APA600-BGG456

The APA600-BGG456 is a ProASICPLUS field-programmable gate array from Microchip Technology. It provides 21,504 logic elements and approximately 0.129 Mbits of embedded memory in a high-density 456-ball BGA package.

Designed for commercial embedded applications, the device delivers a combination of gate count, I/O density and on-chip memory suitable for custom digital logic, interface bridging and control functions that require up to 600,000 gates and 356 I/O connections.

Key Features

• Logic Capacity 21,504 logic elements (cells) and an effective gate count of 600,000 enable implementation of substantial custom digital logic.
• Embedded Memory Approximately 0.129 Mbits of on-chip RAM for buffering, small data storage or state retention within designs.
• I/O Density 356 I/O pins to support multiple high-pin-count interfaces and peripheral connectivity.
• Supply Voltage Operates from 2.3 V to 2.7 V, suitable for systems using low-voltage core rails.
• Package and Mounting 456-BBGA package (supplier device package: 456-PBGA, 35×35) in a surface-mount form factor for compact board integration.
• Commercial Grade Temperature Rated for 0 °C to 70 °C operating temperature and specified as commercial grade.
• Regulatory RoHS compliant.

Typical Applications

• Custom digital logic and prototyping Use the 21,504 logic elements and 600,000-gate capacity to develop and iterate application-specific logic functions.
• High-density I/O interfacing Deploy the 356 I/O pins to aggregate or bridge multiple external peripherals and interfaces on a single device.
• On-chip buffering and small data storage Leverage the embedded memory (approximately 0.129 Mbits) for data buffering, small FIFOs or state tables within control logic.

Unique Advantages

• High logic integration: 21,504 logic elements and 600,000 gates allow consolidation of complex functions into a single FPGA, reducing external component count.
• Significant I/O availability: 356 I/O pins support multiple simultaneous interfaces, simplifying board-level routing and system partitioning.
• Compact package: 456-BBGA (456-PBGA, 35×35) surface-mount package delivers high pin density in a compact footprint for space-constrained designs.
• Low-voltage operation: 2.3 V to 2.7 V supply range aligns with common low-voltage system rails for simpler power provisioning.
• Commercial suitability: Commercial-grade temperature rating and RoHS compliance make the device appropriate for mainstream embedded products and markets.

Why Choose APA600-BGG456?

The APA600-BGG456 balances substantial logic capacity, on-chip memory and high I/O count in a compact BGA package, making it a practical choice for commercial embedded systems that require consolidated digital logic and interface density. Its combination of 21,504 logic elements, approximately 0.129 Mbits of embedded RAM and 356 I/O offers a flexible platform for designers targeting medium-to-high complexity FPGA implementations.

Manufactured by Microchip Technology and offered in a surface-mount 456-BBGA package with RoHS compliance, this device is suited for teams focused on reducing board-level BOM and integrating multiple functions into a single programmable device while adhering to commercial temperature and supply requirements.

Request a quote or submit an inquiry for the APA600-BGG456 to receive pricing and availability tailored to your project needs.