Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
APA600-BGG456M
APA600-BGG456MMicrochip TechnologyIC FPGA 356 I/O 456BGAFPGAs456-PBGA (35x35)2.3V ~ 2.7V-55°C ~ 125°C (TC)
Total RAM Bits:
129024
Number of I/O:
356
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
456-BBGA
Supplier Device Package:
456-PBGA (35×35)
397
APA600-CGS624B
APA600-CGS624BMicrochip TechnologyIC FPGA 440 I/O 624CCGAFPGAs624-CCGA (32.5x32.5)2.3V ~ 2.7V-55°C ~ 125°C (TJ)
Total RAM Bits:
129024
Number of I/O:
440
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Through Hole
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
624-BCCGA
Supplier Device Package:
624-CCGA (32.5×32.5)
251
APA600-CGS624MN/AAPA600-CGS624MMicrochip TechnologyIC FPGA 440 I/O 624CCGAFPGAs624-CCGA (32.5x32.5)2.3 V - 2.7 V-55°C – 125°C
Grade:
Military
Number of Gates:
600000
Number of I/O:
440
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
MIL-STD-883
Total RAM Bits:
129024
639
APA600-CQ208B
APA600-CQ208BMicrochip TechnologyIC FPGA 158 I/O 208CQFPFPGAs208-CQFP (75x75)2.3V ~ 2.7V-55°C ~ 125°C (TJ)
Total RAM Bits:
129024
Number of I/O:
158
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
208-BFCQFP with Tie Bar
Supplier Device Package:
208-CQFP (75×75)
95
APA600-CQ208M
APA600-CQ208MMicrochip TechnologyIC FPGA 158 I/O 208CQFPFPGAs208-CQFP (75x75)2.3V ~ 2.7V-55°C ~ 125°C (TC)
Total RAM Bits:
129024
Number of I/O:
158
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
208-BFCQFP with Tie Bar
Supplier Device Package:
208-CQFP (75×75)
759
APA600-FG256APA600-FG256Microchip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3 V - 2.7 V0°C – 70°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
186
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
N/A
Total RAM Bits:
129024
486
APA600-FG256AAPA600-FG256AMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.375 V - 2.625 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
600000
Number of I/O:
186
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
AEC-Q100
Total RAM Bits:
129024
612
APA600-FG256I
APA600-FG256IMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Total RAM Bits:
129024
Number of I/O:
186
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
702
APA600-FG256M
APA600-FG256MMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3V ~ 2.7V-55°C ~ 125°C (TC)
Total RAM Bits:
129024
Number of I/O:
186
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
758
APA600-FG484
APA600-FG484Microchip TechnologyIC FPGA 370 I/O 484FBGAFPGAs484-FPBGA (23x23)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
129024
Number of I/O:
370
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
138
APA600-FG484AAPA600-FG484AMicrochip TechnologyIC FPGA 370 I/O 484FBGAFPGAs484-FPBGA (23x23)2.375 V - 2.625 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
600000
Number of I/O:
370
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
AEC-Q100
Total RAM Bits:
129024
541
APA600-FG484I
APA600-FG484IMicrochip TechnologyIC FPGA 370 I/O 484FBGAFPGAs484-FPBGA (23x23)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Total RAM Bits:
129024
Number of I/O:
370
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
388
APA600-FG676
APA600-FG676Microchip TechnologyIC FPGA 454 I/O 676FBGAFPGAs676-FBGA (27x27)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
129024
Number of I/O:
454
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
372
APA600-FG676I
APA600-FG676IMicrochip TechnologyIC FPGA 454 I/O 676FBGAFPGAs676-FBGA (27x27)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Total RAM Bits:
129024
Number of I/O:
454
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,023
APA600-FGG256
APA600-FGG256Microchip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
129024
Number of I/O:
186
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
503
APA600-FGG256A
APA600-FGG256AMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.375V ~ 2.625V-40°C ~ 125°C (TJ)
Total RAM Bits:
129024
Number of I/O:
186
Number of Gates:
600000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
1,944
APA600-FGG256IAPA600-FGG256IMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3 V - 2.7 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
600000
Number of I/O:
186
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
N/A
Total RAM Bits:
129024
47
APA600-FGG256M
APA600-FGG256MMicrochip TechnologyIC FPGA 186 I/O 256FBGAFPGAs256-FPBGA (17x17)2.3V ~ 2.7V-55°C ~ 125°C (TC)
Total RAM Bits:
129024
Number of I/O:
186
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TC)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
832
APA600-FGG484
APA600-FGG484Microchip TechnologyIC FPGA 370 I/O 484FBGAFPGAs484-FPBGA (23x23)2.3V ~ 2.7V0°C ~ 70°C (TA)
Total RAM Bits:
129024
Number of I/O:
370
Number of Gates:
600000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
576
APA600-FGG484AAPA600-FGG484AMicrochip TechnologyIC FPGA 370 I/O 484FBGAFPGAs484-FPBGA (23x23)2.375 V - 2.625 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
600000
Number of I/O:
370
Number of LABs/CLBs:
21504
Number of Logic Elements/Cells:
21504
Qualification:
AEC-Q100
Total RAM Bits:
129024
294

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