APA600-FG256M

IC FPGA 186 I/O 256FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA

Quantity 1,986 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case256-LBGANumber of I/O186Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21504Number of Logic Elements/Cells21504
Number of Gates600000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits129024

Overview of APA600-FG256M – ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 129024 256-LBGA

The APA600-FG256M is a ProASICPLUS field programmable gate array offering 600,000 gates, 21,504 logic elements, and approximately 0.13 Mbits of embedded memory (129,024 bits). It provides 186 user I/O pins in a compact 256-LBGA package (supplier device package: 256-FPBGA, 17×17) and is supplied as a surface-mount device.

Designed and qualified for military use, this device is MIL-STD-883 qualified and rated for operation from -55°C to 125°C. The APA600-FG256M operates from a 2.3 V to 2.7 V supply, making it suitable for systems requiring a qualified, low-voltage FPGA solution.

Key Features

  • Core / Logic  Provides 600,000 gates and 21,504 logic elements for implementing medium-to-complex digital functions.
  • Embedded Memory  Approximately 0.13 Mbits of on-chip RAM (129,024 bits) to support local data buffering and state storage.
  • I/O Count  186 available I/O pins to accommodate multiple peripheral interfaces and system connections.
  • Voltage Supply  Operates from 2.3 V to 2.7 V to match low-voltage system domains.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for dense PCB integration.
  • Temperature & Qualification  Military-grade qualification (MIL-STD-883) and an operating temperature range of -55°C to 125°C for harsh-environment deployment.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Militarily qualified platform: MIL-STD-883 qualification provides a verified baseline for designs requiring formal military-level qualification.
  • Wide operating temperature: Rated from -55°C to 125°C to support deployment in extreme temperature environments.
  • High logic capacity: 600,000 gates and 21,504 logic elements enable implementation of substantial digital logic within a single device.
  • Ample I/O resources: 186 I/Os help consolidate multiple interfaces and reduce the need for external multiplexing or glue logic.
  • Compact BGA package: 256-LBGA (17×17) delivers a high-pin-count solution in a compact footprint for space-constrained PCBs.
  • Low-voltage operation: 2.3 V to 2.7 V supply range supports integration with lower-voltage system power rails.

Why Choose APA600-FG256M?

The APA600-FG256M positions itself as a robust, qualified FPGA option for designs that require significant logic resources, a sizable number of I/Os, and embedded RAM, all within a military-grade, wide-temperature package. Its combination of 600,000 gates, 21,504 logic elements, 186 I/Os, and MIL-STD-883 qualification makes it appropriate for applications where qualification and environmental resilience are essential.

Engineers and procurement teams looking for a surface-mount, low-voltage FPGA with a compact BGA footprint and explicit military qualification can rely on the APA600-FG256M to meet stringent temperature and qualification requirements while consolidating system logic and interfaces.

Request a quote or submit an inquiry for pricing and availability of the APA600-FG256M to receive detailed ordering and lead-time information.

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