APA600-FGG256I

The APA600-FGG256I is a ProASICPLUS flash-based FPGA manufactured by Microchip Technology. It provides a hardware platform with 21,504 logic elements, approximately 0.129 Mbits of embedded memory, and 186 I/O pins for implementing custom digital logic and interfacing tasks.

Designed for industrial-grade applications, the device operates from a 2.3 V to 2.7 V supply and across a −40 °C to 85 °C temperature range, packaged in a 256-ball L-BGA (17 × 17, 256-FPBGA) surface-mount package.

Key Features

• Core Logic  21,504 logic elements providing flexible programmable logic capacity for implementing custom digital functions.
• Logic Density  Approximately 600,000 gates of logic density to map state machines, datapaths, and glue logic.
• Embedded Memory  Approximately 0.129 Mbits of on-chip RAM to support buffering, small FIFOs, and local storage within designs.
• I/O Count  186 user I/O pins to support wide external interfacing and multiple parallel signals.
• Power  Operates from a 2.3 V to 2.7 V supply range suitable for standard low-voltage system domains.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 85 °C to meet common industrial temperature requirements.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Custom Logic and Control  Implement state machines, finite-control logic, and specialized processing functions using the device's 21,504 logic elements and 600,000-gate capacity.
• I/O Expansion and Interface Bridging  Use the 186 I/O pins to bridge multiple peripherals or convert between parallel and serial interfaces on constrained PCBs.
• Industrial Automation  Deploy in industrial control systems that require operation across −40 °C to 85 °C and reliable, non-volatile programmable logic.

Unique Advantages

• High Logic Capacity:  21,504 logic elements enable implementation of complex logic without external ASICs or discrete glue logic, simplifying board design.
• Integrated On-Chip Memory:  Approximately 0.129 Mbits of embedded RAM reduces the need for external memory for small buffers and state storage.
• Substantial I/O Availability:  186 I/Os provide flexibility for parallel interfaces, sensor arrays, and mixed-signal front-ends requiring many pins.
• Industrial Temperature Support:  Rated −40 °C to 85 °C to address designs exposed to extended temperature ranges common in industrial environments.
• Space-Efficient Package:  256-LBGA surface-mount package (17 × 17 FPBGA) delivers a compact footprint for high-density PCBs.
• Low-Voltage Operation:  2.3 V to 2.7 V supply compatibility with common low-voltage system rails.

Why Choose APA600-FGG256I?

The APA600-FGG256I positions itself as a robust, industrial-grade FPGA option when designers need substantial logic density, ample I/O, and on-chip memory in a compact L-BGA package. Its combination of 21,504 logic elements, 186 I/Os, and support for a 2.3 V–2.7 V supply makes it suitable for embedded designs that require programmable hardware and reliable operation across industrial temperature ranges.

Manufactured by Microchip Technology and supplied in a RoHS-compliant 256-ball L-BGA, this device offers a straightforward, integrated solution for teams looking to consolidate logic, reduce component count, and maintain a compact board layout while meeting industrial environmental requirements.

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