APA600-CGS624B

The APA600-CGS624B is a ProASICPLUS flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. This military-grade FPGA delivers a large logic fabric and high I/O density to support complex embedded logic and I/O consolidation in temperature-critical systems.

With 21,504 logic elements, approximately 0.13 Mbits of embedded memory, and 440 I/O, the device is designed for applications that require substantial on-chip logic, many external interfaces, and operation across a wide temperature range.

Key Features

• Logic Capacity — 21,504 logic elements supporting up to 600,000 gates for implementing complex digital functions and control logic.
• Embedded Memory — Total on-chip RAM of 129,024 bits (approximately 0.13 Mbits) for local buffering and small-data storage.
• I/O Density — 440 user I/O pins to support extensive peripheral interfacing and signal routing.
• Power — Operates from a 2.3 V to 2.7 V supply range to match system power architectures requiring this nominal core voltage.
• Package & Mounting — 624-BCCGA package (supplier device package: 624-CCGA, 32.5 × 32.5 mm) with through-hole mounting option for specific assembly requirements.
• Rugged Reliability — Military-grade component with an operating temperature range of -55 °C to 125 °C for deployment in harsh environments.
• Environmental Compliance — RoHS compliant for use in assemblies requiring lead-free components.

Typical Applications

• Military Embedded Systems — Military-grade temperature rating and rugged specifications enable use in defense electronics and mission-critical embedded controllers.
• High-Density I/O Controllers — The device’s 440 I/O pins provide the channel count needed for complex interface aggregation, board-level glue logic, and signal routing.
• Complex Logic and Signal Processing — With 21,504 logic elements and 600,000 gates, the FPGA can implement multi-function processing blocks and custom datapaths with on-chip RAM for temporary storage.

Unique Advantages

• High Logic Integration: 21,504 logic elements reduce the need for multiple discrete logic devices, simplifying system architectures.
• Substantial I/O Count: 440 I/O pins allow consolidation of peripheral interfaces and board-level interconnects, lowering BOM complexity.
• Wide Operating Temperature: Rated from -55 °C to 125 °C to support designs requiring extended thermal capability.
• Trimmed Supply Range: 2.3 V to 2.7 V operating voltage supports systems designed around this nominal supply, enabling predictable power integration.
• Robust Package Options: 624-BCCGA (32.5 × 32.5 mm) with through-hole mounting accommodates specific assembly and mechanical requirements.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements for lead-free assemblies.

Why Choose APA600-CGS624B?

The APA600-CGS624B positions itself as a high-capacity, military-grade FPGA suited for applications that demand a combination of extensive logic resources, large I/O counts, and wide thermal capability. Its balance of logic density, on-chip memory, and packaging options makes it a practical choice for engineers designing rugged embedded systems and high-density interface controllers.

Backed by Microchip Technology, this FPGA offers a clear specification set for procurement and design integration, providing long-term value for projects that require dependable operation across challenging environmental conditions.

Request a quote or submit a pricing request for the APA600-CGS624B to receive availability and volume pricing information tailored to your program needs.