APA600-BGG456M

The APA600-BGG456M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for military-grade, high-reliability embedded applications. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex control, signal processing, and interface functions.

Key characteristics include 21,504 logic elements, approximately 0.129 Mbits of embedded memory, 356 I/O pins, MIL‑STD‑883 qualification, and a wide operating temperature range of −55 °C to 125 °C, making it suitable for systems that require proven ruggedness and deterministic, reconfigurable logic.

Key Features

• Core Logic  21,504 logic elements (cells) and approximately 600,000 gates provide substantial programmable resources for custom digital logic and state machines.
• Embedded Memory  Total on-chip RAM of 129,024 bits (approximately 0.129 Mbits) to support buffering, FIFOs, and small data stores within the FPGA fabric.
• I/O Capacity  356 user I/O pins to accommodate high-density interfacing with peripherals, sensors, and external devices.
• Power  Operates from a 2.3 V to 2.7 V supply range for core power compatibility with system power rails.
• Package and Mounting  Available in a 456-BBGA package; supplier device package listed as 456-PBGA (35×35). Surface-mount mounting type supports compact PCB integration.
• Temperature and Qualification  Military-grade device with MIL‑STD‑883 qualification and an operating temperature range of −55 °C to 125 °C for high-reliability environments.
• Environmental Compliance  RoHS compliant for environmental and manufacturing process considerations.

Typical Applications

• Military and Aerospace Systems  Use in mission-critical modules that require MIL‑STD‑883 qualification and wide temperature operation for rugged deployments.
• High-Density I/O Interfaces  Ideal for protocol bridging, interface consolidation, and custom I/O handling where 356 I/O pins simplify board-level design.
• Embedded Control and Signal Processing  Suitable for real-time control, custom signal pipelines, and state-machine implementations using abundant logic elements and on-chip RAM.
• Rugged Communications Equipment  Fits network and communication subsystems that demand reliability, reconfigurability, and military qualification.

Unique Advantages

• Highly Configurable Logic: 21,504 logic elements provide designers with the programmability needed to implement complex, application-specific digital functions.
• Significant On-Chip Memory: Approximately 0.129 Mbits of embedded RAM enables localized buffering and data handling without relying exclusively on external memory.
• Extensive I/O Count: 356 I/O pins reduce the need for external multiplexing or expanders in I/O-intensive designs.
• Military Qualification: MIL‑STD‑883 qualification and a −55 °C to 125 °C operating range support deployment in harsh and mission-critical environments.
• Compact, Surface-Mount Packaging: 456-BBGA / 456-PBGA (35×35) packaging enables dense PCB layouts while maintaining reliable solder-mount attachment.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose APA600-BGG456M?

The APA600-BGG456M balances large programmable capacity, on-chip memory, and a high I/O count with military-grade qualification, making it a strong choice for designers building rugged, reconfigurable systems. Its supply voltage range and surface-mount BGA/PBGA packaging allow straightforward integration into space-constrained, high-reliability boards.

Backed by Microchip Technology and qualified to MIL‑STD‑883, this FPGA is suited to customers developing avionics, defense, and other high-reliability embedded systems that require deterministic logic, robust thermal performance, and long-term availability.

Request a quote or submit an inquiry for pricing and availability of the APA600-BGG456M to start evaluating this military-grade FPGA for your design.