APA600-FG676I

The APA600-FG676I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology. It provides a programmable logic fabric with high I/O count and on-chip memory in a compact 676-FBGA (27×27) surface-mount package.

Designed for industrial deployments, this device delivers a balance of logic capacity, embedded RAM, and robust I/O for applications that require configurable logic, dense interfacing and reliable operation across a wide temperature range.

Key Features

• Logic Capacity 21,504 logic elements (LEs) enabling implementation of complex glue logic, state machines and custom datapaths.
• Embedded Memory Approximately 0.12 Mbits (129,024 bits) of on-chip RAM for FIFOs, small buffers and local storage.
• Gate Count 600,000 gates providing a measure of the device's overall silicon complexity.
• I/O Density 454 user I/O pins to support high-density interfaces and multiple peripheral connections.
• Power Supply Operates from a 2.3 V to 2.7 V supply window for core and I/O planning.
• Package and Mounting 676-FBGA (27×27) package case in a surface-mount form factor for compact PCB layouts.
• Industrial Temperature Range Rated for operation from –40°C to 85°C to meet industrial environmental needs.
• Regulatory RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement control logic, motor drivers interface and real-time sequencing in automation equipment using the device's logic and I/O resources.
• Embedded Systems — Provide custom glue logic, protocol bridging and peripheral aggregation in embedded products where compact packaging and moderate on-chip RAM are required.
• Instrumentation and Test Equipment — Use the FPGA's configurable logic and abundant I/O for signal routing, timing control and custom measurement preprocessing.

Unique Advantages

• High logic density: 21,504 logic elements enable integration of sizable custom logic without external ASICs.
• Significant I/O capability: 454 I/O pins support multiple external interfaces and parallel buses for flexible system integration.
• On-chip RAM: Approximately 0.12 Mbits of embedded memory for local buffering and small data structures, reducing external memory needs.
• Industrial reliability: Operation from –40°C to 85°C and RoHS compliance make the device suitable for industrial-class product designs.
• Compact FBGA package: 676-FBGA (27×27) surface-mount package allows dense board layouts while providing substantial I/O and logic resources.

Why Choose APA600-FG676I?

The APA600-FG676I combines a substantial logic element count, ample I/O and embedded memory in a compact 676-FBGA surface-mount package, targeted at industrial applications that require configurable logic and high interfacing density. With operation across an industrial temperature range and RoHS compliance, it supports robust designs that demand reliability and manufacturability.

This device is well suited to engineers building mid-range FPGA-based solutions where integration, I/O capacity and predictable environmental performance matter. Its specifications make it a practical choice for designs that need scalable programmable logic without moving to larger form-factor devices.

Request a quote or submit an inquiry to receive pricing and availability information for the APA600-FG676I and discuss how it fits your next design.