APA600-FGG256
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA |
|---|---|
| Quantity | 1,426 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21504 | Number of Logic Elements/Cells | 21504 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 129024 |
Overview of APA600-FGG256 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA
The APA600-FGG256 is a ProASICPLUS family field programmable gate array (FPGA) from Microchip Technology. It provides a mid-range logic capacity with integrated on-chip memory and a substantial I/O count in a compact BGA package.
Designed for commercial-grade applications, this surface-mount FPGA targets designs that require a balance of logic density, memory, and I/O in a 256-LBGA footprint while operating from a low-voltage supply.
Key Features
- Logic Capacity — 21,504 logic elements providing a total of 600,000 gates for implementing medium-complexity digital functions.
- Embedded Memory — Approximately 0.129 Mbits (129,024 bits) of on-chip RAM to support buffering, state storage, and small data tables.
- I/O — 186 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Power — Operates from a 2.3 V to 2.7 V supply range suitable for many low-voltage system environments.
- Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
- Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Compliance — RoHS compliant for regulatory and manufacturing consistency.
Unique Advantages
- Substantial logic density: 21,504 logic elements and 600,000 gates enable integration of multiple digital functions on a single device, reducing external component count.
- On-chip memory for local data: Approximately 0.129 Mbits of embedded RAM supports local buffering and state machines without external memory.
- High I/O count: 186 I/O pins provide flexibility for interfacing numerous peripherals and external signals directly to the FPGA.
- Low-voltage operation: 2.3 V–2.7 V supply range supports systems designed around lower core and I/O voltages.
- Compact BGA footprint: 256-LBGA (17×17) surface-mount package helps minimize PCB area while maintaining connectivity.
- Commercial-grade suitability: Rated for 0 °C to 70 °C operation and RoHS compliance for mainstream electronic products.
Why Choose APA600-FGG256?
The APA600-FGG256 delivers a balanced mix of logic resources, embedded memory, and I/O in a compact 256-LBGA package from Microchip Technology. Its 21,504 logic elements and 600,000 gates make it suitable for commercial designs that require medium-complexity FPGA integration without external logic proliferation.
This device is well suited to designers seeking a low-voltage, surface-mount FPGA option with substantial I/O and on-chip memory in a commercial temperature range. Its combination of features supports consolidation of digital functions to simplify BOM and board-level integration.
Request a quote or submit a purchasing inquiry to obtain pricing, availability, and lead-time information for the APA600-FGG256. Our team can provide a formal quote tailored to your volume and delivery requirements.

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