power-up to simplify mixed-voltage interfacing.
  • Performance — Family-level performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance (SX-A family datasheet), supporting responsive logic and interface timing.
  • Power & Voltage — Supports a voltage supply range of 2.25 V to 5.25 V and mixed 2.5 V / 3.3 V / 5 V operation per family configuration options, enabling flexible system power integration.
  • Package & Mounting — 256-pin fine-pitch BGA (256-FPBGA, 17×17) in a surface-mount package for dense board layouts and reliable soldered connections.
  • Nonvolatile Configuration & Security — Single-chip, nonvolatile configuration with family-level secure programming technology (FuseLock™) to protect design IP and prevent reverse engineering.
  • System Test & Diagnostics — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and unique in-system diagnostic and verification capability (Silicon Explorer II support noted at the family level) to aid manufacturing and field diagnostics.
  • Commercial Temperature Grade — Rated for 0 °C to 70 °C operation, matching commercial application environments.
  • Regulatory — RoHS compliant, supporting lead-free assembly processes and regulatory requirements.

Typical Applications

  • PCI and host-interface subsystems — Family-level PCI compliance and flexible I/O make the device suitable for PCI-compliant board functions and host interface logic.
  • Mixed-voltage interface bridging — Configurable I/O standards and wide supply range enable bridging between 2.5 V, 3.3 V and 5 V domains on a single chip.
  • Board-level control and glue logic — Mid-density logic capacity and abundant user I/Os are suited to control, sequencing, and glue-logic roles on complex PCBs.
  • Manufacturing test and diagnostics — Boundary-scan (JTAG) support and in-system diagnostic features help streamline production test and field verification.

Unique Advantages

  • High logic density in a compact package: 6,036 logic elements and ~108,000 system gates in a 256-FPBGA (17×17) enable substantial integration while minimizing board area.
  • Flexible I/O and mixed-voltage operation: Configurable I/O standards and a 2.25 V–5.25 V supply range simplify interfacing across different voltage domains without external level shifters.
  • Nonvolatile, single-chip solution: On-chip nonvolatile configuration removes the need for external configuration memory, reducing BOM and system complexity.
  • Production and field diagnostics: Boundary-scan (IEEE 1149.1) and family-level in-system diagnostic tools improve test coverage and accelerate fault isolation.
  • IP protection: Family secure programming technology (FuseLock™) provides a mechanism to protect design intellectual property against reverse engineering.
  • RoHS compliant package: Supports lead-free manufacturing processes for regulatory and assembly requirements.

Why Choose A54SX72A-FGG256?

The A54SX72A-FGG256 positions itself as a versatile, mid-density FPGA for commercial embedded systems that require a balance of logic capacity, flexible I/O, and single-chip nonvolatile configuration. Its combination of ~108,000 system gates, 6,036 logic elements, and 203 user I/Os in a 256-FPBGA package offers designers the ability to consolidate glue logic, interface conversion, and control functions into a single programmable device.

This device is well suited for engineers seeking scalable, reprogrammable logic with family-level features for secure programming, production testability, and mixed-voltage interfacing. The commercial temperature rating and RoHS-compliant packaging support typical board-level and system integration requirements in commercial product lines.

Request a quote or submit an inquiry for pricing and availability for the A54SX72A-FGG256. Our team can provide lead-time and volume pricing information to support your design schedule.

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