APA600-FGG676

The APA600-FGG676 is a ProASICPLUS field programmable gate array (FPGA) supplied in a 676-ball fine-pitch BGA (27 × 27) package. It delivers a balanced combination of logic capacity, I/O density and on-chip memory tailored for commercial-grade designs.

With 21,504 logic elements, approximately 129,024 bits of embedded RAM, and 454 I/Os, this device is suited to applications that require substantial programmable logic and high interface density while operating from a 2.3 V to 2.7 V supply at 0 °C to 70 °C.

Key Features

• Logic Capacity  Approximately 21,504 logic elements (cells) providing a total of 600,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory  About 129,024 bits of on-chip RAM to support data buffering, FIFOs and small embedded storage needs without external memory.
• I/O Density  454 general-purpose I/Os to support multiple interfaces, wide buses or numerous peripheral connections in a single device.
• Power Supply  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Package & Mounting  676-ball FBGA (27 × 27) package in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade  Commercial-grade device specified for 0 °C to 70 °C operation and RoHS compliant.

Typical Applications

• System Control and Glue Logic  Use the APA600-FGG676 to implement interface bridging, protocol conversion and control logic where many I/Os and moderate logic capacity are required.
• Embedded Peripheral Aggregation  Aggregate and manage multiple sensor, actuator or peripheral interfaces using plentiful I/Os and on-chip RAM for local buffering.
• Custom I/O Subsystems  Deploy in commercial equipment that needs configurable I/O routing, pin-limited designs, or custom timing and sequencing functions.

Unique Advantages

• High I/O Count: 454 I/Os enable dense peripheral and bus connectivity without external multiplexers.
• Substantial Logic Resource: 21,504 logic elements provide the capacity to implement complex control, state machines and data-paths on a single device.
• On-Chip Memory: Approximately 129,024 bits of embedded RAM reduce dependence on external memory for buffering and temporary storage.
• Compact BGA Footprint: 676-FBGA (27 × 27) package allows high integration in space-constrained commercial PCB layouts.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility supports integration with modern low-voltage system rails.
• RoHS Compliant: Environmentally compliant manufacturing for global commercial deployments.

Why Choose APA600-FGG676?

The APA600-FGG676 provides a commercially rated FPGA option that combines mid-to-high logic density, extensive I/O capability and embedded RAM in a single 676-ball BGA package. Its specification set is aimed at designers who need a compact, surface-mount programmable device for commercial electronic products operating within 0 °C to 70 °C.

For engineering teams focused on consolidating multiple functions onto one device, the APA600-FGG676 offers clear integration advantages—reducing board-level complexity and external component count—while providing the resources needed for a wide range of programmable logic tasks.

Request a quote or submit an inquiry for pricing and availability of the APA600-FGG676 to move your design forward.