APA600-FGG484A

The APA600-FGG484A is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, delivering a mid-density programmable logic device with substantial I/O and on-chip memory for embedded control and signal-processing tasks. Its combination of 21,504 logic elements, approximately 129,024 bits of embedded memory and 370 I/O pins makes it suitable for designs that require moderate logic capacity with high I/O connectivity.

Designed for surface-mount applications, this device is offered in a 484-ball BGA package and is qualified to AEC-Q100, supporting a wide operating range from -40 °C to 125 °C for deployment in demanding environments.

Key Features

• Core Logic  21,504 logic elements (cells) providing approximately 600,000 gates to implement custom digital functions and finite-state logic.
• Embedded Memory  Approximately 129,024 bits of on-chip RAM for buffering, FIFOs and small data stores directly within the FPGA fabric.
• I/O Density  370 general-purpose I/O pins to support multiple interfaces, parallel buses and high-pin-count connectivity requirements.
• Package & Mounting  484-ball BGA (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact PCB integration.
• Power  Single-core voltage supply range of 2.375 V to 2.625 V for the device core.
• Temperature & Qualification  Automotive-grade qualification with AEC-Q100 and an operating temperature range of -40 °C to 125 °C for temperature-critical applications.
• Compliance  RoHS-compliant to meet contemporary lead-free manufacturing requirements.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and a -40 °C to 125 °C operating range make this FPGA suitable for in-vehicle control modules and signal processing tasks that require automotive-grade components.
• Industrial automation  High I/O count and ample logic elements support motor control, I/O aggregation and machine-control functions in harsh industrial environments.
• Sensor aggregation and preprocessing  On-chip RAM and programmable logic enable local buffering and preprocessing of sensor data before passing results to host controllers or communication interfaces.
• High-density interface bridging  Use the device’s 370 I/Os to implement protocol bridging, bus adaptation or custom I/O expansion for systems with mixed signal and digital interfaces.

Unique Advantages

• High logic capacity: 21,504 logic elements provide the density needed to integrate multiple functions into a single programmable device, simplifying board-level design.
• Substantial on-chip memory: Approximately 129,024 bits of embedded RAM allow local data buffering and FIFO implementation without relying on external memory.
• Extensive I/O connectivity: 370 I/Os enable direct interfacing to a wide range of peripherals and buses, reducing the need for external glue logic.
• Automotive-grade reliability: AEC-Q100 qualification and wide temperature operation address design needs where robustness and temperature tolerance are required.
• Compact BGA package: The 484-ball FPBGA (23 × 23 mm) provides a balance between pin count and PCB area for space-constrained applications.
• Regulatory-friendly: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose APA600-FGG484A?

The APA600-FGG484A positions itself as a versatile mid-density FPGA option for applications that demand a combination of logic capacity, generous I/O, embedded memory and automotive qualification. Its feature set is aimed at engineers building systems that require programmable flexibility along with temperature and quality qualifications for challenging operating environments.

This device is well suited for development teams and production designs that need scalable, reliable programmable logic from a recognized manufacturer, offering a compact BGA footprint and specifications that support deployment in automotive and industrial contexts.

Request a quote or contact sales for pricing, availability and lead-time details to evaluate the APA600-FGG484A for your next design.