APA600-FG256I

The APA600-FG256I is a ProASICPLUS field programmable gate array (FPGA) IC designed for industrial applications. It provides a high-density programmable fabric featuring 21,504 logic elements, approximately 0.13 Mbits of embedded memory, and 186 I/Os in a compact 256-LBGA package.

With a supply voltage range of 2.3 V to 2.7 V and an operating temperature of -40 °C to 85 °C, this surface-mount FPGA targets designs requiring robust operation and substantial logic integration in constrained board area.

Key Features

• Core Logic  21,504 logic elements (LEs) providing the programmable logic resources required for complex glue logic, state machines, and custom datapaths.
• Embedded Memory  Total on-chip RAM of 129,024 bits (approximately 0.13 Mbits) for small buffers, FIFOs, and register storage within the FPGA fabric.
• I/O Density  186 general-purpose I/O pins to support multiple external interfaces and parallel connections to peripherals and sensors.
• Gate Capacity  Equivalent to 600,000 gates for integrating control logic and custom functionality into a single device.
• Power Supply  Operates from a 2.3 V to 2.7 V supply domain to match low-voltage system rails.
• Package & Mounting  256-LBGA supplier package (256-FPBGA, 17×17) in a surface-mount form factor, helping save PCB area while enabling high I/O counts.
• Industrial Temperature Range  Specified for -40 °C to 85 °C operation for deployment in industrial environments.
• Environmental Compliance  RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating, extensive logic resources, and 186 I/Os to implement motor control logic, I/O aggregation, and protocol handling on factory equipment.
• Embedded System Integration  Integrate custom peripheral controllers, data path logic, and interface adaptation within constrained board space using the compact 256-LBGA package.
• Communications and Interface Bridging  Leverage the large I/O count and logic capacity to implement protocol translation, parallel interfaces, or custom timing-critical logic between subsystems.
• Test and Measurement Front-Ends  Implement signal conditioning control, timing logic, and data staging with on-chip RAM and plentiful logic elements for deterministic instrument behavior.

Unique Advantages

• High integration density: 21,504 logic elements and 600,000 gates enable consolidation of multiple discrete functions into a single FPGA, reducing BOM complexity.
• Substantial I/O capability: 186 I/Os allow direct connection to many peripherals and sensors without additional I/O expanders.
• Compact, board-friendly package: 256-LBGA (256-FPBGA, 17×17) in a surface-mount form factor supports high-density PCB layouts while keeping a small footprint.
• Industrial operating range: Rated for -40 °C to 85 °C operation to meet environmental needs in industrial deployments.
• Controlled supply range: Supports 2.3 V to 2.7 V supply rails to align with common low-voltage system designs.
• Compliance-ready: RoHS compliance supports lead-free manufacturing requirements.

Why Choose APA600-FG256I?

The APA600-FG256I positions itself as a robust, high-density programmable device for industrial and embedded designs that require substantial logic, sizeable I/O, and a compact package. Its combination of 21,504 logic elements, approximately 0.13 Mbits of embedded memory, and 186 I/Os provides designers the capacity to consolidate control, protocol, and interfacing functions onto a single FPGA.

This device is suited for engineers and procurement teams building industrial control systems, embedded platforms, and interface logic where temperature range, board space, and integration density are important. The APA600-FG256I offers a clear value proposition for scalable, reliable implementation backed by established ProASICPLUS FPGA product family attributes.

Request a quote or submit a parts inquiry today to evaluate APA600-FG256I for your next design requirement.