APA600-FG484

IC FPGA 370 I/O 484FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 370 129024 484-BGA

Quantity 452 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O370Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21504Number of Logic Elements/Cells21504
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits129024

Overview of APA600-FG484 – ProASICPLUS FPGA, 370 I/O, 484-BGA

The APA600-FG484 is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, offered in a 484-ball fine-pitch BGA package. It provides a combination of logic capacity, on-chip embedded memory and a high I/O count suitable for commercial embedded designs that require reconfigurable logic and system integration.

With 21,504 logic elements, approximately 0.129 Mbits of embedded memory and support for 370 user I/Os, this device targets applications that need moderate gate count, significant connectivity and compact BGA packaging while operating from a 2.3–2.7 V supply rail.

Key Features

  • Logic Capacity  21,504 logic elements (cells) providing approximately 600,000 gates of user logic for custom digital functions and glue logic.
  • Embedded Memory  Approximately 0.129 Mbits of on-chip RAM (129,024 bits) to support FIFOs, small buffers and state storage within the FPGA fabric.
  • I/O Density  370 user I/Os to support extensive peripheral interfacing, multi-channel I/O and board-level signal routing.
  • Package and Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23 mm) in a surface-mount format for compact board integration and reliable solder attachment.
  • Power  Low-voltage operation from a 2.3 V to 2.7 V supply range to match modern system power rails.
  • Commercial Temperature Grade  Specified for 0 °C to 70 °C operation for standard commercial environment deployments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Embedded Systems  Implement custom control logic, protocol bridging and peripheral interfacing where reconfigurable hardware accelerates development.
  • Communications and Networking  Serve as protocol glue logic, I/O aggregation or timing alignment for moderate-speed interfaces using the device’s high I/O count.
  • Industrial Automation  Control and supervise machine-level logic, I/O expansion and deterministic signal processing within commercial-temperature environments.
  • Prototyping and Functional Integration  Combine multiple functions into a single programmable device to reduce BOM and iterate on hardware designs rapidly.

Unique Advantages

  • High logic density: 21,504 logic elements and approximately 600,000 gates enable implementation of sizable custom digital functions without external ASIC development.
  • Ample I/O channels: 370 user I/Os simplify board-level routing and reduce the need for external multiplexers or I/O expanders.
  • Compact BGA footprint: 484-FPBGA (23×23 mm) package delivers a small, serviceable form factor for space-constrained PCBs.
  • Low-voltage compatibility: 2.3–2.7 V supply range aligns with modern low-voltage system rails for simplified power design.
  • Commercial-grade suitability: Rated for 0 °C to 70 °C operation, making it appropriate for a wide range of consumer and commercial applications.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product development and supply chain requirements.

Why Choose APA600-FG484?

The APA600-FG484 balances significant programmable logic resources, embedded memory and a high I/O count in a compact 484-BGA surface-mount package from Microchip Technology. Its specification set is well suited to designers needing a robust, reconfigurable device for commercial embedded systems, communications interfacing and functional integration.

Selecting this part supports designs that require moderate gate count and dense I/O in a low-voltage, RoHS-compliant device backed by a recognized FPGA product family. It is appropriate for teams seeking to consolidate discrete logic, accelerate development cycles and maintain flexibility across product iterations.

Request a quote or contact sales to discuss availability, pricing and how the APA600-FG484 can fit your next design.

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