APA600-FGG256A

The APA600-FGG256A is a ProASICPLUS field programmable gate array (FPGA) IC offering a balance of logic density, I/O capacity, and automotive-grade qualification. It provides 21,504 logic elements and approximately 0.13 Mbits of embedded memory in a compact 256-LBGA package.

With 186 I/Os, up to 600,000 gates, AEC-Q100 qualification, and RoHS compliance, this device targets applications that require high integration and operation across a wide temperature range. Voltage supply is 2.375 V–2.625 V and the operating temperature range is –40 °C to 125 °C.

Key Features

• Core / Logic: 21,504 logic elements supporting up to 600,000 gates for medium-density programmable logic implementations.
• Embedded Memory: Total on-chip RAM of 129,024 bits (approximately 0.13 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Capacity: 186 user I/Os to support a mix of interfaces, sensor connections, and peripheral control lines.
• Power: Narrow supply voltage range of 2.375 V to 2.625 V for consistent device behavior in low-voltage systems.
• Package: 256-LBGA package; supplier device package listed as 256-FPBGA (17×17) for compact board-level integration.
• Automotive Qualification & Temperature Range: AEC-Q100 qualified with an operating temperature range of –40 °C to 125 °C for use in temperature-demanding environments.
• Regulatory Compliance: RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Automotive Electronics: Suited for automotive control modules and in-vehicle systems that require AEC-Q100 qualification and extended temperature operation.
• Embedded Control: Use in compact embedded systems that need medium-density programmable logic combined with on-chip RAM and significant I/O count.
• Interface Bridging and Signal Aggregation: Ideal for designs requiring many I/Os and flexible logic to concentrate or translate signals between subsystems.

Unique Advantages

• Automotive-Qualified: AEC-Q100 qualification provides confidence for deployment in automotive environments with extended temperature requirements.
• High Logic Density: 21,504 logic elements and up to 600,000 gates offer substantial resources for mid-range FPGA designs without external logic overhead.
• Generous I/O Count: 186 I/Os enable complex interfacing and multi-signal connectivity in a single device.
• Compact Package: 256-LBGA (256-FPBGA 17×17) allows high integration in space-constrained PCB layouts.
• Controlled Voltage Operation: A defined supply range of 2.375 V–2.625 V supports consistent power design and predictable device behavior.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing flows.

Why Choose APA600-FGG256A?

The APA600-FGG256A positions itself as a robust, automotive-qualified FPGA option for designers needing a mid-density programmable logic device with substantial I/O and embedded memory. Its combination of 21,504 logic elements, approximately 0.13 Mbits of on-chip RAM, and AEC-Q100 qualification makes it suitable for applications that demand integration, temperature resilience, and compact packaging.

Engineers and procurement teams looking for a device that balances logic capacity, I/O flexibility, and automotive-grade reliability will find the APA600-FGG256A appropriate for a range of embedded and in-vehicle designs where space, thermal range, and compliance are key considerations.

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