APA600-FG256M
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA |
|---|---|
| Quantity | 1,986 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21504 | Number of Logic Elements/Cells | 21504 | ||
| Number of Gates | 600000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 129024 |
Overview of APA600-FG256M – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA
The APA600-FG256M is a ProASICPLUS field programmable gate array offering 600,000 gates, 21,504 logic elements, and approximately 0.13 Mbits of embedded memory (129,024 bits). It provides 186 user I/O pins in a compact 256-LBGA package (supplier device package: 256-FPBGA, 17×17) and is supplied as a surface-mount device.
Designed and qualified for military use, this device is MIL-STD-883 qualified and rated for operation from -55°C to 125°C. The APA600-FG256M operates from a 2.3 V to 2.7 V supply, making it suitable for systems requiring a qualified, low-voltage FPGA solution.
Key Features
- Core / Logic Provides 600,000 gates and 21,504 logic elements for implementing medium-to-complex digital functions.
- Embedded Memory Approximately 0.13 Mbits of on-chip RAM (129,024 bits) to support local data buffering and state storage.
- I/O Count 186 available I/O pins to accommodate multiple peripheral interfaces and system connections.
- Voltage Supply Operates from 2.3 V to 2.7 V to match low-voltage system domains.
- Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for dense PCB integration.
- Temperature & Qualification Military-grade qualification (MIL-STD-883) and an operating temperature range of -55°C to 125°C for harsh-environment deployment.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Militarily qualified platform: MIL-STD-883 qualification provides a verified baseline for designs requiring formal military-level qualification.
- Wide operating temperature: Rated from -55°C to 125°C to support deployment in extreme temperature environments.
- High logic capacity: 600,000 gates and 21,504 logic elements enable implementation of substantial digital logic within a single device.
- Ample I/O resources: 186 I/Os help consolidate multiple interfaces and reduce the need for external multiplexing or glue logic.
- Compact BGA package: 256-LBGA (17×17) delivers a high-pin-count solution in a compact footprint for space-constrained PCBs.
- Low-voltage operation: 2.3 V to 2.7 V supply range supports integration with lower-voltage system power rails.
Why Choose APA600-FG256M?
The APA600-FG256M positions itself as a robust, qualified FPGA option for designs that require significant logic resources, a sizable number of I/Os, and embedded RAM, all within a military-grade, wide-temperature package. Its combination of 600,000 gates, 21,504 logic elements, 186 I/Os, and MIL-STD-883 qualification makes it appropriate for applications where qualification and environmental resilience are essential.
Engineers and procurement teams looking for a surface-mount, low-voltage FPGA with a compact BGA footprint and explicit military qualification can rely on the APA600-FG256M to meet stringent temperature and qualification requirements while consolidating system logic and interfaces.
Request a quote or submit an inquiry for pricing and availability of the APA600-FG256M to receive detailed ordering and lead-time information.

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