APA600-FGG484

The APA600-FGG484 is a ProASICPLUS field programmable gate array (FPGA) offered by Microchip Technology in a 484-ball FBGA package (23×23 mm). It provides a programmable logic fabric with 21,504 logic elements and approximately 129,024 bits of embedded memory for mid-density logic and memory integration.

Key electrical and mechanical characteristics include support for 370 I/O pins, an operating supply range from 2.3 V to 2.7 V, surface-mount packaging, and a commercial operating temperature range of 0 °C to 70 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 21,504 logic elements (cells) supporting approximately 600,000 equivalent gates for mid-density programmable logic implementations.
• Embedded Memory — Approximately 129,024 bits of on-chip RAM to support buffering, state machines, and small data storage without external memory.
• I/O Resources — 370 available I/O pins to accommodate multiple interfaces and peripheral connections on a single device.
• Power — Operates from a 2.3 V to 2.7 V supply range to match common system voltage domains.
• Package and Mounting — 484-ball fine-pitch BGA (484-FPBGA, 23×23 mm) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade — Commercial grade device specified for 0 °C to 70 °C operation.
• Regulatory Compliance — RoHS compliant to support lead-free assembly processes.

Unique Advantages

• Mid-density logic integration: 21,504 logic elements and roughly 600,000 gates provide a balance of capacity and cost for designs that need substantial programmable logic without high-end density.
• On-chip memory reduces BOM: Approximately 129,024 bits of embedded RAM minimize the need for external memory components for small to moderate buffering and state storage.
• High I/O count: 370 I/O pins enable flexible interfacing to peripherals, sensors, and external logic while consolidating board-level routing.
• Compact, surface-mount BGA: 484-ball FBGA (23×23 mm) offers a small PCB footprint and reliable solder joint geometry for surface-mount assembly.
• Commercial temperature rating: Specified for 0 °C to 70 °C operation to match standard commercial electronic applications.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many global markets.

Why Choose APA600-FGG484?

The APA600-FGG484 is positioned for designs that require a mid-density FPGA with a substantial mix of logic elements, embedded memory, and a high I/O count in a compact surface-mount BGA package. Its 2.3 V–2.7 V operating range and commercial temperature specification make it suitable for standard commercial electronic products where these electrical and environmental parameters align with system requirements.

Designers and procurement teams seeking a RoHS-compliant, mid-capacity programmable logic device from Microchip Technology will find the APA600-FGG484 delivers a straightforward combination of logic, memory, and I/O in a compact package for streamlined board integration.

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