APA600-FG484
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 370 129024 484-BGA |
|---|---|
| Quantity | 452 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 370 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21504 | Number of Logic Elements/Cells | 21504 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 129024 |
Overview of APA600-FG484 – ProASICPLUS FPGA, 370 I/O, 484-BGA
The APA600-FG484 is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, offered in a 484-ball fine-pitch BGA package. It provides a combination of logic capacity, on-chip embedded memory and a high I/O count suitable for commercial embedded designs that require reconfigurable logic and system integration.
With 21,504 logic elements, approximately 0.129 Mbits of embedded memory and support for 370 user I/Os, this device targets applications that need moderate gate count, significant connectivity and compact BGA packaging while operating from a 2.3–2.7 V supply rail.
Key Features
- Logic Capacity 21,504 logic elements (cells) providing approximately 600,000 gates of user logic for custom digital functions and glue logic.
- Embedded Memory Approximately 0.129 Mbits of on-chip RAM (129,024 bits) to support FIFOs, small buffers and state storage within the FPGA fabric.
- I/O Density 370 user I/Os to support extensive peripheral interfacing, multi-channel I/O and board-level signal routing.
- Package and Mounting 484-BGA package (supplier device package: 484-FPBGA, 23×23 mm) in a surface-mount format for compact board integration and reliable solder attachment.
- Power Low-voltage operation from a 2.3 V to 2.7 V supply range to match modern system power rails.
- Commercial Temperature Grade Specified for 0 °C to 70 °C operation for standard commercial environment deployments.
- RoHS Compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- Embedded Systems Implement custom control logic, protocol bridging and peripheral interfacing where reconfigurable hardware accelerates development.
- Communications and Networking Serve as protocol glue logic, I/O aggregation or timing alignment for moderate-speed interfaces using the device’s high I/O count.
- Industrial Automation Control and supervise machine-level logic, I/O expansion and deterministic signal processing within commercial-temperature environments.
- Prototyping and Functional Integration Combine multiple functions into a single programmable device to reduce BOM and iterate on hardware designs rapidly.
Unique Advantages
- High logic density: 21,504 logic elements and approximately 600,000 gates enable implementation of sizable custom digital functions without external ASIC development.
- Ample I/O channels: 370 user I/Os simplify board-level routing and reduce the need for external multiplexers or I/O expanders.
- Compact BGA footprint: 484-FPBGA (23×23 mm) package delivers a small, serviceable form factor for space-constrained PCBs.
- Low-voltage compatibility: 2.3–2.7 V supply range aligns with modern low-voltage system rails for simplified power design.
- Commercial-grade suitability: Rated for 0 °C to 70 °C operation, making it appropriate for a wide range of consumer and commercial applications.
- Regulatory readiness: RoHS compliance supports environmentally conscious product development and supply chain requirements.
Why Choose APA600-FG484?
The APA600-FG484 balances significant programmable logic resources, embedded memory and a high I/O count in a compact 484-BGA surface-mount package from Microchip Technology. Its specification set is well suited to designers needing a robust, reconfigurable device for commercial embedded systems, communications interfacing and functional integration.
Selecting this part supports designs that require moderate gate count and dense I/O in a low-voltage, RoHS-compliant device backed by a recognized FPGA product family. It is appropriate for teams seeking to consolidate discrete logic, accelerate development cycles and maintain flexibility across product iterations.
Request a quote or contact sales to discuss availability, pricing and how the APA600-FG484 can fit your next design.

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