Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
APA750-FGG896I
APA750-FGG896IMicrochip TechnologyIC FPGA 562 I/O 896FBGAFPGAs896-FBGA (31x31)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Total RAM Bits:
147456
Number of I/O:
562
Number of Gates:
750000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
1,913
APA750-PQ208
APA750-PQ208Microchip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
147456
Number of I/O:
158
Number of Gates:
750000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
716
APA750-PQ208AAPA750-PQ208AMicrochip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.375 V - 2.625 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
750000
Number of I/O:
158
Number of LABs/CLBs:
32768
Number of Logic Elements/Cells:
32768
Qualification:
AEC-Q100
Total RAM Bits:
147456
462
APA750-PQ208IAPA750-PQ208IMicrochip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.3 V - 2.7 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
750000
Number of I/O:
158
Number of LABs/CLBs:
32768
Number of Logic Elements/Cells:
32768
Qualification:
N/A
Total RAM Bits:
147456
582
APA750-PQG208
APA750-PQG208Microchip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
147456
Number of I/O:
158
Number of Gates:
750000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
784
APA750-PQG208A
APA750-PQG208AMicrochip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.375V ~ 2.625V-40°C ~ 125°C (TJ)
Total RAM Bits:
147456
Number of I/O:
158
Number of Gates:
750000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,099
APA750-PQG208I
APA750-PQG208IMicrochip TechnologyIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Total RAM Bits:
147456
Number of I/O:
158
Number of Gates:
750000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
513
N/AN/AAR8035-AL1A-1QualcommAR8035-AL1A-1.Drivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V0°C ~ 70°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
531
N/AN/AAR8035-AL1A-R-1QualcommAR8035-AL1A-R-1.Drivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V0°C ~ 70°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
467
N/AN/AAR8035-AL1A-SR-1QualcommAR8035-AL1A-SR-1.Drivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V0°C ~ 70°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
876
N/AN/AAR8035-AL1B-1QualcommLinear ICDrivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
789
N/AN/AAR8035-AL1B-R-1QualcommAR8035-AL1B-R-1.Drivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
915
N/AN/AAR8035-AL1B-SR-1QualcommAR8035-AL1B-SR-1.Drivers, Receivers, Transceivers40-QFN (5x5)1.04V ~ 1.17V, 3.14V ~ 3.47V-40°C ~ 85°C (TA)
Type:
Transceiver
Protocol:
Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full, Half
Data Rate:
10Mbps, 100Mbps, 1Gbps
Voltage – Supply:
1.04V ~ 1.17V, 3.14V ~ 3.47V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
40-WFQFN Exposed Pad
Supplier Device Package:
40-QFN (5×5)
938
AS11P2TLRQN/AAS11P2TLRQSTMicroelectronicsIC SWITCH SPDT X 1 1.2OHM 6DFNAnalog Switches, Multiplexers, Demultiplexers6-DFN (1.2x1.0)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
1
On-State Resistance (Max):
1.2Ohm
Channel-to-Channel Matching (ΔRon):
50mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.5V
Switch Time (Ton, Toff) (Max):
28ns, 21ns
-3db Bandwidth:
150MHz
Charge Injection:
33pC
Channel Capacitance (CS(off), CD(off)):
25pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-80dB @ 100kHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-UFDFN
Supplier Device Package:
6-DFN (1.2×1.0)
787
AS21P2THBQ
AS21P2THBQSTMicroelectronicsIC SWITCH SPDT X 2 7OHM 10QFNAnalog Switches, Multiplexers, Demultiplexers10-QFN (1.8x1.4)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
7Ohm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
15ns, 13ns
-3db Bandwidth:
800MHz
Charge Injection:
6.4pC
Channel Capacitance (CS(off), CD(off)):
2pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-78dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFQFN
Supplier Device Package:
10-QFN (1.8×1.4)
1,281
AS21P2TLRQ
AS21P2TLRQSTMicroelectronicsIC SWITCH SPDT X 2 500MOHM 10QFNAnalog Switches, Multiplexers, Demultiplexers10-QFN (1.8x1.4)N/A-40°C ~ 85°C (TA)
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
500mOhm
Channel-to-Channel Matching (ΔRon):
100mOhm
Voltage – Supply, Single (V+):
1.65V ~ 4.3V
Switch Time (Ton, Toff) (Max):
65ns, 40ns
-3db Bandwidth:
55MHz
Charge Injection:
49pC
Channel Capacitance (CS(off), CD(off)):
5pF
Current – Leakage (IS(off)) (Max):
20nA
Crosstalk:
-72dB @ 100kHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
10-UFQFN
Supplier Device Package:
10-QFN (1.8×1.4)
1,146
AS4C16M16D1-5BCNAS4C16M16D1-5BCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
764
AS4C16M16D1-5BCNTRAS4C16M16D1-5BCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V0°C ~ 70°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
1,532
AS4C16M16D1-5BINAS4C16M16D1-5BINAlliance Memory, Inc.IC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
893
AS4C16M16D1-5BINTRAS4C16M16D1-5BINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 60TFBGAMemory60-TFBGA (8x13)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Access Time:
700 ps
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
16M x 16
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
60-TFBGA
Qualification:
N/A
Technology:
SDRAM - DDR
Write Cycle Time Word Page:
15 ns
875

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