 | | APA750-FGG896I | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.3V ~ 2.7V | -40°C ~ 85°C (TA) | Voltage – Supply: 2.3V ~ 2.7V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 896-FBGA (31×31) | 1,913 | |
 | | APA750-PQ208 | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Voltage – Supply: 2.3V ~ 2.7V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 208-PQFP (28×28) | 716 | |
 | | APA750-PQ208A | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 125°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 462 | |
 | | APA750-PQ208I | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 582 | |
 | | APA750-PQG208 | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Voltage – Supply: 2.3V ~ 2.7V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 208-PQFP (28×28) | 784 | |
 | | APA750-PQG208A | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375V ~ 2.625V | -40°C ~ 125°C (TJ) | Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Supplier Device Package: 208-PQFP (28×28) | 1,099 | |
 | | APA750-PQG208I | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3V ~ 2.7V | -40°C ~ 85°C (TA) | Voltage – Supply: 2.3V ~ 2.7V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 208-PQFP (28×28) | 513 | |
| N/A | N/A | AR8035-AL1A-1 | Qualcomm | AR8035-AL1A-1. | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | 0°C ~ 70°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 531 | |
| N/A | N/A | AR8035-AL1A-R-1 | Qualcomm | AR8035-AL1A-R-1. | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | 0°C ~ 70°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 467 | |
| N/A | N/A | AR8035-AL1A-SR-1 | Qualcomm | AR8035-AL1A-SR-1. | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | 0°C ~ 70°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 876 | |
| N/A | N/A | AR8035-AL1B-1 | Qualcomm | Linear IC | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | -40°C ~ 85°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 789 | |
| N/A | N/A | AR8035-AL1B-R-1 | Qualcomm | AR8035-AL1B-R-1. | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | -40°C ~ 85°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 915 | |
| N/A | N/A | AR8035-AL1B-SR-1 | Qualcomm | AR8035-AL1B-SR-1. | Drivers, Receivers, Transceivers | 40-QFN (5x5) | 1.04V ~ 1.17V, 3.14V ~ 3.47V | -40°C ~ 85°C (TA) | Number of Drivers/Receivers: 1/1 Data Rate: 10Mbps, 100Mbps, 1Gbps Voltage – Supply: 1.04V ~ 1.17V, 3.14V ~ 3.47V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 40-WFQFN Exposed Pad Supplier Device Package: 40-QFN (5×5) | 938 | |
 | N/A | AS11P2TLRQ | STMicroelectronics | IC SWITCH SPDT X 1 1.2OHM 6DFN | Analog Switches, Multiplexers, Demultiplexers | 6-DFN (1.2x1.0) | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 2:1 On-State Resistance (Max): 1.2Ohm Channel-to-Channel Matching (ΔRon): 50mOhm Voltage – Supply, Single (V+): 1.65V ~ 4.5V Switch Time (Ton, Toff) (Max): 28ns, 21ns Channel Capacitance (CS(off), CD(off)): 25pF Current – Leakage (IS(off)) (Max): 20nA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 6-DFN (1.2×1.0) | 787 | |
 | | AS21P2THBQ | STMicroelectronics | IC SWITCH SPDT X 2 7OHM 10QFN | Analog Switches, Multiplexers, Demultiplexers | 10-QFN (1.8x1.4) | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 2:1 On-State Resistance (Max): 7Ohm Channel-to-Channel Matching (ΔRon): 100mOhm Voltage – Supply, Single (V+): 1.65V ~ 4.3V Switch Time (Ton, Toff) (Max): 15ns, 13ns Channel Capacitance (CS(off), CD(off)): 2pF Current – Leakage (IS(off)) (Max): 20nA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 10-QFN (1.8×1.4) | 1,281 | |
 | | AS21P2TLRQ | STMicroelectronics | IC SWITCH SPDT X 2 500MOHM 10QFN | Analog Switches, Multiplexers, Demultiplexers | 10-QFN (1.8x1.4) | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 2:1 On-State Resistance (Max): 500mOhm Channel-to-Channel Matching (ΔRon): 100mOhm Voltage – Supply, Single (V+): 1.65V ~ 4.3V Switch Time (Ton, Toff) (Max): 65ns, 40ns Channel Capacitance (CS(off), CD(off)): 5pF Current – Leakage (IS(off)) (Max): 20nA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 10-QFN (1.8×1.4) | 1,146 | |
 | | AS4C16M16D1-5BCN | Alliance Memory, Inc. | IC DRAM 256MBIT PAR 60TFBGA | Memory | 60-TFBGA (8x13) | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 16M x 16 Write Cycle Time Word Page: 15 ns | 764 | |
 | | AS4C16M16D1-5BCNTR | Alliance Memory, Inc. | IC DRAM 256MBIT PAR 60TFBGA | Memory | 60-TFBGA (8x13) | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Memory Interface: Parallel Memory Organization: 16M x 16 Write Cycle Time Word Page: 15 ns | 1,532 | |
 | | AS4C16M16D1-5BIN | Alliance Memory, Inc. | IC DRAM 256MBIT PAR 60TFBGA | Memory | 60-TFBGA (8x13) | 2.3V ~ 2.7V | -40°C ~ 85°C (TA) | Memory Interface: Parallel Memory Organization: 16M x 16 Write Cycle Time Word Page: 15 ns | 893 | |
 | | AS4C16M16D1-5BINTR | Alliance Memory, Inc. | IC DRAM 256MBIT PAR 60TFBGA | Memory | 60-TFBGA (8x13) | 2.3V ~ 2.7V | -40°C ~ 85°C (TA) | Memory Interface: Parallel Memory Organization: 16M x 16 Write Cycle Time Word Page: 15 ns | 875 | |