APA600-FGG484I

The APA600-FGG484I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology provided in a 484-ball BGA package. It delivers a balance of programmable logic, on-chip memory, and flexible I/O count for industrial embedded designs.

With 21,504 logic elements, approximately 0.129 Mbits of embedded memory and 370 I/O pins, this device targets industrial applications that require moderate logic density, significant I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity — 21,504 logic elements (cells) providing up to 600,000 logic gates for implementing combinational and sequential logic functions.
• Embedded Memory — Total on-chip RAM of 129,024 bits (approximately 0.129 Mbits) for buffering, state storage and small lookup tables.
• I/O Resources — 370 I/O pins to support wide peripheral interfacing, parallel buses and multi-channel signal routing.
• Power Supply — Operates from a 2.3 V to 2.7 V supply range, enabling compatibility with common embedded power rails.
• Industrial Temperature Grade — Specified operating range from −40 °C to 85 °C for deployment in industrial environments.
• Package and Mounting — 484-ball FBGA (23 × 23) package in a 484-BGA footprint with surface-mount mounting for compact board integration.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic and interfacing for factory automation and process control systems using the device’s industrial temperature rating and abundant I/O.
• Interface and Glue Logic — Use the 370 I/O pins to bridge multiple peripherals, translate bus protocols, and consolidate discrete logic into a single programmable device.
• Embedded Systems — Deploy as programmable logic and peripheral manager in embedded platforms where moderate memory and logic capacity are required.
• Prototyping and System Integration — Validate hardware designs and integrate custom functions with the device’s logic capacity and BGA footprint suitable for production-ready prototypes.

Unique Advantages

• Substantial Logic Density: 21,504 logic elements and 600,000 gates allow implementation of sizeable custom logic blocks without external glue chips.
• Significant I/O Count: 370 I/Os support multi-channel interfaces, broad peripheral connectivity and complex board-level integration.
• Industrial Reliability: Specified for −40 °C to 85 °C operation, enabling use in a wide range of industrial environments.
• Compact BGA Package: 484-FPBGA (23×23) provides a space-efficient footprint for high-density PCBs while retaining ample I/O.
• RoHS Compliant: Conforms to environmental compliance requirements for modern electronics manufacturing.
• Flexible Supply Voltage: 2.3 V to 2.7 V operation for compatibility with common core and I/O power domains.

Why Choose APA600-FGG484I?

The APA600-FGG484I positions itself as a robust ProASICPLUS FPGA option for industrial designs that require a balance of logic capacity, on-chip memory and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployment in demanding embedded systems and control applications.

Engineers specifying this device will find a well-rounded combination of programmable resources, supply voltage flexibility and a 484-BGA footprint that supports both prototyping and production PCB layouts from a recognized semiconductor manufacturer.

Request a quote or submit an inquiry to obtain pricing, lead-time and availability for the APA600-FGG484I. Our team can provide further technical information and ordering details to support your design and procurement process.