APA600-FG484A

The APA600-FG484A is a ProASICPLUS field programmable gate array (FPGA) offering 600,000 gates with 21,504 logic elements and 370 user I/Os in a 484‑BGA surface‑mount package. It provides on‑chip embedded memory and a voltage supply range of 2.375 V to 2.625 V.

With AEC‑Q100 qualification and an operating temperature range of -40 °C to 125 °C, this device is targeted for applications that require automotive‑grade qualification and extended temperature capability while delivering a compact, high‑density programmable logic solution.

Key Features

• FPGA Core ProASICPLUS architecture delivering 600,000 gates for programmable logic integration.
• Logic Resources 21,504 logic elements to implement medium‑to‑large combinational and sequential logic functions.
• Embedded Memory Approximately 0.13 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
• I/O Density 370 user I/O pins to support multiple interfaces and parallel connectivity options.
• Package and Mounting 484‑BGA supplier device package (484‑FPBGA, 23×23) in a surface‑mount form factor for compact PCB integration.
• Power Single supply operating range from 2.375 V to 2.625 V to match tight system power rails.
• Automotive Qualification & Temperature AEC‑Q100 qualified and rated for operation from -40 °C to 125 °C for use in temperature‑extreme environments.
• Mounting Type Surface mount for automated PCB assembly and reliable mechanical connection.

Typical Applications

• Automotive Systems — Suitable for automotive applications requiring AEC‑Q100 qualification and extended -40 °C to 125 °C operation.
• Embedded Control — Implement control logic and state machines using 21,504 logic elements and on‑chip memory for local data handling.
• High‑I/O Interfaces — Use the 370 I/Os for interfacing sensors, actuators, and peripheral devices in complex systems.
• Space‑Constrained Designs — 484‑BGA surface‑mount package enables a compact, high‑density implementation on PCB designs.

Unique Advantages

• Automotive‑grade Qualification: AEC‑Q100 qualification and extended temperature rating support deployment in automotive environments.
• High Integration Density: 600,000 gates and 21,504 logic elements enable consolidation of multiple functions into a single FPGA, reducing system BOM.
• Generous I/O Count: 370 I/Os provide flexibility for parallel interfaces and mixed peripheral connectivity without external multiplexing.
• Compact BGA Package: 484‑BGA (484‑FPBGA, 23×23) surface‑mount package minimizes PCB footprint while maintaining thermal and mechanical robustness.
• Tight Supply Range: Narrow operating voltage window (2.375 V–2.625 V) for predictable power integration with system rails.
• On‑chip Memory: Approximately 0.13 Mbits of embedded RAM for local buffering and temporary data storage.

Why Choose APA600-FG484A?

The APA600-FG484A combines a high gate count and substantial logic‑element capacity with a large I/O complement and on‑chip memory in a compact 484‑BGA package. Its AEC‑Q100 qualification and -40 °C to 125 °C rating make it suitable for designs that demand automotive‑grade qualification and extended temperature operation.

This device is appropriate for engineers seeking a robust, highly integrated FPGA for automotive and other temperature‑challenged embedded systems where density, I/O flexibility, and qualification are key selection criteria.

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