APA600-FG256

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA

Quantity 486 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21504Number of Logic Elements/Cells21504
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits129024

Overview of APA600-FG256 – ProASICPLUS Field Programmable Gate Array (FPGA), 600,000 gates, 256-LBGA

The APA600-FG256 is a ProASICPLUS Flash FPGA from Microchip Technology delivering moderate logic density and embedded memory in a compact BGA package. With 21,504 logic elements and approximately 0.13 Mbits of on-chip RAM, this surface-mount device targets commercial applications that require programmable logic, flexible I/O and a small board footprint.

Key electrical and mechanical characteristics include a 2.3 V to 2.7 V supply range, 186 user I/Os, commercial operating temperature (0 °C to 70 °C), and RoHS compliance.

Key Features

  • Logic Capacity  21,504 logic elements providing approximately 600,000 gates for mid-range programmable logic implementations.
  • Embedded Memory  Approximately 0.13 Mbits (129,024 bits) of on-chip RAM for small data buffers and state storage.
  • I/O  186 general-purpose I/O pins to support multiple interfaces and peripheral connections.
  • Power  Single supply operation from 2.3 V to 2.7 V to match low-voltage system domains.
  • Package & Mounting  256‑pin LBGA (supplier package: 256‑FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
  • Temperature & Grade  Commercial grade operation from 0 °C to 70 °C suitable for a wide range of consumer and commercial designs.
  • Regulatory  RoHS compliant for lead-free manufacturing flow.

Unique Advantages

  • Balanced logic and memory mix: 21,504 logic elements combined with 129,024 bits of RAM enable implementation of medium-complexity custom logic and modest data buffering without external memory.
  • High I/O count in compact package: 186 I/Os in a 256‑pin BGA allow dense peripheral connectivity while keeping board area small.
  • Low-voltage operation: The 2.3 V to 2.7 V supply range supports integration into modern low-voltage systems and simplifies power supply design.
  • Surface-mount BGA footprint: 256‑FPBGA (17×17) package provides a reliable, space-efficient mounting option for high-density PCBs.
  • Commercial-grade suitability: Rated for 0 °C to 70 °C operation and RoHS compliance for mainstream commercial product deployments.

Why Choose APA600-FG256?

The APA600-FG256 positions itself as a mid-range ProASICPLUS Flash FPGA that balances logic density, embedded memory and I/O capacity in a compact 256‑pin BGA. It is well suited for designers who need programmable logic with a significant I/O complement and on-chip RAM while maintaining a small PCB footprint and low-voltage power domain.

Backed by Microchip Technology and delivered in a RoHS-compliant surface-mount package, the APA600-FG256 provides a straightforward building block for commercial electronic designs that require flexible, reprogrammable logic and moderate resource capacity.

Request a quote or submit a quotation request for APA600-FG256 to get pricing and availability details for your project.

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