APA600-BGG456I

The APA600-BGG456I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for applications that require a high-density programmable logic fabric. It provides a combination of logic resources, I/O capacity and on-chip memory in a 456-ball BGA package for surface-mount assembly.

With 21,504 logic elements, 356 user I/Os, approximately 0.129 Mbits of embedded memory and a 2.3 V to 2.7 V supply range, this device targets industrial designs that need configurable logic, robust I/O count and operation across a –40 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 21,504 logic elements providing a programmable fabric suitable for medium-to-high complexity logic integration; rated at 600,000 gates.
• Embedded Memory — Approximately 0.129 Mbits of on-chip RAM to support buffering, state machines and small data structures without external memory.
• I/O Density — 356 user I/Os to support wide parallel interfaces, multiple peripherals and board-level I/O consolidation.
• Power Supply — Single-supply operation from 2.3 V to 2.7 V to match a range of low-voltage system rail requirements.
• Package & Mounting — 456-BBGA package (supplier device package: 456-PBGA, 35 × 35 mm) in a surface-mount form factor for compact board integration.
• Industrial Operating Range — Rated for operation from –40 °C to 85 °C and supplied in an industrial grade variant for deployment in industrial environments.
• Compliance — RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Industrial Control — High I/O count and industrial temperature rating suit programmable control functions, sensor interfacing and real-time I/O aggregation.
• Communications Interfaces — Large logic resource and embedded RAM enable implementation of protocol bridging, packet processing and custom data path logic.
• Embedded System Integration — Use as a central programmable fabric for consolidating glue logic, custom peripherals and timing-critical functions in embedded platforms.

Unique Advantages

• High Logic Density: 21,504 logic elements (approx. 600k gates) allow integration of complex logic functions that reduce external component count.
• Significant I/O Resource: 356 user I/Os enable direct interfacing to multiple peripherals and parallel buses, simplifying board-level routing and connections.
• On-Chip Memory: Approximately 0.129 Mbits of embedded RAM supports local buffering and state storage, reducing dependency on external memory.
• Industrial Reliability: Industrial-grade specification and –40 °C to 85 °C operating range support deployments in demanding environmental conditions.
• Compact BGA Packaging: 456-ball PBGA (35 × 35 mm) provides a high-density, surface-mount solution for space-constrained designs.
• Lead-Free Manufacturing Ready: RoHS compliance helps meet modern manufacturing and environmental requirements.

Why Choose APA600-BGG456I?

The APA600-BGG456I delivers a balanced combination of programmable logic, on-chip memory and a high I/O count in a compact 456-BBGA package, making it well suited for industrial and embedded designs that require flexible hardware customization and robust operation across standard industrial temperatures. Its supply voltage range and RoHS compliance make it compatible with contemporary low-voltage system designs and manufacturing practices.

This device is ideal for engineers looking to consolidate discrete logic, implement custom interfaces or accelerate control and data-path functions while keeping board area and BOM complexity under control. The APA600-BGG456I offers a scalable, reliable platform for medium-to-high complexity programmable logic requirements.

Request a quote or submit an inquiry to get pricing and availability for the APA600-BGG456I for your next design.