APA600-FG676

The APA600-FG676 is a ProASICPLUS Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 676-FBGA (27×27) surface-mount package. It provides a mid-range FPGA fabric with 21,504 logic elements, 600,000 gates and 454 user I/O for dense, reconfigurable logic implementations.

Designed for commercial-grade applications, the device includes approximately 0.13 Mbits of embedded memory, operates from a 2.3 V to 2.7 V supply, and supports an operating temperature range of 0 °C to 70 °C. It is RoHS compliant for environmental regulation alignment.

Key Features

• Logic Capacity — 21,504 logic elements (reported) and 600,000 gates enable implementation of complex combinational and sequential logic.
• Embedded Memory — Approximately 0.13 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density — 454 user I/O pins to support multiple peripherals, parallel interfaces, or broad I/O expansion needs.
• Package — 676-FBGA (27×27) BGA package optimized for board-level density and surface-mount assembly.
• Power — Low-voltage operation from 2.3 V to 2.7 V to match common logic and I/O domains.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 70 °C operating temperature.
• Compliance — RoHS compliant for reduced hazardous substances in assembly.

Typical Applications

• Custom Logic and Prototyping — Implement mid-scale custom logic functions and prototypes using 21,504 logic elements and 600,000 gates.
• I/O-Intensive Interface Bridging — Use the 454 I/O pins to bridge multiple peripherals, parallel buses, or mixed-signal interfaces on compact PCBs.
• Compact Embedded Boards — The 676-FBGA surface-mount package and low-voltage operation make the part suitable for space-constrained commercial embedded designs.

Unique Advantages

• Balanced Logic and Memory: Combines 21,504 logic elements with approximately 0.13 Mbits of on-chip RAM to support control logic, state machines, and modest buffering without external memory.
• High I/O Count: 454 user I/O pins reduce the need for external I/O expanders in applications that require many signals or interfaces.
• Compact BGA Packaging: The 676-FBGA (27×27) package enables high-density board integration while maintaining surface-mount assembly workflows.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C operation, aligning with a wide range of commercial electronic products and prototypes.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose APA600-FG676?

The APA600-FG676 offers a practical mix of logic capacity, I/O density, and embedded memory in a compact 676-FBGA package from Microchip Technology. Its specifications make it suitable for commercial embedded systems that require mid-range programmable logic, multiple interfaces, and surface-mount integration.

Choose this device for designs where a balance of logic resources, I/O count, and compact packaging matter—projects such as custom control logic, interface bridging, and embedded prototyping can benefit from the APA600-FG676's feature set and RoHS-compliant construction.

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