APA600-FG484I

The APA600-FG484I is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, engineered for industrial applications requiring reconfigurable digital logic. It delivers a combination of high logic density, on-chip memory, and a large I/O count in a compact ball grid array package.

With 21,504 logic elements, approximately 0.129 Mbits of embedded memory, and 370 I/O, this device is suited to designs that need significant programmable logic capacity, abundant connectivity, and low-voltage operation in industrial temperature environments.

Key Features

• Core and Logic  21,504 logic elements providing a total of 600,000 gates for implementing complex digital logic and control functions.
• Embedded Memory  Total on-chip RAM of 129,024 bits (approximately 0.129 Mbits) to support data buffering, state machines, and local storage.
• I/O Capacity  370 I/O pins to accommodate extensive interfacing needs and multiple peripheral connections.
• Power  Operates from a 2.3 V to 2.7 V supply range to support low-voltage system designs.
• Package and Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface mount format for high-density PCB assembly.
• Temperature and Grade  Industrial-grade device rated for operation from -40°C to 85°C for reliable performance in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: The 21,504 logic elements and 600,000 gates enable complex digital implementations without external ASICs or discrete logic.
• On-chip RAM for local storage: 129,024 bits of embedded memory reduce or eliminate the need for external SRAM in many designs, simplifying board-level BOM.
• Extensive I/O count: 370 I/O pins provide flexibility for interfacing with sensors, controllers, and peripheral devices.
• Low-voltage operation: 2.3 V to 2.7 V supply range supports integration into modern low-voltage systems and helps manage system power budgets.
• Industrial temperature rating: -40°C to 85°C operation supports use in varied environmental conditions common in industrial deployments.
• Compact BGA package: 484-BGA (484-FPBGA, 23×23) surface-mount package enables high-density PCB designs while maintaining robust electrical performance.

Why Choose APA600-FG484I?

The APA600-FG484I positions itself as a capable, industrial-grade FPGA option for designs that demand substantial programmable logic, embedded memory, and wide I/O capacity in a compact BGA package. Its combination of 21,504 logic elements, approximately 0.129 Mbits of on-chip RAM, and 370 I/O makes it appropriate for applications where integration, deterministic hardware behavior, and temperature resilience are important.

For engineering teams and procurement, this device offers a balanced set of capabilities—logic density, connectivity, low-voltage operation, and RoHS compliance—that support medium- to high-complexity designs in industrial environments while simplifying board-level integration.

Request a quote or submit an inquiry to start the procurement process for APA600-FG484I and evaluate its fit for your next industrial FPGA design.