APA600-FGG256

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA

Quantity 1,426 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21504Number of Logic Elements/Cells21504
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits129024

Overview of APA600-FGG256 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA

The APA600-FGG256 is a ProASICPLUS family field programmable gate array (FPGA) from Microchip Technology. It provides a mid-range logic capacity with integrated on-chip memory and a substantial I/O count in a compact BGA package.

Designed for commercial-grade applications, this surface-mount FPGA targets designs that require a balance of logic density, memory, and I/O in a 256-LBGA footprint while operating from a low-voltage supply.

Key Features

  • Logic Capacity — 21,504 logic elements providing a total of 600,000 gates for implementing medium-complexity digital functions.
  • Embedded Memory — Approximately 0.129 Mbits (129,024 bits) of on-chip RAM to support buffering, state storage, and small data tables.
  • I/O — 186 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
  • Power — Operates from a 2.3 V to 2.7 V supply range suitable for many low-voltage system environments.
  • Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
  • Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Compliance — RoHS compliant for regulatory and manufacturing consistency.

Unique Advantages

  • Substantial logic density: 21,504 logic elements and 600,000 gates enable integration of multiple digital functions on a single device, reducing external component count.
  • On-chip memory for local data: Approximately 0.129 Mbits of embedded RAM supports local buffering and state machines without external memory.
  • High I/O count: 186 I/O pins provide flexibility for interfacing numerous peripherals and external signals directly to the FPGA.
  • Low-voltage operation: 2.3 V–2.7 V supply range supports systems designed around lower core and I/O voltages.
  • Compact BGA footprint: 256-LBGA (17×17) surface-mount package helps minimize PCB area while maintaining connectivity.
  • Commercial-grade suitability: Rated for 0 °C to 70 °C operation and RoHS compliance for mainstream electronic products.

Why Choose APA600-FGG256?

The APA600-FGG256 delivers a balanced mix of logic resources, embedded memory, and I/O in a compact 256-LBGA package from Microchip Technology. Its 21,504 logic elements and 600,000 gates make it suitable for commercial designs that require medium-complexity FPGA integration without external logic proliferation.

This device is well suited to designers seeking a low-voltage, surface-mount FPGA option with substantial I/O and on-chip memory in a commercial temperature range. Its combination of features supports consolidation of digital functions to simplify BOM and board-level integration.

Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time information for the APA600-FGG256. Our team can provide a formal quote tailored to your volume and delivery requirements.

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