A54SX72A-FGG256A

The A54SX72A-FGG256A is an automotive-grade, nonvolatile SX-A family FPGA from Microchip Technology designed for vehicle electronics and other embedded systems that require programmable logic with wide operating conditions. It delivers up to 108,000 system gates and approximately 6,036 logic elements in a 256-ball BGA package with 203 user-programmable I/O pins, supporting flexible interfacing and deterministic timing.

Built for robustness and in-system flexibility, this device combines hot-swap compatible I/Os, configurable I/O voltage support, and proven diagnostic and security features to simplify system integration in temperature-demanding environments.

Key Features

• Core & Capacity — Up to 108,000 system gates and approximately 6,036 logic elements with up to 2,012 dedicated flip-flops for implementing complex control and interface logic.
• I/O Density & Configurability — 203 user-programmable I/O pins; configurable I/O support for 3.3V PCI, 3.3V LVTTL and 2.5V LVCMOS2, with individual output slew-rate control and configurable weak pull-up/pull-down at power-up.
• Performance & Timing — Internal performance up to 250 MHz and deterministic, user-controllable timing for predictable synchronous designs. PCI-compatible operation at 66 MHz is supported.
• Nonvolatile & Power Behavior — Nonvolatile single-chip solution with power-up/down friendly behavior that does not require supply sequencing, simplifying power system design.
• Security & Diagnostics — Secure programming technology with FuseLock™ to protect design IP and unique in-system diagnostic and verification capability via Silicon Explorer II. Boundary-scan testing compliant with IEEE 1149.1 (JTAG) is supported for production and field diagnostics.
• Automotive Qualification & Environmental Range — Automotive grade with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C. RoHS-compliant packaging and surface-mount 256-FPBGA (17×17) package.
• Supply & Mounting — Wide supply voltage range from 2.25 V to 5.25 V and surface-mount packaging for PCB assembly in automotive and embedded platforms.

Typical Applications

• Automotive control systems — Programmable logic for vehicle subsystems where automotive-grade qualification (AEC-Q100) and extended temperature operation are required.
• High-density I/O interfacing — Integrates multiple interfaces and signal-level support within a single device using its 203 programmable I/Os and configurable I/O standards.
• Production test and field diagnostics — Boundary-scan (IEEE 1149.1) and Silicon Explorer II enable thorough in-system verification and diagnostics during manufacturing and service.

Unique Advantages

• Highly configurable I/O — Multiple voltage standards and per-pin features simplify system integration and reduce external level-shifting components.
• Deterministic timing — User-controllable timing and high internal performance support reliable synchronous designs where timing predictability matters.
• Automotive-ready reliability — AEC-Q100 qualification and a −40°C to 125°C operating range support deployment in temperature-challenging vehicle environments.
• Nonvolatile, single-chip solution — Eliminates the need for external configuration memory and simplifies board-level design and BOM.
• Security and manufacturing support — Built-in secure programming (FuseLock™) and IEEE 1149.1 boundary-scan support help protect IP and streamline production test flows.

Why Choose A54SX72A-FGG256A?

The A54SX72A-FGG256A positions itself as a robust, automotive-grade FPGA option for designers who need high gate capacity, substantial I/O count, and deterministic performance in a nonvolatile single-chip solution. Its AEC-Q100 qualification, wide supply range, and extended temperature rating make it suitable for demanding embedded applications where reliability and in-system diagnostic capability are essential.

This device is well suited to teams designing vehicle electronics and other embedded systems that require flexible I/O standards, secure programming, and streamlined production testing. The combination of high logic capacity, configurable I/Os, and power-friendly behavior provides a scalable foundation for long-lived, ruggedized designs.

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